JP2000280155A5 - - Google Patents
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- Publication number
- JP2000280155A5 JP2000280155A5 JP1999087654A JP8765499A JP2000280155A5 JP 2000280155 A5 JP2000280155 A5 JP 2000280155A5 JP 1999087654 A JP1999087654 A JP 1999087654A JP 8765499 A JP8765499 A JP 8765499A JP 2000280155 A5 JP2000280155 A5 JP 2000280155A5
- Authority
- JP
- Japan
- Prior art keywords
- work
- grinding
- view
- double
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000012530 fluid Substances 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08765499A JP3951496B2 (ja) | 1999-03-30 | 1999-03-30 | 薄板円板状ワークの両面研削装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08765499A JP3951496B2 (ja) | 1999-03-30 | 1999-03-30 | 薄板円板状ワークの両面研削装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000280155A JP2000280155A (ja) | 2000-10-10 |
| JP2000280155A5 true JP2000280155A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2005-01-06 |
| JP3951496B2 JP3951496B2 (ja) | 2007-08-01 |
Family
ID=13920958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08765499A Expired - Fee Related JP3951496B2 (ja) | 1999-03-30 | 1999-03-30 | 薄板円板状ワークの両面研削装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3951496B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3993856B2 (ja) | 2004-01-22 | 2007-10-17 | 光洋機械工業株式会社 | 両頭平面研削装置 |
| DE102004011996B4 (de) | 2004-03-11 | 2007-12-06 | Siltronic Ag | Vorrichtung zum simultanen beidseitigen Schleifen von scheibenförmigen Werkstücken |
| KR101141474B1 (ko) * | 2004-03-19 | 2012-05-07 | 엠이엠씨 일렉트로닉 머티리얼즈, 인크. | 양면 연삭기용 웨이퍼 클램핑 장치 |
| JP4798480B2 (ja) * | 2005-05-25 | 2011-10-19 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置 |
| US7601049B2 (en) | 2006-01-30 | 2009-10-13 | Memc Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
| US7662023B2 (en) | 2006-01-30 | 2010-02-16 | Memc Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
| US7930058B2 (en) | 2006-01-30 | 2011-04-19 | Memc Electronic Materials, Inc. | Nanotopography control and optimization using feedback from warp data |
| JP4985451B2 (ja) | 2008-02-14 | 2012-07-25 | 信越半導体株式会社 | ワークの両頭研削装置およびワークの両頭研削方法 |
| DE102008026782A1 (de) | 2008-06-04 | 2009-07-09 | Siltronic Ag | Vorrichtung zum simultanen beidseitigen Schleifen eines scheibenförmigen Werkstücks |
| DE102009025242B4 (de) | 2009-06-17 | 2013-05-23 | Siltronic Ag | Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe |
| DE102009038941B4 (de) | 2009-08-26 | 2013-03-21 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| JP5872947B2 (ja) * | 2012-04-05 | 2016-03-01 | 光洋機械工業株式会社 | 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 |
| CN114178920B (zh) * | 2021-10-26 | 2023-05-05 | 国营芜湖机械厂 | 一种齿轮泵上的齿轮端面损伤修复装置 |
| CN114227524A (zh) * | 2021-12-30 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 双面研磨装置和双面研磨方法 |
| CN116833838B (zh) * | 2023-07-28 | 2025-07-01 | 浙江固本精密技术有限公司 | 一种液体静压式数控卧轴圆台平面磨床 |
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1999
- 1999-03-30 JP JP08765499A patent/JP3951496B2/ja not_active Expired - Fee Related