JP2000277542A5 - - Google Patents
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- Publication number
- JP2000277542A5 JP2000277542A5 JP1999081786A JP8178699A JP2000277542A5 JP 2000277542 A5 JP2000277542 A5 JP 2000277542A5 JP 1999081786 A JP1999081786 A JP 1999081786A JP 8178699 A JP8178699 A JP 8178699A JP 2000277542 A5 JP2000277542 A5 JP 2000277542A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor device
- semiconductor
- back surface
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 39
- 239000000758 substrate Substances 0.000 claims 7
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08178699A JP3895884B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08178699A JP3895884B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004285690A Division JP4017625B2 (ja) | 2004-09-30 | 2004-09-30 | 半導体装置の製造方法 |
| JP2006311131A Division JP2007073987A (ja) | 2006-11-17 | 2006-11-17 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000277542A JP2000277542A (ja) | 2000-10-06 |
| JP2000277542A5 true JP2000277542A5 (enExample) | 2005-06-23 |
| JP3895884B2 JP3895884B2 (ja) | 2007-03-22 |
Family
ID=13756181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08178699A Expired - Lifetime JP3895884B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3895884B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6744124B1 (en) * | 1999-12-10 | 2004-06-01 | Siliconix Incorporated | Semiconductor die package including cup-shaped leadframe |
| US7595547B1 (en) | 2005-06-13 | 2009-09-29 | Vishay-Siliconix | Semiconductor die package including cup-shaped leadframe |
| JP2002252318A (ja) | 2001-02-27 | 2002-09-06 | Nec Kansai Ltd | チップ型半導体装置 |
| JP3942500B2 (ja) | 2002-07-02 | 2007-07-11 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP3853263B2 (ja) * | 2002-07-08 | 2006-12-06 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置 |
| DE10249205B3 (de) * | 2002-10-22 | 2004-08-05 | Siemens Ag | Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen |
| DE10249206B3 (de) * | 2002-10-22 | 2004-07-01 | Siemens Ag | Verfahren zum Zusammenbau eines Leistungsbauelements |
| US6841865B2 (en) * | 2002-11-22 | 2005-01-11 | International Rectifier Corporation | Semiconductor device having clips for connecting to external elements |
| JP4222092B2 (ja) | 2003-05-07 | 2009-02-12 | 富士電機デバイステクノロジー株式会社 | 半導体ウェハ、半導体装置および半導体装置の製造方法 |
| US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
| EP4044226A1 (en) * | 2021-02-16 | 2022-08-17 | Nexperia B.V. | A semiconductor device and a method of manufacturing of a semiconductor device |
-
1999
- 1999-03-25 JP JP08178699A patent/JP3895884B2/ja not_active Expired - Lifetime
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