JP2000292440A - Measuring apparatus for electronic component - Google Patents
Measuring apparatus for electronic componentInfo
- Publication number
- JP2000292440A JP2000292440A JP2000025039A JP2000025039A JP2000292440A JP 2000292440 A JP2000292440 A JP 2000292440A JP 2000025039 A JP2000025039 A JP 2000025039A JP 2000025039 A JP2000025039 A JP 2000025039A JP 2000292440 A JP2000292440 A JP 2000292440A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- terminal
- electronic component
- support
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は抵抗やＩＣ等の電子
部品の測定装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring electronic components such as resistors and ICs.
【０００２】[0002]
【従来の技術】従来のこの種電子部品の測定装置は図３
に示すような構造になっていた。すなわち基板１の裏面
側に導電パターン２を形成し、この基板１の貫通孔３に
はスプリングプローブ４を貫通させ、基板１の裏面側に
おいてスプリングプローブ４と導電パターン２をはんだ
５により接続していた。この構成において図３に示すご
とくスプリングプローブ４の先端６に電子部品７の裏面
側の端子８を当接させることによってこの電子部品７の
測定を行なっていた。2. Description of the Related Art FIG.
It had a structure as shown in FIG. That is, a conductive pattern 2 is formed on the back surface of the substrate 1, a spring probe 4 is passed through the through hole 3 of the substrate 1, and the spring probe 4 and the conductive pattern 2 are connected by solder 5 on the back surface of the substrate 1. Was. In this configuration, as shown in FIG. 3, the electronic component 7 is measured by bringing the terminal 8 on the back surface side of the electronic component 7 into contact with the tip 6 of the spring probe 4.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の構成におい
てはスプリングプローブ４を用いて電子部品７の特性を
測定していたので、この測定に誤差が生じ易いという問
題があった。すなわち電子部品７の高周波特性を測定し
ようとした場合においても、スプリングプローブ４を用
いているわけではあるが、実際の基板１上においてはこ
のスプリングプローブ４が実装されることはなく、実際
の回路で用いられないスプリングプローブ４を用いれば
その部分において高周波特性が変動し、この結果として
電子部品７の正しい高周波特性が測定し難くなるという
問題があった。そこで本発明はこの特性を正しく測定す
ることを目的とするものである。In the above-described conventional configuration, since the characteristics of the electronic component 7 are measured using the spring probe 4, there is a problem that an error is easily generated in this measurement. That is, even when the high frequency characteristics of the electronic component 7 are to be measured, the spring probe 4 is used. However, the spring probe 4 is not mounted on the actual substrate 1 and the actual circuit is not mounted. If the spring probe 4 not used in the above is used, the high-frequency characteristics fluctuate in that portion, and as a result, it is difficult to measure the correct high-frequency characteristics of the electronic component 7. Therefore, an object of the present invention is to correctly measure this characteristic.
【０００４】[0004]
【課題を解決するための手段】この目的を達成するため
に本発明は貫通孔を有する基板と、この基板の裏面側に
設けた導電パターンと、この導電パターンにその一端側
が接続されるとともにその他端側が前記貫通孔を貫通し
て基板の表面側に突出された端子とを備えた構成とした
ものである。すなわちこのようにした場合には電子部品
に当接するのは端子の他端側であって、この端子は従来
のようなスプリングプローブを用いなくても基板の裏面
側においてその一端を固定し他端側は貫通孔をフリーの
状態としたことによって適度な弾性を得ることができ、
より実際の実装状態と同じ様な状態に近付けることが出
来るので高周波特性が安定するようになる。In order to achieve the above object, the present invention provides a substrate having a through hole, a conductive pattern provided on the back side of the substrate, and one end connected to the conductive pattern. And a terminal protruding from the through-hole to the front surface side of the substrate. That is, in this case, the other end of the terminal comes into contact with the electronic component, and this terminal is fixed at one end on the back side of the substrate without using a conventional spring probe. The side can obtain moderate elasticity by making the through hole free.
Since the same state as the actual mounting state can be approached, the high frequency characteristics are stabilized.
【０００５】[0005]
【発明の実施の形態】本発明の請求項１に記載の発明
は、貫通孔を有する基板と、この基板の裏面側に設けた
導電パターンと、この導電パターンにその一端側が接続
されるとともにその他端側が前記貫通孔を貫通して基板
の表面側に突出された端子とを備えた電子部品の測定装
置であって、上記課題を解決するための手段で説明した
ように高周波特性が安定するものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a substrate having a through hole, a conductive pattern provided on the back side of the substrate, and one end connected to the conductive pattern. A measuring device for an electronic component having a terminal whose end side penetrates through the through-hole and protrudes to the front surface side of the substrate, wherein the high-frequency characteristics are stable as described in the means for solving the above problems. It is.
【０００６】本発明の請求項２に記載の発明は、基板の
裏面側において導電パターンと端子の一端との接続部を
第一の支持体で支持し、この基板の裏面側であって、こ
の端子の一端側の接続部よりも他端側を第二の支持体で
支持し、第二の支持体を第一の支持体よりも硬度を低く
した請求項１に記載の電子部品の測定装置としたもので
あって、端子の他端側に電子部品の電極を押付けること
により、この端子の一端側に導電パターンから剥離する
方向の力が働いたとしてもこの部分を第一の支持体で支
持しているので、前記端子の剥離が生ずるのを防止する
ことができる。According to a second aspect of the present invention, a connecting portion between a conductive pattern and one end of a terminal is supported on a back side of a substrate by a first support. The electronic component measuring device according to claim 1, wherein the other end of the terminal is supported by a second support at the other end than the connection portion at one end, and the second support has a lower hardness than the first support. By pressing an electrode of an electronic component on the other end of the terminal, even if a force in the direction of peeling off from the conductive pattern acts on one end of the terminal, this portion is used as a first support. The terminal can be prevented from peeling off.
【０００７】また第一の支持体よりもやわらかい第二の
支持体で、前記基板の裏面側において端子の一端の固定
部よりも他端側を支持しているので、基板の表面側にお
いてこの端子の他端側に電子部品の電極を押付けた時に
は端子はそれを基板裏面側の第二の支持体で十分な弾力
を有した状態で支持された状態で下方に沈むこととな
り、このことから電子部品の電極に端子との衝突による
大きな衝撃力を与えることがないものとなる。The second support, which is softer than the first support, supports the other end of the terminal on the back side of the substrate rather than the fixed portion at one end of the terminal. When the electrode of the electronic component is pressed against the other end of the substrate, the terminal sinks downward while being supported by the second support on the back surface of the substrate with sufficient elasticity. A large impact force due to collision with the terminal is not applied to the electrode of the component.
【０００８】本発明の請求項３に記載の発明は、基板の
裏面側において、導電パターンと端子の一端との接続部
をバネ性の支持体の固定部側で支持し、この支持体の遊
端側で前記基板の裏面側において端子の一端の接続部よ
りも他端側を支持した請求項１に記載の電子部品の測定
装置であって、端子の他端側に電子部品の電極を押付け
ることにより、この端子の一端側に導電パターンから剥
離する方向の力が働いたとしてもこの部分をバネ性支持
体の固定部で支持しているので、前記端子の剥離が生ず
るのを防止することができる。According to a third aspect of the present invention, a connecting portion between the conductive pattern and one end of the terminal is supported on a fixed portion of a spring-like support on the back side of the substrate, and the play of the support is adjusted. 2. The measuring device for an electronic component according to claim 1, wherein the other end of the terminal is supported on the rear surface side of the substrate on the rear surface side of the substrate with respect to one end of the terminal. By attaching, even if a force in the direction of peeling from the conductive pattern acts on one end side of the terminal, since this portion is supported by the fixing portion of the spring support, peeling of the terminal is prevented. be able to.
【０００９】またバネ性の支持体の遊端側で、前記基板
の裏面側において端子の一端の固定部よりも他端側を支
持しているので、基板の表面側においてこの端子の他端
側に電子部品の電極を押付けた時には端子はそれを基板
裏面側の支持体で十分な弾力を有した状態で支持された
状態で下方に沈むこととなり、このことから電子部品の
電極に端子との衝突による大きな衝撃力を与えることが
ないものとなる。Also, since the free end of the spring support supports the other end of the terminal on the back side of the substrate rather than the fixed portion of one end of the terminal, the other end of the terminal is located on the front side of the substrate. When the electrode of the electronic component is pressed against the terminal, the terminal sinks downward while being supported by the support on the back side of the substrate with sufficient elasticity. A large impact force due to a collision is not given.
【００１０】次に本発明の請求項４に記載の発明は、基
板の裏面側において、導電パターンにプラグを固定し、
このプラグに端子の一端を着脱自在に接続した請求項１
〜３のいずれか一つに記載の電子部品の測定装置であっ
て、端子の劣化時には容易に交換が行えるものとなる。Next, according to a fourth aspect of the present invention, a plug is fixed to a conductive pattern on the back side of a substrate.
2. An end of a terminal is detachably connected to the plug.
The electronic component measuring device according to any one of the above-described items, wherein the terminal can be easily replaced when the terminal is deteriorated.
【００１１】次に本発明の請求項５に記載の発明は、基
板の表面側において対向する端子他端の対向面側に外方
に広がる傾斜を設けた請求項１に記載の電子部品の測定
装置であって、対向する端子の他端間に、その傾斜を利
用して電子部品の両端の電極を挟みつけることができる
様になる。According to a fifth aspect of the present invention, there is provided an electronic component measuring apparatus as set forth in the first aspect, wherein an inclined surface extending outward is provided on the surface opposite to the other end of the terminal on the surface side of the substrate. In the device, electrodes at both ends of the electronic component can be sandwiched between the other ends of the opposing terminals by using the inclination.
【００１２】以下本発明の一実施形態を図１を用いて説
明する。An embodiment of the present invention will be described below with reference to FIG.
【００１３】図１において９は合成樹脂製の基板で、こ
の基板９には２個の貫通孔１０が設けられている。この
基板９の裏面側には銅製の導電パターン１１が設けられ
ている。この導電パターン１１にはベリリウム銅で形成
した線状の端子１２の一端側が半田により固定されてい
る。この端子１２は図１に示すごとくＬ字状に形成され
たもので、その中程において９０度の方向に折曲げられ
他端側は図１に示すごとく貫通孔１０を貫通して表面側
に突出されている。このような状態において基板９の裏
面側において硬質ウレタン製のゴムから成る第二の支持
体１３で、この端子１２の基板９裏面の導電パターン１
１への固定部よりも内方を支持し、その外方すなわち端
子１２の一端と導電パターン１１の固定部分は合成樹脂
製の第一の支持体１４で同心円状に支持している。この
場合第二の支持体１３の方が第一の支持体１４よりも硬
度を柔らかくしている。さてこのような状態で図１に示
すごとく基板９の裏面側に電子部品の一例として用いた
ＩＣ１５を、ＩＣ１５の裏面側の方でＩＣ１５の電極１
６を端子１２の他端に当接させる。この場合押付けた際
にこの端子１２を基板の裏面側においてゴム製の第二の
支持体１３で支持しているので、押した時には緩衝作用
が働き、この結果としてＩＣ１５の電極１６を傷付ける
ことなく、また電極１６との正しい当接が行われるよう
になる。そしてこのようにしてＩＣ１５の高周波特性が
測定されるのである。In FIG. 1, reference numeral 9 denotes a substrate made of a synthetic resin, and the substrate 9 is provided with two through holes 10. A conductive pattern 11 made of copper is provided on the back side of the substrate 9. One end of a linear terminal 12 formed of beryllium copper is fixed to the conductive pattern 11 by soldering. The terminal 12 is formed in an L-shape as shown in FIG. 1, and is bent in the direction of 90 degrees in the middle thereof, and the other end penetrates the through hole 10 as shown in FIG. It is protruding. In such a state, the conductive pattern 1 on the rear surface of the substrate 9 of the terminal 12 is formed by the second support 13 made of hard urethane rubber on the rear surface side of the substrate 9.
The first support 14 made of synthetic resin supports concentrically on the inner side than the fixing portion to the first portion 1, and on the outer side, that is, at the one end of the terminal 12 and the fixed portion of the conductive pattern 11. In this case, the hardness of the second support 13 is softer than that of the first support 14. In this state, as shown in FIG. 1, the IC 15 used as an example of the electronic component is placed on the back side of the substrate 9 and the electrode 1 of the IC 15 is placed on the back side of the IC 15.
6 is brought into contact with the other end of the terminal 12. In this case, when the terminal 12 is pressed, the terminal 12 is supported by the second support 13 made of rubber on the back surface side of the substrate. Therefore, when the terminal 12 is pressed, a buffering action is performed. In addition, correct contact with the electrode 16 is performed. Then, the high frequency characteristics of the IC 15 are measured in this manner.
【００１４】なお端子１２の一端側と導電パターン１１
との固定部は基板９と硬い第一の支持体１４で挟持して
いるので、端子１２の中部が第二の支持体１３側に撓ん
だとしても前記固定部にはその力が及ばず、この結果と
して前記固定部の損傷も生じない。Note that one end of the terminal 12 and the conductive pattern 11
Is fixed between the substrate 9 and the hard first support 14, so that even if the center of the terminal 12 bends toward the second support 13, the force does not reach the fixed portion. As a result, the fixing portion is not damaged.
【００１５】図２は本発明の他の実施形態を示し、基板
９の表面側において対向する端子１２Ａ他端の対向面側
に外方に広がる傾斜１２Ｂを設けたものであって、対向
する端子１２Ａの他端間に、その傾斜１２Ｂを利用して
電子部品１５Ａの両端のＬ字状電極１５Ｂのコーナ部を
挟みつけることができる様になる。FIG. 2 shows another embodiment of the present invention, in which an inclined surface 12B extending outward is provided on the opposing surface side of the other end of the opposing terminal 12A on the front surface side of the substrate 9, and The corners of the L-shaped electrodes 15B at both ends of the electronic component 15A can be sandwiched between the other ends of 12A by using the inclination 12B.
【００１６】[0016]
【発明の効果】以上のように本発明は、貫通孔を有する
基板と、この基板の裏面側に設けた導電パターンと、こ
の導電パターンにその一端側が接続されるとともにその
他端側が前記貫通孔を貫通して基板の表面側に突出され
た端子とを備えた電子部品の測定装置であって、部品の
実装状態に近い状態で測定が行えるので、高周波特性が
安定するものとなる。As described above, the present invention provides a substrate having a through-hole, a conductive pattern provided on the back surface of the substrate, and one end connected to the conductive pattern and the other end connected to the through-hole. This is a measuring device for an electronic component including a terminal that penetrates and protrudes to the surface side of the substrate, and can perform measurement in a state close to a mounted state of the component, so that high-frequency characteristics are stabilized.
【図１】本発明の一実施形態の断面図FIG. 1 is a cross-sectional view of one embodiment of the present invention.
【図２】本発明の他の実施形態の斜視図FIG. 2 is a perspective view of another embodiment of the present invention.
【図３】従来例の断面図FIG. 3 is a sectional view of a conventional example.
９ 基板 １０ 貫通孔 １１ 導電パターン １２ 端子 １３ 第二の支持体 １４ 第一の支持体 １５ ＩＣ １６ 電極 9 Substrate 10 Through-hole 11 Conductive pattern 12 Terminal 13 Second support 14 First support 15 IC 16 Electrode
Claims (5)
側に設けた導電パターンと、この導電パターンにその一
端側が接続されるとともにその他端側が前記貫通孔を貫
通して基板の表面側に突出された端子とを備えた電子部
品の測定装置。1. A substrate having a through hole, a conductive pattern provided on the back side of the substrate, and one end connected to the conductive pattern and the other end passing through the through hole and facing the front surface of the substrate. An electronic component measuring device having a protruding terminal.
子の一端との接続部を第一の支持体で支持し、この基板
の裏面側であってこの端子の一端側の接続部よりも他端
側を第二の支持体で支持し、第二の支持体を第一の支持
体よりも硬度を低くした請求項１に記載の電子部品の測
定装置。2. A connection portion between the conductive pattern and one end of the terminal is supported on a back surface of the substrate by a first support, and the other end of the connection portion on the back surface of the substrate and one end of the terminal. The electronic component measuring device according to claim 1, wherein the side is supported by a second support, and the second support has a lower hardness than the first support.
端子の一端との接続部をバネ性の支持体の固定部側で支
持し、この支持体の遊端側で前記基板の裏面側において
端子の一端の接続部よりも他端側を支持した請求項１に
記載の電子部品の測定装置。3. A connection portion between the conductive pattern and one end of the terminal is supported on a fixed portion of a spring-like support on the back surface of the substrate, and a terminal is provided on a back end of the substrate at a free end of the support. The electronic component measuring device according to claim 1, wherein the other end side of the one end is supported with respect to the other end side.
プラグを固定し、このプラグに端子の一端を着脱自在に
接続した請求項１〜３のいずれか一つに記載の電子部品
の測定装置。4. The electronic component measuring device according to claim 1, wherein a plug is fixed to the conductive pattern on the back side of the substrate, and one end of the terminal is detachably connected to the plug.
の対向面側に外方に広がる傾斜を設けた請求項１に記載
の電子部品の測定装置。5. The electronic component measuring apparatus according to claim 1, wherein an inclined surface extending outward is provided on the opposite surface side of the other end of the terminal facing the front surface side of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000025039A JP3815165B2 (en) | 1999-02-02 | 2000-02-02 | Electronic component measuring device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2459499 | 1999-02-02 | ||
| JP11-24594 | 1999-02-02 | ||
| JP2000025039A JP3815165B2 (en) | 1999-02-02 | 2000-02-02 | Electronic component measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000292440A true JP2000292440A (en) | 2000-10-20 |
| JP3815165B2 JP3815165B2 (en) | 2006-08-30 |
Family
ID=26362143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000025039A Expired - Fee Related JP3815165B2 (en) | 1999-02-02 | 2000-02-02 | Electronic component measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3815165B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002286750A (en) * | 2001-03-28 | 2002-10-03 | Hioki Ee Corp | Contact probe device |
| JP2012222259A (en) * | 2011-04-13 | 2012-11-12 | Koyo Thermo System Kk | Wafer with thermocouple, wafer support pin, and wafer support structure |
-
2000
- 2000-02-02 JP JP2000025039A patent/JP3815165B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002286750A (en) * | 2001-03-28 | 2002-10-03 | Hioki Ee Corp | Contact probe device |
| JP2012222259A (en) * | 2011-04-13 | 2012-11-12 | Koyo Thermo System Kk | Wafer with thermocouple, wafer support pin, and wafer support structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3815165B2 (en) | 2006-08-30 |
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