JP2000219267A - Lamination device for manufacturing carrier tape manufacture of carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of warpage of a carrier tape by making the drum shape of a laminator roller into an arcuate carvature, and forming the drum shape of a compression roller on the curvature to be fitted in with this shape in a carrier tape manufacturing device through the lamination of metal foil, a film or the like. SOLUTION: A film or a sheet base material 4 is allowed to pass through a drying zone 5 and copper foil 6 is laminated by means of a laminator roller 1 having an arcuate drum part and a rubber roller 2 having an inverted-arcuate drum part fitting thereto via an adhesive. After being cooled by a cooling a roller 3, a laminate material 7 is taken up on a roller by putting the copper foil face outside. In this manner, since the cooling roller 3, guide roller, or winding roller have a lamination tape warped after nipping of the laminate tape, there exist no wrinkles in the tape. Therefore, even in the case of an adhesive undergoing large thermally hardening contraction, a quantity of warpage can be reduced, and a carrier tape with an excellent adhesive characteristics can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB (Tape Aut)
Tape for omated Bonding, BGA (Ball GridArra)
y), a manufacturing apparatus and a manufacturing method of a carrier tape for a semiconductor integrated circuit such as a CSP (Chip Size Package).

[0002]

2. Description of the Related Art Conventionally, in the production of carrier tapes such as TAB, tape BGA, and CSP, a copper foil is laminated on a polyimide tape as a base material using an epoxy adhesive or a polyimide adhesive, and patterning is performed on the laminated material. Was manufactured.

[0003] These adhesives have a large volume shrinkage during heat curing, and when the copper foil is patterned, the internal stress of the adhesive layer is relieved, so that the pattern surface is warped concavely in the width direction of the tape, and the flat carrier is deformed. There was a problem that a tape could not be obtained.

In recent years, the fine pitch and the number of pins have been increased, and the thickness of the tape base material has changed from 75 μm to 50 μm. Since the thickness of the base material has been reduced, the stiffness of the base film or tape has been weakened, and the warpage has become several mm due to the curing shrinkage of the adhesive after patterning.

[0005] Further, reduction of the volume shrinkage of the adhesive and reduction of the coating amount have been studied, but the problem of adhesion reliability due to the variation of the coating amount and the increase of Tg (glass transition temperature) in wire bonding have been considered. There were demands and the situation was not significantly improved.

[0006]

As described above, with the current technology, it is difficult to reduce the volume shrinkage of the adhesive and to reduce the amount of adhesive applied, and it is difficult to reduce the amount of warpage of the carrier tape. It is a situation that is. An object of the present invention is to provide a manufacturing apparatus and an apparatus method for supplying such a carrier tape without warpage.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the present invention is directed to a laminate for producing a carrier tape by laminating a metal foil and a film or sheet-like substrate. In the apparatus, the laminator roll longitudinal body shape is an arc-shaped curved surface, and the pressing roll longitudinal body shape is a curved surface fitted to the laminator roll shape, the laminate for producing carrier tape. Device.

According to a second aspect of the present invention, there is provided a carrier tape manufacturing method for laminating a metal foil and a film or a sheet-like base material using an adhesive, wherein the laminator roll has a curved body having a circular body in the longitudinal direction. A carrier tape manufacturing method characterized in that the carrier tape is manufactured by using a laminating apparatus in which the shape of the pressing pressure roll in the longitudinal direction is a curved surface fitted to the shape of the laminator roll.

According to a third aspect of the present invention, there is provided a carrier tape manufacturing method according to the second aspect, wherein the film or sheet-like substrate has a single-layer or multilayer structure.

According to a fourth aspect of the present invention, there is provided the carrier tape manufacturing method according to the second or third aspect, wherein the adhesive has a single-layer or multilayer structure.

According to a fifth aspect of the present invention, there is provided a carrier tape manufacturing method according to the second to fourth aspects, wherein the film or sheet-like substrate is a single-layer or multi-layer flexible printed wiring board. It was done.

According to a sixth aspect of the present invention, the metal foil is made of copper, the film or sheet base is made of a polyimide resin, and the adhesive is made of a polyimide resin or an epoxy resin. Item 6. A method for producing a carrier tape according to any one of Items 2 to 5.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, since it is difficult to reduce the curing shrinkage of the adhesive, the longitudinal body of the laminator roll is formed into an appropriate circular arc shape and the laminator roll is formed in order to reduce the warpage due to the curing shrinkage. This is a laminating device in which the rubber roll longitudinal direction body is formed into an inverted arc shape so that it fits with the metal foil in a state where the width direction of the film base is warped so that the bonding surface becomes convex, and heat curing is performed. This is a method in which the volumetric shrinkage force is offset by the warpage during lamination.

FIG. 1 is a perspective view showing a laminator roll 1 according to an embodiment of the present invention, in which a trunk portion has an arc shape. FIG. 2 is a perspective view showing a rubber roll 2 according to an embodiment of the present invention, which is fitted to a laminator roll 1 having a body portion having an inverted arc shape. In the present embodiment, the direction of the arc of the laminator roll is concave, but a convex material such as lamination from metal foil may be employed depending on the manufacturing conditions.

Although the laminator roll is usually a flat roll, the present invention is characterized in that the longitudinal direction of the trunk has an arc shape. The roll is fitted in a laminator roll shape so that a uniform pressure is applied over the entire width of the film when the roll is nipped by the laminator roll. If the laminator body is concave, the rubber roll body is convex. Preferably, the roll is an elastic body. The size of the circular arc shape is determined according to the amount of curing shrinkage of the adhesive. If the curing shrinkage is large, it is necessary to increase the radius R of the circular arc.

FIG. 3 schematically shows an embodiment of a laminating apparatus for producing a laminated material for a carrier tape according to the present invention.
Pass the film or sheet substrate 4 through the drying zone 5;
A rubber roll 2 for fitting a copper foil 6 to a laminator roll 1 having a body having an arc shape and a laminator roll having a body having an inverted arc shape.
To laminate with an adhesive (not shown) therebetween to obtain a laminated material. Then, after cooling with the cooling roll 3, the laminated material 7 is wound around the roll with the copper foil surface facing outward. Since the cooling roll 3, the guide roll, and the take-up roll after the laminator nip have the warped shape of the laminating tape, an arc shape is given to the roll body so that the tape does not break.
When the concave surface of the tape touches the roll, the roll body is made to have a convex shape. When the convex surface of the tape touches the roll, the roll body is made to have a concave shape, and the tape is wound on the lami tape so that it does not wrinkle.

As the film or sheet substrate, general-purpose thermoplastic resins such as polyester and polyurethane, thermosetting resins such as phenolic resin, epoxy resin and polyimide resin, thermoplastic polyimide resins such as polyetherimide and polyimide, and polysulfone , Polyether sulfone, polyether ether ketone, and other super engineering plastics. The thickness of the substrate is, for example, 25 to 125 μm. These films or sheet substrates may have a single-layer or multilayer structure. Further, a single-layer or multilayer flexible printed wiring board may be used. Copper is generally used as the metal foil, but gold, silver, aluminum, nickel or the like may be used.

Adhesives are generally epoxy-based or polyimide-based, but also polyurethane-based, polyester-based adhesives and modified types thereof. The adhesive may be not only a single layer type but also a multilayer type such as a multilayer type provided with a urethane resin layer in order to alleviate the stress caused by curing shrinkage of the adhesive, and an adhesive using a low Tg adhesive as a buffer layer.

The adhesive may be coated on the base material in the previous process, or the adhesive layer may be formed into a film in the previous process and then laminated with the metal foil in the laminating process. Can be considered.

FIG. 4 is a perspective view of a laminated material for a carrier tape showing a state in which the adhesive has not been cured immediately after being laminated by the laminator apparatus of the present invention. The laminated material 8 is bent in an arc shape, and has a structure in which an adhesive 10 is sandwiched between a copper foil 9 and a film or sheet base material 11. FIG.
Is a diagram showing a method for measuring the amount of warpage h using a conventional laminated material as an example. The amount of warpage is obtained by measuring the depth of focus using an optical microscope.

The determination of the radius R of the arc shape of the laminator roll is determined by the magnitude of the curing shrinkage of the adhesive. Epoxy adhesive application amount dry12μm, copper foil 1 / 2oz.1
When laminating with a specification of 8 μm thickness and polyimide tape of 50 μm thickness, R is preferably about 50 mm. Immediately after lamination, the copper foil surface is convex and the amount of warpage is preferably about 1 mm or less. When cured in an oven at 150 ° C for 6 hours, the epoxy adhesive cures and shrinks, and the warpage is almost 0 mm.
Offset by In the patterning of copper foil, when laminating with a flat roll, the pattern surface width direction is warped to a concave shape by about 3 mm due to stress relaxation of the adhesive layer. However, the copper foil lami tape according to the present invention relaxes the stress of the adhesive. Therefore, the amount of warpage is not much different from that before patterning, and stays at 1 mm or less.

Further, T after curing with a polyimide-based adhesive
g is 150 ° C., and when the coating amount is dry 8 μm, copper foil 1/2 ounce, 18 μm
R is preferably about 60 mm with a thickness of 50 μm for a polyimide tape. Immediately after lamination, the copper foil surface is convex and the amount of warpage is about 1 mm or less. When cured in an oven at 270 ° C. for 3 hours, the amount of warpage is offset to almost 0 mm as in the case of the epoxy adhesive. Since the stress relaxation of the adhesive layer has already been performed in the patterning of the copper foil, the warpage amount is 1 m.
m or less.

[0023]

EXAMPLE An epoxy adhesive was used as a polyimide tape "UPILEX S" manufactured by Ube Industries, Ltd., 35 mm wide and 50 mm wide.
The raw tape which was applied at a dry thickness of 12 [mu] m and the B stage was used was a copper foil SLP manufactured by Nihon Denki Co., Ltd. in a laminating apparatus in which the laminator roll body had a shape of R = 50 mm.
(Wt) 1/2 oz, 18 μm thickness and laminator temperature 15
The laminate was laminated at 0 ° C. at a line speed of 2 m / min and wound up on a reel with the copper foil surface facing outward to obtain a laminated material. The uncured tape warpage immediately after lamination was 1.5 mm. Take the copper foil lamination tape (laminated material) wound up on a reel in an oven.
It was heated at 50 ° C. for 6 hours. The amount of tape warpage after heat curing was 0.9 mm at the copper foil surface convexity. Next, resist coating was performed, and the copper foil was patterned with an etching solution. The warpage after patterning is 0.5
mm. Ni is patterned by electroless plating
3μm, Au 0.3μm thick plating, T-BGA
Carrier tape was manufactured. When the amount of warpage was measured, the pattern had a concave shape of 0.8 mm. Further, there was no problem in transport due to tape warpage in mounting processing.

(Comparative Example) The same polyimide raw tape with an epoxy adhesive and copper foil as in the example were used, and they were bonded at the same temperature and speed as in the example using a flat laminator roll. The amount of warpage of the uncured product immediately after lamination is 0.1 due to the concave surface of the copper foil.
5 mm. Next, the same as in the example, 150
Heat cured at 6 ° C for 6 hours. The warpage after curing is 0.7m
m, the copper foil was concave. Furthermore, when resist coating and patterning were performed under the same conditions as in the example, the amount of warpage was 3.5 mm in the pattern concave. Ni3 μm Au0.
The warpage after the electroless plating of 3 μm was 3.
6 mm. The amount of warpage was 4.5 times that of the example.

[0025]

According to the present invention, even if the adhesive has a large thermosetting shrinkage, the amount of warpage of the laminated product can be remarkably reduced, and the adhesive properties do not need to be changed. A manufacturing apparatus and a manufacturing method for manufacturing a carrier tape having good characteristics can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a laminator roll in which a trunk portion of the present invention has an arc shape.

FIG. 2 is a perspective view of a roll in which a body portion of the present invention is fitted to a laminator roll 1 having an inverted arc shape.

FIG. 3 is a schematic view of a carrier tape manufacturing apparatus according to the present invention, which includes a laminator roll having a body having an arc shape and a roll fitted to a laminator roll having a body having an inverted arc shape.

FIG. 4 is a perspective view of a laminated material in which an adhesive laminated by the laminator device of the present invention has not been cured.

FIG. 5 shows the amount of warpage of an uncured adhesive laminate and a patterned product immediately after lamination.

[Explanation of symbols]

1 ・ ・ ・ Laminator roll whose body is arc-shaped 2 ・ ・ ・ Roll fitted with laminator roll whose body is inverted arc 3 ・ ・ ・ Cooling roll of laminator device 4 ・ ・ ・ Film or sheet base material 5 ・・ ・ Drying zone 6 ・ ・ ・ Copper foil 7 ・ ・ ・ Laminated material wound with the copper foil surface outside 8 ・ ・ ・ Laminated material of copper foil and base material 9 ・ ・ ・ Copper foil 10 ・ ・ ・ Adhesive 11 ... Film and sheet base materials

Continued on the front page F-term (reference) 3E067 AA11 AB41 AC18 BA02A BB11A BB14A BB25A FA01 GD10 4F100 AB01A AB17A AB33A AK49B AK53B AT00B AT00C BA02 BA03 BA07 BA10A BA10B BA10C CB00 EC182 E0441 EJ90E03 EJ192 EJ421

Claims (6)

[Claims] 1. A laminating apparatus for manufacturing a carrier tape by laminating a metal foil and a film or sheet-like substrate, wherein a laminator roll longitudinal body shape is an arc-shaped curved surface, and a pressing pressure roll. A laminating apparatus for producing a carrier tape, wherein a longitudinal body shape is a curved surface fitted to the laminator roll shape. 2. A method for producing a carrier tape, comprising laminating a metal foil and a film or sheet-like base material using an adhesive, wherein a laminator roll longitudinal body has a circular arc-shaped curved surface and a pressing pressure roll longitudinal A method for producing a carrier tape, characterized in that the carrier tape is produced by using a laminating apparatus having a curved shape that fits the shape of the laminator roll in a direction body. 3. The method for producing a carrier tape according to claim 2, wherein the film or sheet-like substrate has a single-layer or multilayer structure. 4. The method according to claim 2, wherein the adhesive has a single-layer or multilayer structure. 5. The method according to claim 2, wherein the film or sheet-like substrate is a single-layer or multi-layer flexible printed wiring board. 6. The carrier tape according to claim 2, wherein the metal foil is copper, the film or sheet base is a polyimide resin, and the adhesive is a polyimide resin or an epoxy resin. Production method.