JP3815165B2 - Electronic component measuring device - Google Patents

Electronic component measuring device Download PDF

Info

Publication number
JP3815165B2
JP3815165B2 JP2000025039A JP2000025039A JP3815165B2 JP 3815165 B2 JP3815165 B2 JP 3815165B2 JP 2000025039 A JP2000025039 A JP 2000025039A JP 2000025039 A JP2000025039 A JP 2000025039A JP 3815165 B2 JP3815165 B2 JP 3815165B2
Authority
JP
Japan
Prior art keywords
substrate
terminal
electronic component
conductive pattern
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000025039A
Other languages
Japanese (ja)
Other versions
JP2000292440A (en
Inventor
真一 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000025039A priority Critical patent/JP3815165B2/en
Publication of JP2000292440A publication Critical patent/JP2000292440A/en
Application granted granted Critical
Publication of JP3815165B2 publication Critical patent/JP3815165B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は抵抗やＩＣ等の電子部品の測定装置に関するものである。
【０００２】
【従来の技術】
従来のこの種電子部品の測定装置は図３に示すような構造になっていた。すなわち基板１の裏面側に導電パターン２を形成し、この基板１の貫通孔３にはスプリングプローブ４を貫通させ、基板１の裏面側においてスプリングプローブ４と導電パターン２をはんだ５により接続していた。この構成において図３に示すごとくスプリングプローブ４の先端６に電子部品７の裏面側の端子８を当接させることによってこの電子部品７の測定を行なっていた。
【０００３】
【発明が解決しようとする課題】
上記従来の構成においてはスプリングプローブ４を用いて電子部品７の特性を測定していたので、この測定に誤差が生じ易いという問題があった。すなわち電子部品７の高周波特性を測定しようとした場合においても、スプリングプローブ４を用いているわけではあるが、実際の基板１上においてはこのスプリングプローブ４が実装されることはなく、実際の回路で用いられないスプリングプローブ４を用いればその部分において高周波特性が変動し、この結果として電子部品７の正しい高周波特性が測定し難くなるという問題があった。そこで本発明はこの特性を正しく測定することを目的とするものである。
【０００４】
【課題を解決するための手段】
この目的を達成するために本発明は貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部を第一の支持体で支持し、この基板の裏面側であってこの端子の一端側の接続部よりも他端側を第二の支持体で支持し、第二の支持体を第一の支持体よりも硬度を低くした構成としたものである。すなわちこのようにした場合には電子部品に当接するのは端子の他端側であって、この端子は従来のようなスプリングプローブを用いなくても基板の裏面側においてその一端を固定し他端側は貫通孔をフリーの状態としたことによって適度な弾性を得ることができ、より実際の実装状態と同じ様な状態に近付けることが出来るので高周波特性が安定するようになる。
【０００５】
【発明の実施の形態】
本発明の請求項１に記載の発明は、貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部を第一の支持体で支持し、この基板の裏面側であってこの端子の一端側の接続部よりも他端側を第二の支持体で支持し、第二の支持体を第一の支持体よりも硬度を低くした電子部品の測定装置であって、上記課題を解決するための手段で説明したように高周波特性が安定するものである。
【０００６】
また、端子の他端側に電子部品の電極を押付けることにより、この端子の一端側に導電パターンから剥離する方向の力が働いたとしてもこの部分を第一の支持体で支持しているので、前記端子の剥離が生ずるのを防止することができる。
【０００７】
また第一の支持体よりもやわらかい第二の支持体で、前記基板の裏面側において端子の一端の固定部よりも他端側を支持しているので、基板の表面側においてこの端子の他端側に電子部品の電極を押付けた時には端子はそれを基板裏面側の第二の支持体で十分な弾力を有した状態で支持された状態で下方に沈むこととなり、このことから電子部品の電極に端子との衝突による大きな衝撃力を与えることがないものとなる。
【０００８】
本発明の請求項２に記載の発明は、貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部をバネ性の支持体の固定部側で支持し、この支持体の遊端側で前記基板の裏面側において端子の一端の接続部よりも他端側を支持した電子部品の測定装置であって、端子の他端側に電子部品の電極を押付けることにより、この端子の一端側に導電パターンから剥離する方向の力が働いたとしてもこの部分をバネ性支持体の固定部で支持しているので、前記端子の剥離が生ずるのを防止することができる。
【０００９】
またバネ性の支持体の遊端側で、前記基板の裏面側において端子の一端の固定部よりも他端側を支持しているので、基板の表面側においてこの端子の他端側に電子部品の電極を押付けた時には端子はそれを基板裏面側の支持体で十分な弾力を有した状態で支持された状態で下方に沈むこととなり、このことから電子部品の電極に端子との衝突による大きな衝撃力を与えることがないものとなる。
【００１０】
次に本発明の請求項３に記載の発明は、基板の裏面側において、導電パターンにプラグを固定し、このプラグに端子の一端を着脱自在に接続した請求項１または２のいずれか一つに記載の電子部品の測定装置であって、端子の劣化時には容易に交換が行えるものとなる。
【００１１】
次に本発明の請求項４に記載の発明は、基板の表面側において対向する端子他端の対向面側に外方に広がる傾斜を設けた請求項１に記載の電子部品の測定装置であって、対向する端子の他端間に、その傾斜を利用して電子部品の両端の電極を挟みつけることができる様になる。
【００１２】
以下本発明の一実施形態を図１を用いて説明する。
【００１３】
図１において９は合成樹脂製の基板で、この基板９には２個の貫通孔１０が設けられている。この基板９の裏面側には銅製の導電パターン１１が設けられている。この導電パターン１１にはベリリウム銅で形成した線状の端子１２の一端側が半田により固定されている。この端子１２は図１に示すごとくＬ字状に形成されたもので、その中程において９０度の方向に折曲げられ他端側は図１に示すごとく貫通孔１０を貫通して表面側に突出されている。このような状態において基板９の裏面側において硬質ウレタン製のゴムから成る第二の支持体１３で、この端子１２の基板９裏面の導電パターン１１への固定部よりも内方を支持し、その外方すなわち端子１２の一端と導電パターン１１の固定部分は合成樹脂製の第一の支持体１４で同心円状に支持している。この場合第二の支持体１３の方が第一の支持体１４よりも硬度を柔らかくしている。さてこのような状態で図１に示すごとく基板９の裏面側に電子部品の一例として用いたＩＣ１５を、ＩＣ１５の裏面側の方でＩＣ１５の電極１６を端子１２の他端に当接させる。この場合押付けた際にこの端子１２を基板の裏面側においてゴム製の第二の支持体１３で支持しているので、押した時には緩衝作用が働き、この結果としてＩＣ１５の電極１６を傷付けることなく、また電極１６との正しい当接が行われるようになる。そしてこのようにしてＩＣ１５の高周波特性が測定されるのである。
【００１４】
なお端子１２の一端側と導電パターン１１との固定部は基板９と硬い第一の支持体１４で挟持しているので、端子１２の中部が第二の支持体１３側に撓んだとしても前記固定部にはその力が及ばず、この結果として前記固定部の損傷も生じない。
【００１５】
図２は本発明の他の実施形態を示し、基板９の表面側において対向する端子１２Ａ他端の対向面側に外方に広がる傾斜１２Ｂを設けたものであって、対向する端子１２Ａの他端間に、その傾斜１２Ｂを利用して電子部品１５Ａの両端のＬ字状電極１５Ｂのコーナ部を挟みつけることができる様になる。
【００１６】
【発明の効果】
以上のように本発明は、貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部を第一の支持体で支持し、この基板の裏面側であってこの端子の一端側の接続部よりも他端側を第二の支持体で支持し、第二の支持体を第一の支持体よりも硬度を低くした電子部品の測定装置であって、部品の実装状態に近い状態で測定が行えるので、高周波特性が安定するものとなる。
また、端子の他端側に電子部品の電極を押付けることにより、この端子の一端側に導電パターンから剥離する方向の力が働いたとしてもこの部分を第一の支持体で支持しているので、前記端子の剥離が生ずるのを防止することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態の断面図
【図２】本発明の他の実施形態の斜視図
【図３】従来例の断面図
【符号の説明】
９ 基板
１０ 貫通孔
１１ 導電パターン
１２ 端子
１３ 第二の支持体
１４ 第一の支持体
１５ ＩＣ
１６ 電極[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a measuring device for electronic parts such as resistors and ICs.
[0002]
[Prior art]
A conventional measuring device for this kind of electronic component has a structure as shown in FIG. That is, the conductive pattern 2 is formed on the back side of the substrate 1, the spring probe 4 is passed through the through hole 3 of the substrate 1, and the spring probe 4 and the conductive pattern 2 are connected by the solder 5 on the back side of the substrate 1. It was. In this configuration, the electronic component 7 is measured by bringing the terminal 8 on the back surface side of the electronic component 7 into contact with the tip 6 of the spring probe 4 as shown in FIG.
[0003]
[Problems to be solved by the invention]
In the above conventional configuration, since the characteristics of the electronic component 7 are measured using the spring probe 4, there is a problem that an error is likely to occur in this measurement. That is, even when the high frequency characteristics of the electronic component 7 are to be measured, the spring probe 4 is used, but the spring probe 4 is not mounted on the actual substrate 1 and an actual circuit is not provided. If the spring probe 4 that is not used in the above is used, the high frequency characteristics fluctuate in that portion, and as a result, it is difficult to measure the correct high frequency characteristics of the electronic component 7. Therefore, the present invention aims to correctly measure this characteristic.
[0004]
[Means for Solving the Problems]
In order to achieve this object, the present invention provides a substrate having a through hole, a conductive pattern provided on the back side of the substrate, one end of the conductive pattern connected to the conductive pattern, and the other end penetrating the through hole. In a measuring apparatus for electronic components comprising a terminal protruding on the front surface side of a substrate, a connection portion between the conductive pattern and one end of the terminal is supported by a first support on the back surface side of the substrate, and the back surface of the substrate The other end side of the terminal at one end side of the terminal is supported by the second support body, and the second support body is configured to have a lower hardness than the first support body. . That is, in this case, it is the other end side of the terminal that contacts the electronic component, and this terminal is fixed at the other end on the back side of the substrate without using a conventional spring probe. By setting the through hole in a free state on the side, moderate elasticity can be obtained, and since it can be brought closer to a state similar to the actual mounting state, the high frequency characteristics are stabilized.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a substrate having a through hole, a conductive pattern provided on the back side of the substrate, one end of the conductive pattern is connected to the conductive pattern, and the other end passes through the through hole. Then, in the electronic component measuring apparatus including the terminal protruding to the front surface side of the substrate, the connection portion between the conductive pattern and one end of the terminal is supported by the first support on the back surface side of the substrate, and this substrate Measurement of an electronic component in which the second support is supported by the second support on the back side of the terminal and the other end side of the connection on one end of the terminal, and the hardness of the second support is lower than that of the first support As described in the means for solving the above-mentioned problems, the high-frequency characteristics are stable.
[0006]
Further, by pressing the electrode of the electronic component on the other end side of the terminal, even if a force in the direction of peeling from the conductive pattern acts on one end side of the terminal, this portion is supported by the first support. Therefore, it is possible to prevent the terminal from being peeled off.
[0007]
In addition, the second support member, which is softer than the first support member, supports the other end side of the fixing portion at one end of the terminal on the back surface side of the substrate. When the electrode of the electronic component is pressed to the side, the terminal sinks downward in a state where the terminal is supported with sufficient elasticity by the second support on the back side of the substrate. Thus, a large impact force due to the collision with the terminal is not given to the terminal.
[0008]
According to a second aspect of the present invention, there is provided a substrate having a through hole, a conductive pattern provided on the back side of the substrate, one end side of which is connected to the conductive pattern, and the other end side penetrating the through hole. Then, in the electronic component measuring apparatus including the terminal protruding to the front surface side of the substrate, the connection portion between the conductive pattern and one end of the terminal is supported on the fixed portion side of the spring-like support body on the back surface side of the substrate. An electronic component measuring device that supports the other end side of the support at the free end side of the support on the back side of the substrate from the connecting portion at one end of the terminal, and the electrode of the electronic component is provided at the other end side of the terminal. Even if a force in the direction of peeling from the conductive pattern is applied to one end of this terminal by pressing, this part is supported by the fixing part of the spring support, so that the peeling of the terminal is prevented. can do.
[0009]
Further, since the other end side of the free end side of the spring-like support body is supported on the back surface side of the substrate from the fixed portion of one end of the terminal, the electronic component is provided on the other end side of the terminal on the surface side of the substrate. When the electrode is pressed, the terminal sinks downward in a state where it is supported by a support on the back side of the substrate with sufficient elasticity, and this causes a large collision due to a collision with the terminal of the electronic component electrode. It will not give impact force.
[0010]
The invention described in claim 3 of the present invention is then one in the back surface side of the substrate, the plug is fixed to the conductive pattern, any one of claims 1 or 2 and detachably connected to one end of the terminal in the plug The electronic device measuring apparatus according to the item 1, which can be easily replaced when the terminal deteriorates.
[0011]
Next, an invention according to claim 4 of the present invention is the electronic component measuring apparatus according to claim 1, wherein an inclination that spreads outward is provided on the opposite surface side of the other end of the opposing terminal on the surface side of the substrate. Thus, the electrodes at both ends of the electronic component can be sandwiched between the other ends of the opposing terminals using the inclination.
[0012]
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
[0013]
In FIG. 1, reference numeral 9 denotes a synthetic resin substrate, and the substrate 9 is provided with two through holes 10. A copper conductive pattern 11 is provided on the back side of the substrate 9. One end side of a linear terminal 12 made of beryllium copper is fixed to the conductive pattern 11 by solder. The terminal 12 is formed in an L shape as shown in FIG. 1, and is bent in the direction of 90 degrees in the middle thereof, and the other end penetrates the through hole 10 as shown in FIG. It is protruding. In such a state, the second support 13 made of hard urethane rubber on the back surface side of the substrate 9 supports the inside of the terminal 12 from the fixing portion to the conductive pattern 11 on the back surface of the substrate 9, The outside, that is, one end of the terminal 12 and the fixed portion of the conductive pattern 11 are supported concentrically by a first support 14 made of synthetic resin. In this case, the hardness of the second support 13 is softer than that of the first support 14. In this state, as shown in FIG. 1, the IC 15 used as an example of the electronic component is brought into contact with the back side of the substrate 9, and the electrode 16 of the IC 15 is brought into contact with the other end of the terminal 12 on the back side of the IC 15. In this case, since the terminal 12 is supported by the second support 13 made of rubber on the back surface side of the substrate when pressed, a buffering action works when pressed, and as a result, the electrode 16 of the IC 15 is not damaged. In addition, correct contact with the electrode 16 is performed. In this way, the high frequency characteristics of the IC 15 are measured.
[0014]
In addition, since the fixing | fixed part of the one end side of the terminal 12 and the conductive pattern 11 is clamped by the board | substrate 9 and the hard 1st support body 14, even if the center part of the terminal 12 bends to the 2nd support body 13 side. The fixing portion is not exerted with force, and as a result, the fixing portion is not damaged.
[0015]
FIG. 2 shows another embodiment of the present invention, in which an inclined surface 12B extending outward is provided on the opposite surface side of the other end of the terminal 12A facing the surface of the substrate 9, and other than the facing terminal 12A. The corners of the L-shaped electrode 15B at both ends of the electronic component 15A can be sandwiched between the ends using the inclination 12B.
[0016]
【The invention's effect】
As described above, the present invention provides a substrate having a through hole, a conductive pattern provided on the back side of the substrate, one end of the conductive pattern connected to the conductive pattern, and the other end passing through the through hole. In an electronic component measuring device including a terminal protruding to the front surface side, a connection portion between the conductive pattern and one end of the terminal is supported by a first support on the back surface side of the substrate, and on the back surface side of the substrate An apparatus for measuring an electronic component in which the other end side of the connection portion on one end side of the terminal is supported by a second support body, and the hardness of the second support body is lower than that of the first support body. Since the measurement can be performed in a state close to the component mounting state, the high frequency characteristics are stabilized.
Further, by pressing the electrode of the electronic component on the other end side of the terminal, even if a force in the direction of peeling from the conductive pattern acts on one end side of the terminal, this portion is supported by the first support. Therefore, it is possible to prevent the terminal from being peeled off.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an embodiment of the present invention. FIG. 2 is a perspective view of another embodiment of the present invention. FIG. 3 is a cross-sectional view of a conventional example.
9 Substrate 10 Through-hole 11 Conductive pattern 12 Terminal 13 Second support 14 First support 15 IC
16 electrodes

Claims (4)

貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部を第一の支持体で支持し、この基板の裏面側であってこの端子の一端側の接続部よりも他端側を第二の支持体で支持し、第二の支持体を第一の支持体よりも硬度を低くした電子部品の測定装置。A substrate having a through hole, a conductive pattern provided on the back side of the substrate, a terminal having one end connected to the conductive pattern and the other end penetrating the through hole and projecting to the surface side of the substrate; In the electronic component measuring apparatus , the connection portion between the conductive pattern and one end of the terminal is supported by the first support on the back surface side of the substrate, and the back surface side of the substrate is connected to the one end side of the terminal. An apparatus for measuring an electronic component in which the other end side of the connection part is supported by a second support, and the hardness of the second support is lower than that of the first support . 貫通孔を有する基板と、この基板の裏面側に設けた導電パターンと、この導電パターンにその一端側が接続されるとともにその他端側が前記貫通孔を貫通して基板の表面側に突出された端子とを備えた電子部品の測定装置において、前記基板の裏面側で導電パターンと端子の一端との接続部をバネ性の支持体の固定部側で支持し、この支持体の遊端側で前記基板の裏面側において端子の一端の接続部よりも他端側を支持した電子部品の測定装置。A substrate having a through hole, a conductive pattern provided on the back side of the substrate, a terminal having one end connected to the conductive pattern and the other end penetrating the through hole and projecting to the surface side of the substrate; In the electronic component measuring apparatus , the connection portion between the conductive pattern and one end of the terminal is supported on the back surface side of the substrate on the fixed portion side of the spring support, and the substrate is supported on the free end side of the support. The measuring apparatus of the electronic component which supported the other end side rather than the connection part of the one end of a terminal in the back surface side . 基板の裏面側において、導電パターンにプラグを固定し、このプラグに端子の一端を着脱自在に接続した請求項１または２のいずれか一つに記載の電子部品の測定装置。 3. The electronic component measuring apparatus according to claim 1, wherein a plug is fixed to the conductive pattern on the back side of the substrate, and one end of a terminal is detachably connected to the plug. 基板の表面側において対向する端子他端の対向面側に外方に広がる傾斜を設けた請求項１に記載の電子部品の測定装置。  The electronic component measuring device according to claim 1, wherein an inclination that spreads outward is provided on the facing surface side of the other end of the terminal that faces the surface of the substrate.
JP2000025039A 1999-02-02 2000-02-02 Electronic component measuring device Expired - Fee Related JP3815165B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000025039A JP3815165B2 (en) 1999-02-02 2000-02-02 Electronic component measuring device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-24594 1999-02-02
JP2459499 1999-02-02
JP2000025039A JP3815165B2 (en) 1999-02-02 2000-02-02 Electronic component measuring device

Publications (2)

Publication Number Publication Date
JP2000292440A JP2000292440A (en) 2000-10-20
JP3815165B2 true JP3815165B2 (en) 2006-08-30

Family

ID=26362143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000025039A Expired - Fee Related JP3815165B2 (en) 1999-02-02 2000-02-02 Electronic component measuring device

Country Status (1)

Country Link
JP (1) JP3815165B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286750A (en) * 2001-03-28 2002-10-03 Hioki Ee Corp Contact probe device
JP2012222259A (en) * 2011-04-13 2012-11-12 Koyo Thermo System Kk Wafer with thermocouple, wafer support pin, and wafer support structure

Also Published As

Publication number Publication date
JP2000292440A (en) 2000-10-20

Similar Documents

Publication Publication Date Title
TW305097B (en)
JP3233195B2 (en) Semiconductor element inspection socket
US6764315B2 (en) Electrical connector
US5926027A (en) Apparatus and method for testing a device
US5273440A (en) Pad array socket
JPH11344510A (en) Probe card, probe and semiconductor testing device
JPH04230866A (en) Ic adaptor
TW200406954A (en) Connection structure between printed circuit board and flexible circuit board
US4870356A (en) Multi-component test fixture
JP2734412B2 (en) Semiconductor device socket
US7924036B2 (en) Contactor assembly for integrated circuit testing
JP3815165B2 (en) Electronic component measuring device
JP4765508B2 (en) Measuring jig for high frequency devices
JPS6058831B2 (en) Characteristic inspection jig for electronic components
US6659812B2 (en) Surface mount probe point socket and system
JP3735404B2 (en) Semiconductor device measurement substrate
KR100324007B1 (en) Mutual Contact Device For Module Devices
US6814609B2 (en) Electrical signal read-out method and device therefor
JP2600745Y2 (en) Jig for integrated circuit inspection equipment
JPH0566243A (en) Jig for lsi evaluation
JP2003337158A (en) Electric characteristic measuring holder and electric characteristic measuring method
JP2000030829A (en) Ic socket
WO2020217729A1 (en) Probe device
JP4156125B2 (en) IC socket
JP2759451B2 (en) Printed circuit board inspection jig

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041224

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060131

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060403

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060516

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060529

LAPS Cancellation because of no payment of annual fees