JPH04199535A - Evaluation jig for characteristic of ic package - Google Patents

Abstract

PURPOSE:To prevent a short circuit with a package surface or the connector-side conductor boards of a jig. when a bias is applied with probe needles, by providing a board having a high-frequency transmission line, a plurality of bias transmission lines, and through holes for applying spring force to spring type leads. CONSTITUTION:A board 1 having a high-frequency transmission line 4, a plurality of bias transmission lines 5, and through holes 2 for applying spring force to spring type leads 3, a pedestal 22, conductor boards 24, and connectors 26 are provided. Then, an IC package 11 is fixed to the fixed part of a jig 21 with their terminals 13, 14 on the side of the underside, and the terminals 13, 14 are connected to input/output terminals for high-frequency signals and bias applying terminals respectively provided at both ends of the fixed part on the board 1. Namely, the input/output terminals 13 of the IC package 11 for high-frequency signals 13 are connected with the microstrip line 4 of the board 1 of the jig 21, and the biasing terminals 14 touch the spring type leads 3. Accordingly, it becomes possible to prevent a short circuit caused by the miscontact of probe needles and to simplify the measurement.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention mainly relates to an IC package characteristic evaluation jig used for measuring the electrical characteristics of a high frequency IC package.

[Prior Art 1] As an IC package for high frequency, there is one shown in a top view and a side view in FIGS. 5 and 6. In these figures, in the IC package 11, high-frequency signal input/output and bias terminals 13 and 14 made of microstrip lines are exposed on the upper surfaces of shoulders 12a, 12a at both ends of the package body 12. In addition, 15 is a notch for attachment, and 16 is a package cap.

Conventionally, when measuring the electrical characteristics of the IC package 11 as described above, a jig 21 as shown in front and side views in FIGS. 7 and 8 is used. This jig 21 is
A pedestal 22 that fixes the IC package 11, and this pedestal 2
2, and connectors 26.26 attached to the conductor plates 24.24 for transmitting and receiving high frequency signals to and from the IC package 11. The measurement of the electrical characteristics of the IC package 11 using this jig 21 is performed as follows.

First, the IC package 11 is fixed to the pedestal 22 with the mounting screws 23 with each of its terminals 13 and 14 facing up. Then, the connector 26 is attached to the conductor plate 24 with attachment screws 27, and the conductor plate 24 is fixed to both sides of the base 22 with attachment screws 25. At this time, connector 2
6.26 center conductors 26a, 26a are conductor plates 24.24
It is connected to the high frequency signal input/output terminals 13 and 13 of the IC package 11 through the .

Then, I attached to the jig 21 as described above.
A high frequency signal is input and output to and from the C package 11 via the connector 26, and a bias voltage is applied by contacting the bias application probe needle 28 to the surface of the bias terminal 14. The IC package 11 to which a high frequency signal and bias voltage are applied performs a predetermined operation, and its electrical characteristics are measured by a measuring device (not shown).

[Problems to be Solved by the Invention] However, in the jig 21 as described above, the probe needle 28 is connected to the bias terminal 14 of the IC package 11.
Since the space for inserting the probe needle 2B is narrow, the probe needle 28 may come into contact with the conductor plate 24 or other microstrip lines, causing a short circuit and damaging the IC chip inside the IC package 11. There was a problem with this.

In addition, in order to bring the IC package 11 into contact with the jig 21, in addition to attaching the IC package 11 to the jig 21, the conductor plate 24 to which the connector 26 is attached is attached to the jig 21, and the center conductor 26a of the connector 26 is attached to the jig 21. There was a problem in that it required work to connect the IC package 11 to the IC package 11, and the measurement work was time-consuming.

This invention was made to solve the above problems, and aims to provide an IC package characteristic evaluation jig that can prevent short circuits due to erroneous contact of the probe needle and simplify measurement. do.

[Means for Solving the Problems] An IC package characteristic evaluation jig according to the present invention includes a high-frequency transmission line for transmitting input/output signals, and a plurality of bias transmission lines each having a spring-type lead wire at the tip for transmitting bias signals. A line, a substrate in which a through hole is formed for applying a spring force to the spring type lead wire, and a microstrip line formed on an IC package, which has this substrate on both sides, and is connected to a high frequency transmission line on the substrate. A pedestal on which the IC package is mounted together with the substrate, with high frequency signal input/output terminals in contact with each other, and bias terminals of the IC package in contact with each of the bias transmission lines, and both sides of the substrate are sandwiched. It consists of a conductor plate fixed to the pedestal, and a connector that is attached to the conductor plate and includes a center conductor that passes through the conductor plates on both sides and comes into contact with the high frequency transmission line.

[Effect]

In this invention, when the IC package is fixed to the fixed part of the jig with its terminals facing down, each terminal is connected to the high frequency signal input/output terminal and the bias application terminal provided at both ends of the fixed part on the board. It will be connected. Thereby, the high frequency signal input/output terminal of the IC package is connected to the microstrip line on the substrate of the jig, and it becomes possible to measure the characteristics of the IC package without impairing the high frequency characteristics. In addition, since the spring-type lead wire contacts the bias terminal, there is no need to make adjustments due to misalignment of the IC package body, leading to a reduction in evaluation time.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 1 is a plan view showing a substrate of a jig according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a side view of a jig using this invention. 4 shows a top view of FIG. 3.

In the second embodiment, as shown in FIG. 1, a through hole 2 is provided in a portion of the substrate 1 corresponding to the bias terminal of the package 11. A spring type lead wire 3 protruding from the surface of the substrate 1 is connected to the center of the through hole 2 from the bias transmission line 5 in contact with the through hole 2 . From FIG. 2, the positions of the through hole 2 and the spring type lead wire 3 are
When the second package cap 16 is placed facing downward, the bias terminal 14 is formed so as to come into contact with the spring type lead wire 3. This spring type lead wire 3 is pushed down into the through hole 2 by fixing the package, but since the spring type lead wire 3 also tries to restore its shape, the bias terminal 1
Contact with 4 is ensured.

Next, the contact between the high frequency transmission lines 4, 4 of this board 1 and the high frequency signal input/output terminals 13, 13 of the package body 12 is determined by the structure of the high frequency transmission line 4.
The effect on the slope of is reduced and becomes stable.

FIGS. 3 and 4 are side views showing one embodiment of the jig according to the present invention. With the package body 12 facing down on the package cap 16 side, the notch 15 is fixed to the pedestal 22 with the mounting screw 23, and the bias transmission line 5 is connected to the spring type lead wire 3 provided on the substrate 1 of the jig 21 and the high frequency transmission line. 4,
4 are connected to each terminal of the package body 12. There is no contact with a probe needle, and a bias is applied to the bias transmission line 5 by connecting it with a clip or the like from a power source (not shown) through a lead wire.

[Effects of the Invention] As explained above, the present invention provides a high-frequency transmission line for transmitting input/output signals, a plurality of bias transmission lines each having a spring-type lead wire at the tip for transmitting bias signals, and the spring-type lead wires. A high frequency signal input/output device comprising a substrate having a through hole formed therein for applying a spring force to the substrate, and a microstrip line formed in an IC package on the high frequency transmission line on the substrate, and having this substrate on both sides. terminals are in contact with each other, and each of the bias transmission lines is connected to the IC.
a pedestal on which the IC package is attached together with the substrate with the bias terminals of the package in contact; a conductive plate fixed to the pedestal across both sides of the substrate; The connector has a center conductor that contacts the high-frequency transmission line and is attached to the conductor plate, and the connector side conductor plate on the package surface or jig when bias is applied with a probe needle, which has been a problem in the past. Short circuits can be prevented, high frequency signals and bias can be easily applied to the package, and working time can be reduced.

[Brief explanation of the drawing]

1 and 2 are a perspective view of a substrate of a characteristic evaluation jig according to an embodiment of the present invention, and a sectional view taken along line A-A in FIG. 1, and FIG. FIG. 4 is a plan view of FIG. 3, FIGS. 5 and 6 are top and side views of a high-frequency IC package, and FIG.
The figure is a top view of a conventional IC package characteristic evaluation jig, and FIG. 8 is a side view of FIG. 7. In the figure, 1 is a substrate, 2 is a through hole, 3 is a spring type lead wire, 4 is a high frequency transmission line, 5 is a bias transmission line, 11
is an IC package, 12 is a package body, 13 is a high frequency signal input/output terminal, 14 is a bias terminal, 15 is a mounting notch, 16 is a package cap, 21 is a jig,
22 is a pedestal, 24 is a conductor plate, 26 is a connector, and 26a is a center conductor. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 2 Figure 3 Revised Figure 4 Figure 5 Figure 7 Figure 8 C

Claims (1)

[Claims] A high-frequency transmission line for transmitting input/output signals, a plurality of bias transmission lines each having a spring-type lead wire at the tip for transmitting bias signals, and a substrate formed with a through-hole for applying a spring force to the spring-type lead wires. The IC has this substrate on both sides, high frequency signal input/output terminals made of microstrip lines formed on the IC package are in contact with the high frequency transmission line on the substrate, and the IC is connected to each of the bias transmission lines. a pedestal on which the IC package is attached together with the substrate with the bias terminals of the package in contact; a conductive plate fixed to the pedestal across both sides of the substrate; 1. A jig for evaluating characteristics of an IC package, comprising: a connector that includes a center conductor that contacts a high frequency transmission line and is attached to the conductor plate.