JP2000277542A5 - - Google Patents

Claims (16)

A semiconductor chip;
A conductive means having a mounting portion to which the back surface of the semiconductor chip is electrically fixed and an extending portion extending upward from the periphery of the mounting portion;
A semiconductor device characterized in that the conductive means is used as a lead-out electrode on the back surface of the semiconductor chip, and an end portion of the extending portion constituting the conductive means is located on a side where a surface electrode of the semiconductor chip is provided. A semiconductor chip having external connection terminals on the surface;
A conductive plate having a mounting portion to which the back surface of the semiconductor chip is electrically fixed and an extending portion integrally extending from the periphery of the mounting portion;
The conductive plate is used as a lead-out electrode on the back surface of the semiconductor chip and a heat radiating means, and an end portion of the extending portion constituting the conductive plate is located substantially on the same plane as an external connection terminal of the semiconductor chip. Semiconductor device.     The semiconductor device according to claim 1, wherein a sealing resin is provided in a peripheral portion of the semiconductor chip.   The semiconductor device according to claim 1, wherein the extending portion is provided apart from the periphery of the semiconductor chip.     3. The semiconductor device according to claim 1, wherein a shape of a back surface of the conductive means or the conductive plate is determined as an external dimension thereof when viewed in a plan view.   3. The semiconductor device according to claim 1, wherein the back surface of the conductive means or the conductive plate is formed substantially flat for adsorption / holding or printing of a model name.     The semiconductor device according to claim 1, wherein the extending portion and the conductive means or the extending portion and the conductive plate are bent in an L shape.   3. The semiconductor device according to claim 1, wherein the semiconductor chip mounted on the conductive means or the conductive plate is a three-terminal type semiconductor element including a back surface of the semiconductor chip.   3. The semiconductor device according to claim 1, wherein the semiconductor chip mounted on the conductive means or the conductive plate is a two-terminal type semiconductor element including a back surface of the semiconductor chip.   On the other side opposite to one side of the conductive means or the conductive plate provided with the extension, a connection unit integrated with one side of the common strip is provided, and the connection unit is cut. The semiconductor device according to claim 1, wherein the extending portion and the mounting portion form the conductive means or the conductive plate. A substrate on which a semiconductor chip is mounted, a first external connection terminal formed on the surface side of the semiconductor chip, and a second external connection formed on the substrate so as to match the height of the first external connection terminal. An external connection terminal,
An electrode on the back surface side of the semiconductor substrate is led out to the front surface side of the semiconductor substrate via the substrate and the second external connection terminal, and the first and second external connection terminals can be bonded to each other. A semiconductor device characterized by that.   12. The semiconductor device according to claim 11, wherein the substrate and the second external connection terminal are integrated and bent into an L shape.   The semiconductor device according to claim 11, wherein the semiconductor chip is a three-terminal element.   The semiconductor device according to claim 11, wherein the semiconductor chip is a two-terminal element.   The semiconductor device according to claim 11, wherein the shape of the back surface side of the substrate determines an external dimension in a plan view.   12. The semiconductor device according to claim 11, wherein the semiconductor chip is exposed.