JP2000223575A - 半導体装置の設計方法、半導体装置および半導体装置の製造方法 - Google Patents

半導体装置の設計方法、半導体装置および半導体装置の製造方法

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Publication number
JP2000223575A
JP2000223575A JP11020277A JP2027799A JP2000223575A JP 2000223575 A JP2000223575 A JP 2000223575A JP 11020277 A JP11020277 A JP 11020277A JP 2027799 A JP2027799 A JP 2027799A JP 2000223575 A JP2000223575 A JP 2000223575A
Authority
JP
Japan
Prior art keywords
power supply
wiring
semiconductor device
layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11020277A
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English (en)
Japanese (ja)
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JP2000223575A5 (https=
Inventor
Kazuhisa Suzuki
和久 鈴木
Toshiro Takahashi
敏郎 高橋
Kazuto Nagashima
和人 長島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11020277A priority Critical patent/JP2000223575A/ja
Publication of JP2000223575A publication Critical patent/JP2000223575A/ja
Publication of JP2000223575A5 publication Critical patent/JP2000223575A5/ja
Pending legal-status Critical Current

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Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP11020277A 1999-01-28 1999-01-28 半導体装置の設計方法、半導体装置および半導体装置の製造方法 Pending JP2000223575A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11020277A JP2000223575A (ja) 1999-01-28 1999-01-28 半導体装置の設計方法、半導体装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11020277A JP2000223575A (ja) 1999-01-28 1999-01-28 半導体装置の設計方法、半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2000223575A true JP2000223575A (ja) 2000-08-11
JP2000223575A5 JP2000223575A5 (https=) 2006-01-26

Family

ID=12022687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11020277A Pending JP2000223575A (ja) 1999-01-28 1999-01-28 半導体装置の設計方法、半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2000223575A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100667597B1 (ko) 2005-02-07 2007-01-11 삼성전자주식회사 매크로 셀의 전원 라인 배치 구조 및 매크로 셀과 파워매시의 결합 구조
JP2007165670A (ja) * 2005-12-15 2007-06-28 Matsushita Electric Ind Co Ltd 半導体回路装置およびその設計方法
US8063415B2 (en) 2007-07-25 2011-11-22 Renesas Electronics Corporation Semiconductor device
CN112567507A (zh) * 2018-08-28 2021-03-26 株式会社索思未来 半导体集成电路装置
JPWO2021111604A1 (https=) * 2019-12-05 2021-06-10
CN114492283A (zh) * 2020-11-11 2022-05-13 Oppo广东移动通信有限公司 配置芯片的方法及装置、设备、存储介质
CN114898790A (zh) * 2016-01-29 2022-08-12 三星电子株式会社 用于选择性地执行隔离功能的半导体器件及其布局替代方法
WO2024116853A1 (ja) * 2022-11-29 2024-06-06 株式会社ソシオネクスト 半導体集積回路装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100667597B1 (ko) 2005-02-07 2007-01-11 삼성전자주식회사 매크로 셀의 전원 라인 배치 구조 및 매크로 셀과 파워매시의 결합 구조
JP2007165670A (ja) * 2005-12-15 2007-06-28 Matsushita Electric Ind Co Ltd 半導体回路装置およびその設計方法
US8063415B2 (en) 2007-07-25 2011-11-22 Renesas Electronics Corporation Semiconductor device
US8264011B2 (en) 2007-07-25 2012-09-11 Renesas Electronics Corporation Semiconductor device
CN114898790A (zh) * 2016-01-29 2022-08-12 三星电子株式会社 用于选择性地执行隔离功能的半导体器件及其布局替代方法
CN112567507A (zh) * 2018-08-28 2021-03-26 株式会社索思未来 半导体集成电路装置
CN112567507B (zh) * 2018-08-28 2024-07-05 株式会社索思未来 半导体集成电路装置
JPWO2021111604A1 (https=) * 2019-12-05 2021-06-10
JP7363921B2 (ja) 2019-12-05 2023-10-18 株式会社ソシオネクスト 半導体装置
CN114492283A (zh) * 2020-11-11 2022-05-13 Oppo广东移动通信有限公司 配置芯片的方法及装置、设备、存储介质
WO2024116853A1 (ja) * 2022-11-29 2024-06-06 株式会社ソシオネクスト 半導体集積回路装置

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