JP2000216336A - Surface-mounting type electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface-mounting type electronic components which can be soldered securely without interference between a soldering iron and other elements and is applicable to highly dense mounting, even if the electronic components are subjected to soldering by using the soldering iron. SOLUTION: A recessed part 2 (notched part) is formed in the peripheral part of a substrate 2, and a connection terminal 3 is provided adjacent to the recessed part 2. The connection terminal 3 is arranged, so that a part (one end face) of the outer circumferential surface of the connection terminal 3 and the end face (end face on the bottom side of the recessed part) of the recessed part 2a of the substrate 2 are substantially flush with each other. This manufacturing method is applied to a hybrid IC 10, where an element 1 is mounted to the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component, and more particularly, for example, to a surface mount type hybrid component.
The present invention relates to a surface-mount type electronic component mounted on a surface of a connection target such as a printed circuit board via a connection terminal as shown in FIG.

[0002]

2. Description of the Related Art As a conventional surface mount type hybrid IC, for example, FIG.
As shown in the main part of FIG.
A hybrid IC 60 (60a) having a prismatic connection terminal (chip terminal) 53 on the lower surface side of the device, or a columnar shape on the lower surface side of a substrate 52 on which the element 51 is mounted as shown in FIG. IC 60 provided with connection terminals 53
(60b).

[0003] Such a hybrid IC 60
A and 60b are lands 56 formed on the surface of a printed circuit board 55 to be connected, usually by reflow soldering, by connecting the connection terminals 53 to each other through solder fillets 54 (FIGS. 7A and 7B). Are electrically and mechanically connected to each other for surface mounting.

In mounting a hybrid IC, it is necessary to mount by a manual soldering using a soldering iron, instead of the above-described reflow soldering method, depending on the type of an object to be connected. May be.

However, in recent years, as the demand for high-density mounting has increased, as shown in FIG.
When the soldering is performed using the soldering iron 58, the soldering iron 58 is used to separate the other elements (components) on the printed circuit board 55. 3) There is a problem that the tip of the soldering iron 58 cannot be brought into contact with the solder 59 by contact with the soldering iron 57, and it becomes difficult to reliably perform soldering.
This tendency increases as the height of the other element (component) 57 increases.

Therefore, if an attempt is made to secure a predetermined distance L2 between the hybrid IC 60 and another element (component) 57 so that the tip of the soldering iron 58 reaches the solder 59,
This leads to a decrease in the mounting density, which makes it impossible to meet the demand for miniaturization.

The present invention solves the above-mentioned problems. Even when soldering is performed using a soldering iron, the soldering is performed without interference between the soldering iron and other elements. It is an object of the present invention to provide a surface-mounted electronic component capable of supporting high-density mounting.

[0008]

In order to achieve the above object, a surface mount type electronic component according to the present invention (claim 1) comprises: an electronic component main body having an element mounted on a substrate; and the electronic component main body. And a connection terminal electrically and mechanically connected to a surface of a mounting object such as a printed circuit board, the connection terminal being provided on a lower surface side of the substrate, A concave notch is formed in the portion, and the connection terminal is provided near the notch.

[0009] By forming a concave notch on the periphery of the substrate constituting the hybrid IC and arranging connection terminals near the notch, soldering using a soldering iron can be performed. Also, it is possible to insert the soldering iron from the recess of the substrate to the vicinity of the joint between the connection terminal and the land of the connection object such as a printed circuit board, so that the soldering can be reliably performed. Therefore, it is not necessary to increase the distance between other elements as in the past, and even when the height of the surrounding elements is high, the soldering iron is joined almost directly from above to the connection between the land and the connection terminal. It becomes possible to insert even near the part, and it becomes possible to cope with high-density mounting.
There is no particular restriction on the specific shape of the concave cutout, and it is possible to adopt various shapes into which a soldering iron can be inserted. There is no particular limitation on the shape of the connection terminal, and various shapes can be used.

According to a second aspect of the present invention, in the surface-mounted electronic component, a part of an outer peripheral surface of the connection terminal and at least a part of an end surface of the concave notch of the substrate are substantially flush. Features.

In a case where a part of the outer peripheral surface of the connection terminal and at least a part of an end face of the concave notch of the substrate are substantially flush, a soldering iron inserted from the concave notch is used. In addition, it is possible to securely insert the solder into the vicinity of the joint between the connection terminal and the land of the connection object such as a printed circuit board, and to perform the soldering, thereby making the present invention more effective.

Further, the surface-mounted electronic component according to a third aspect is characterized in that the electronic component body is a hybrid IC in which elements are mounted on a substrate.

By applying the present invention to a hybrid IC in which elements are mounted on a substrate, it is possible to mount the hybrid IC at high density while securing the mounting reliability.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail. Here, a surface-mounted hybrid IC will be described as an example of the surface-mounted electronic component.

FIG. 1 is a perspective view showing a main part of a surface mount type hybrid IC according to an embodiment of the present invention.
3A and 3B are diagrams illustrating main parts of the hybrid IC, wherein FIG. 3A is a plan view and FIG. 3B is a front view.

The hybrid IC 10 is formed by mounting various elements 1 on a substrate 2.
A plurality of recesses (notches) of width M and depth N
2a is formed. A connection terminal (length L, width W) 3 made of metal and having a substantially square planar shape is provided near the concave portion (notch portion) 2a on the lower surface of the substrate 2 (FIG. 2). reference). The connection terminal 3 is connected to one end face 13.
Is an end surface 12 on the bottom side of the concave portion (notch portion) 2 a of the substrate 2.
It is arranged at a position that is substantially flush with the above. The size of the concave portion 2a of the substrate 2 is formed such that the tip of a soldering iron used for soldering can be inserted.

As the substrate 2, a substrate made of a copper-clad laminate made of a resin and glass fiber as a base material or an aluminum thick film printed substrate made of a ceramic material can be used. Further, as the connection terminal 3, it is possible to use a material in which the surface of a non-conductive material such as ceramic or resin is coated with a metal or other conductive material.

FIG. 3 shows a positional relationship between the substrate 2, the connection terminals 3, and the lands 21 on the printed circuit board 20 to which the connection terminals 3 are connected, which constitute the hybrid IC 10 of this embodiment.

In this embodiment, the lands 21 formed on the printed circuit board 20 have a length L1 and a width W1 larger than the length L and the width W of the connection terminal 3, as shown in FIG. Is formed.

In this hybrid IC 10, a concave portion 2 a is formed in the peripheral portion of the substrate 2, and the connecting terminal 3
Is arranged so that one end face 13 is substantially flush with the end face 12 of the concave portion (notch portion) 2 a of the substrate 2. Therefore, as shown in FIG. When soldering, the soldering iron 31 is placed almost directly above the substrate 2
Through the concave portion 2a of the connection terminal 3 and the land 21 can be inserted. As a result, Hybrid I
Even if the distance L2 (FIG. 4) between the C10 and the other element 7 is not increased, the soldering can be surely performed by using the soldering iron 31, so that high-density mounting can be supported. become.

FIGS. 5 (a), 5 (b) and 5 (c) are views showing another example of the mode of disposing the connection terminals 3 on the substrate 2. FIG.
In the present invention, as shown in FIG. 5A, the connection terminal 3 is close to the periphery of the substrate 2 so that a part of the connection terminal 3 is exposed from the concave portion 2a of the substrate 2 when viewed in plan. 5 (b), one end face 13 is arranged so as to be substantially flush with the end face 12a on the side of the concave portion 2a, or as shown in FIG. 5 (c). ), One end face 13 of each of the two connection terminals 3 is substantially flush with the end faces 12a on each side of the one recess 2a. They can be arranged on both sides, and can be arranged in other manners.

In the above embodiment, the case where the planar shape of the connection terminal is substantially square has been described as an example. However, there is no particular restriction on the specific shape of the connection terminal, and various shapes are available depending on the shape of the land. Can be formed.

As shown in FIG. 6, the connection terminal 3 may be formed by bending a thin metal plate having a thickness T1 and a width H1 into a hollow columnar structure.
Also in this case, a solder fillet is formed around after mounting (after soldering), so that it can sufficiently function as a connection terminal.

Further, the present invention can be widely applied when various solders such as a eutectic solder and a high-temperature solder are used at the time of mounting.

In the above embodiment, the hybrid I
C has been described as an example.
The present invention is not limited to C, and can be applied to various other surface mount electronic components.

In the above embodiment, the case where the connection terminals are attached to the substrate by a method of soldering using a soldering iron has been described. Therefore, it is also possible to mount the device by mounting it on a substrate at the same time as other elements and performing reflow soldering, or mounting it using a conductive resin.

The present invention is not limited to the above-described embodiment in other respects, and various applications and modifications can be made within the scope of the present invention.

[0028]

As described above, the surface-mounted electronic component according to the present invention (Claim 1) has a concave notch formed on the periphery of the substrate constituting the hybrid IC and the notch. Because the connection terminal is arranged near the
Even when soldering with a soldering iron, insert the soldering iron from the recess of the board to the vicinity of the joint between the land of the object to be connected such as a printed circuit board and the connection terminal to ensure the soldering. It is possible to do. As a result, it is not necessary to increase the distance between other elements as in the conventional case, and even when the height of the surrounding elements is high, the soldering iron is almost directly above the land and the connection terminal. It becomes possible to insert even in the vicinity of the joint, and it is possible to cope with high-density mounting.

Further, as in the surface mount type electronic component according to the second aspect, a configuration is provided in which a part of the outer peripheral surface of the connection terminal and at least a part of an end surface of the concave notch of the substrate are substantially flush. In this case, the soldering iron inserted from the concave notch can be securely inserted into the vicinity of the joint between the land of the connection target such as a printed circuit board and the connection terminal, and soldering can be performed. The present invention can be made more effective.

Further, by applying the present invention to a hybrid IC having an element mounted on a substrate as in the surface mount type electronic component of the third aspect, it is possible to ensure the mounting reliability,
It becomes possible to mount a hybrid IC at high density.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a surface mount type hybrid IC according to an embodiment of the present invention.

FIGS. 2A and 2B are diagrams showing a main part of a surface mount type hybrid IC according to an embodiment of the present invention, wherein FIG. 2A is a plan view and FIG.
Is a front view.

FIG. 3 is a hybrid IC according to an embodiment of the present invention.
FIG. 3 is a perspective view showing a positional relationship between a substrate constituting the substrate, connection terminals, and lands on a printed circuit board to which the connection terminals are connected.

FIG. 4 is a hybrid IC according to an embodiment of the present invention.
FIG. 5 is a perspective view showing a state in which the connection terminals constituting the above are soldered to the lands of the printed circuit board using a soldering iron.

FIGS. 5A to 5C are diagrams showing another example of the arrangement of connection terminals of the hybrid IC according to one embodiment of the present invention.

FIG. 6 is a hybrid IC according to an embodiment of the present invention.
FIG. 6 is a perspective view showing another example of the connection terminal used for the first embodiment.

FIGS. 7A and 7B are perspective views showing a main part of a conventional surface-mount type hybrid IC.

FIG. 8 is a diagram showing a positional relationship between a hybrid IC and other elements (parts) when a conventional hybrid IC is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Element 2 Substrate 2a Depression formed in substrate 3 Connection terminal 10 Hybrid IC 12 End face on bottom side of depression (notch) 12a End face on side of depression (notch) 13 One end face of connection terminal 20 Printed circuit board 21 Land L Connection terminal length L1 Land length L2 Distance between hybrid IC and other elements W Connection terminal width W1 Land width M Board recess width N Board recess depth

Claims (3)

[Claims] An electronic component main body having an element mounted on a substrate and an electric and mechanical surface disposed on a lower surface side of a substrate constituting the electronic component main body and electrically mounted on a surface of a mounting object such as a printed circuit board. And a connection terminal connected to the surface-mounted electronic component, wherein a concave notch is formed in a peripheral portion of the substrate,
A surface-mounted electronic component, wherein the connection terminal is provided near the notch. 2. The surface mount type according to claim 1, wherein a part of an outer peripheral surface of the connection terminal and at least a part of an end surface of the concave notch of the substrate are substantially flush with each other. Electronic components. 3. The surface-mounted electronic component according to claim 1, wherein the electronic component body is a hybrid IC having an element mounted on a substrate.