JP2000272157A - サーマルヘッドラッピング装置 - Google Patents

サーマルヘッドラッピング装置

Info

Publication number
JP2000272157A
JP2000272157A JP11083915A JP8391599A JP2000272157A JP 2000272157 A JP2000272157 A JP 2000272157A JP 11083915 A JP11083915 A JP 11083915A JP 8391599 A JP8391599 A JP 8391599A JP 2000272157 A JP2000272157 A JP 2000272157A
Authority
JP
Japan
Prior art keywords
thermal head
pallet
protective film
polishing
lapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11083915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000272157A5 (show.php
Inventor
Makoto Kashiwatani
誠 柏谷
Junji Nakada
純司 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP11083915A priority Critical patent/JP2000272157A/ja
Priority to US09/534,555 priority patent/US6688951B2/en
Publication of JP2000272157A publication Critical patent/JP2000272157A/ja
Publication of JP2000272157A5 publication Critical patent/JP2000272157A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/26—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding workpieces with arcuate surfaces, e.g. parts of car bodies, bumpers or magnetic recording heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electronic Switches (AREA)
JP11083915A 1999-03-26 1999-03-26 サーマルヘッドラッピング装置 Pending JP2000272157A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11083915A JP2000272157A (ja) 1999-03-26 1999-03-26 サーマルヘッドラッピング装置
US09/534,555 US6688951B2 (en) 1999-03-26 2000-03-27 Thermal head lapping apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11083915A JP2000272157A (ja) 1999-03-26 1999-03-26 サーマルヘッドラッピング装置

Publications (2)

Publication Number Publication Date
JP2000272157A true JP2000272157A (ja) 2000-10-03
JP2000272157A5 JP2000272157A5 (show.php) 2005-05-26

Family

ID=13815908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11083915A Pending JP2000272157A (ja) 1999-03-26 1999-03-26 サーマルヘッドラッピング装置

Country Status (2)

Country Link
US (1) US6688951B2 (show.php)
JP (1) JP2000272157A (show.php)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235501B2 (en) 2004-12-13 2007-06-26 Micron Technology, Inc. Lanthanum hafnium oxide dielectrics
US7560395B2 (en) * 2005-01-05 2009-07-14 Micron Technology, Inc. Atomic layer deposited hafnium tantalum oxide dielectrics
US8930023B2 (en) 2009-11-06 2015-01-06 Irobot Corporation Localization by learning of wave-signal distributions
US7410910B2 (en) * 2005-08-31 2008-08-12 Micron Technology, Inc. Lanthanum aluminum oxynitride dielectric films
US7972974B2 (en) 2006-01-10 2011-07-05 Micron Technology, Inc. Gallium lanthanide oxide films
US7605030B2 (en) 2006-08-31 2009-10-20 Micron Technology, Inc. Hafnium tantalum oxynitride high-k dielectric and metal gates
US7759747B2 (en) 2006-08-31 2010-07-20 Micron Technology, Inc. Tantalum aluminum oxynitride high-κ dielectric
US20080057659A1 (en) * 2006-08-31 2008-03-06 Micron Technology, Inc. Hafnium aluminium oxynitride high-K dielectric and metal gates
US7544604B2 (en) 2006-08-31 2009-06-09 Micron Technology, Inc. Tantalum lanthanide oxynitride films
US7432548B2 (en) * 2006-08-31 2008-10-07 Micron Technology, Inc. Silicon lanthanide oxynitride films
US7563730B2 (en) * 2006-08-31 2009-07-21 Micron Technology, Inc. Hafnium lanthanide oxynitride films
US7776765B2 (en) * 2006-08-31 2010-08-17 Micron Technology, Inc. Tantalum silicon oxynitride high-k dielectrics and metal gates
CN102713779B (zh) 2009-11-06 2015-12-02 艾罗伯特公司 用于通过自主型机器人完全覆盖表面的方法和系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306167A (ja) * 1988-06-06 1989-12-11 Sony Corp ハードディスク用基板研磨装置
US5443415A (en) * 1993-09-24 1995-08-22 International Technology Partners, Inc. Burnishing apparatus for flexible magnetic disks and method therefor
JPH07132628A (ja) 1993-11-10 1995-05-23 Toshiba Corp サーマルヘッドおよびその製造方法
JP2895757B2 (ja) * 1994-08-05 1999-05-24 日本ミクロコーティング株式会社 研磨装置
JPH08108359A (ja) * 1994-10-07 1996-04-30 Fuji Photo Film Co Ltd 研磨装置
JPH115323A (ja) 1997-04-22 1999-01-12 Fuji Photo Film Co Ltd サーマルヘッドおよびその製造方法
JP3024947B2 (ja) * 1997-07-03 2000-03-27 日本ミクロコーティング株式会社 研磨装置

Also Published As

Publication number Publication date
US6688951B2 (en) 2004-02-10
US20030060146A1 (en) 2003-03-27

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