JP2000216083A - Apparatus and method for developing process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the developing process whereby a resist remaining on a substrate can be surely removed. SOLUTION: The developing apparatus has a rinse liq. spraying nozzle 47 for spraying a rinse liq. at a high pressure on a substrate G after the developing process on the substrate G, and a cover 50 surrounding the side of this nozzle 47, the cover being disposed with a specified space (d) from the substrate G so as to temporarily store the rinse liq. sprayed from the nozzle 47 and form a rinse liq. film on the substrate. When the nozzle 47 sprays the rinse liq. at a high pressure on the substrate G, the box-like cover 50 forms a rinse film having a buffer action enough to prevent the damage to the substrate G while a resist remaining on the substrate is removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter of a color liquid crystal display (LCD).
The present invention relates to a developing apparatus and a developing method for performing a developing process on a substrate after an exposure process.

[0002]

2. Description of the Related Art In the production of a color filter for a color liquid crystal display (LCD), a color resist of four colors (red, green, blue, and black) is applied to a rectangular substrate made of glass, and this is exposed. A color filter is formed by a so-called photolithography technique of developing the color filter.

In the photolithography process of such a color filter, a coating process and an exposure / development process are performed for each color resist. That is, for example, after the substrate is washed, it is carried into the resist coating unit, and first, a red color resist is applied, the red color resist is exposed, and subsequently developed, and then the green color resist is processed. Coating, exposing the green color resist, then developing, then
The same goes for blue and black.

In developing a color filter substrate, a rectangular substrate is mounted on a spin chuck in a development processing unit, a developing solution is supplied from a developing solution supply nozzle, and the entire surface of the substrate is developed. , And is stopped for a predetermined time, and the developing process proceeds. Thereafter, the substrate is rotated by the spin chuck to shake off the developing solution, and then a rinsing solution such as pure water is discharged from the rinsing solution supply nozzle to wash away the developing solution remaining on the substrate. After that, the spin chuck is rotated at high speed, the rinse liquid remaining on the substrate is shaken off, and the substrate is dried,
Thus, a series of development processing ends.

[0005]

In such a color filter substrate development process, the type of the resist is different from, for example, the resist of the circuit pattern of the LCD substrate, and contains a special pigment. Therefore, after removing the resist remaining on the substrate after the reaction between the developing solution and the resist is completed after the developing solution is applied to the substrate and the developing process is completed, the conventional rinsing solution is supplied from a nozzle for supplying a rinsing solution. A very low pressure rinsing liquid has a problem that the resist liquid on the substrate cannot be reliably removed.

On the other hand, in a developing unit for a color filter, when a developing solution is applied, an inner cup is arranged around the substrate, and the processed developing solution is drained downward inside the inner cup. Collected at the outlet. However, when the rinsing liquid is discharged, the outer cup is disposed around the substrate, but the rinse liquid after cleaning is not discharged and collected by the outer cup, but the entire developing processing unit is discharged. It is stored and discharged and collected at the bottom of the surrounding sink. Therefore, the rinse liquid cannot be efficiently collected.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a developing apparatus capable of reliably removing a resist remaining on a substrate. Another object of the present invention is to provide a developing apparatus and a developing method capable of efficiently collecting a rinsing liquid.

[0008]

According to a first aspect of the present invention, there is provided a developing apparatus for performing a developing process by applying a developing solution to a substrate after an exposure process. A developing solution supply nozzle for supplying and applying a developing solution to the substrate and performing a developing process on the substrate, and after the developing process of the substrate,
A rinsing liquid jet nozzle for jetting a rinsing liquid onto the substrate at a high pressure; and a rinsing liquid film forming means for forming a rinsing liquid film on the substrate when the rinsing liquid is jetted by the rinsing liquid jet nozzle. Is provided.

As described above, when the rinsing liquid is jetted at a high pressure, a film of the rinsing liquid is formed on the substrate. Therefore, the substrate is damaged by the high-pressure rinsing liquid due to the buffering action of the rinsing liquid film. And the resist remaining on the substrate can be removed without fail. That is, when the rinsing liquid is simply sprayed at a high pressure, the high-pressure rinsing liquid may damage circuit patterns and the like on the substrate.
Since the rinsing liquid is sprayed while forming the rinsing liquid film on the substrate, if the rinsing liquid pressure and the thickness of the rinsing liquid film are adjusted, the rinsing liquid remains on the substrate without damaging the substrate. The resist thus removed can be reliably removed.

In this case, the rinsing liquid film forming means is arranged to surround the side of the rinsing liquid injection nozzle and to have a predetermined gap between the rinsing liquid injection nozzle and the substrate. A cover for forming a film of the rinsing liquid on the substrate while temporarily storing the film.

As described above, when the rinsing liquid is injected at a high pressure, the rinsing liquid is temporarily stored by the cover surrounding the rinsing liquid injection nozzle and disposed with a predetermined gap between the rinsing liquid and the substrate. Since the rinsing liquid film is formed on the substrate, the resist remaining on the substrate can be reliably removed while avoiding damage to the substrate due to the high-pressure rinsing liquid due to the buffer action of the rinsing liquid film. Further, since the cover for forming the rinse liquid film is arranged with a predetermined gap between the substrate and the substrate, the thickness of the rinse liquid film can be easily adjusted by adjusting the gap. By adjusting the thickness of the rinsing liquid film and the pressure of the rinsing liquid, cleaning can be optimized while preventing damage to the substrate.

Further, by bubbling the rinse liquid film formed on the substrate by the rinse liquid film forming means by the bubbling means, the resist remaining on the substrate can be more reliably removed. In this case, the bubbling means may be a means for jetting nitrogen gas into the film of the rinsing liquid.

According to a second aspect of the present invention, there is provided a developing apparatus for applying a developing solution to a substrate after an exposure process and performing a developing process. A developing solution supply nozzle for performing the developing process, an inner cup surrounding the periphery of the substrate when applying the developing solution, and a developing solution flowing downward through the inner side of the inner cup when applying the developing solution. A developing solution tray for storing and discharging the liquid, and a rinse liquid discharge nozzle for discharging the rinse liquid to the substrate after the development processing of the substrate, and at the time of discharging the rinse liquid, outside the inner cup, An outer cup surrounding the periphery of the substrate, and a rinsing liquid for storing and discharging the rinsing liquid that has flowed downward between the outer side of the inner cup and the inner side of the outer cup when discharging the rinsing liquid. Having a saucer Developing apparatus is provided to symptoms.

As described above, the processed developer flows downward through the inner side of the inner cup, and is stored and discharged / recovered by the developer tray, while the rinse solution after washing is removed from the inner cup. Is flowed downward through the space between the outside and the inside of the outer cup, and is stored and discharged / recovered by the rinsing liquid tray, so that the developer and the rinsing liquid can be separated and recovered, and the rinsing liquid can be removed. It can be collected efficiently.

Further, the developing solution tray is preferably disposed so as to cover the bottom of the inner cup and is inclined so as to collect the developing solution. The rinsing solution tray covers the bottom of the outer cup. It is preferable to be arranged in such a manner as to be inclined so as to collect the rinsing liquid.

According to a third aspect of the present invention, a step of developing the substrate, a step of rotating the substrate at a first speed while discharging a rinsing liquid onto the substrate, and Accelerate to the second speed faster than the speed of
Depressing the substrate at a third speed while injecting a high-pressure rinsing liquid onto the substrate while rotating the substrate at the third speed, and scanning the substrate with the high-pressure rinsing liquid. A fourth speed higher than the first and third speeds;
A step of performing normal rinsing while accelerating to a speed of 4 and rotating the substrate at the fourth speed, and a process of drying the substrate by rotating the substrate at a fifth speed higher than the fourth speed. Is provided.

As described above, the developing process, the high-pressure rinsing performed while rotating the substrate at a low speed, the normal rinsing performed while rotating at a high speed, and the drying by rotating the substrate at an ultra-high speed are sequentially performed. The remaining resist can be reliably removed. Further, bubbles and the like generated by high-pressure rinsing can be removed by ordinary rinsing performed while rotating the substrate at high speed.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a system for applying and developing a color filter of an LCD to which the present invention is applied.

This coating / developing processing system includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and developing on the substrates G. A processing unit 2 and an interface unit 3 for transferring a substrate G between the exposure unit (not shown) and a cassette station 1 and an interface unit 3 at both ends of the processing unit 2. Are located.

The cassette station 1 has a transport mechanism 1 for transporting the substrate G between the cassette C and the processing section 2.
0 is provided. Then, the cassette C is loaded and unloaded at the cassette station 1. Also, the transport mechanism 1
0 is a transport path 10 provided along the cassette arrangement direction.
A transfer arm 11 is provided which is movable on the substrate a. The transfer arm 11 transfers the substrate G between the cassette C and the processing unit 2.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
2, 13 and 14, and each processing unit is disposed on both sides of these transport paths. And between these, the relay parts 15 and 16 are provided.

The front section 2a includes a main transfer device 17 movable along the transfer path 12. On one side of the transfer path 12, two cleaning units (SCRs) 21a and 21b are arranged. , A cooling unit (COL) 25, a heat treatment unit (HP) 26 and a cooling unit (COL)
7 are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13. On one side of the transfer path 13, a resist coating unit (CT) for coating a color resist is provided. ) 22 and an edge remover (ER) 23 for removing the color resist on the periphery of the substrate G
Is provided on the other side of the transport path 13, a heat treatment unit (HP) 28 having a two-stage stack, and a heat treatment / cooling unit (HP) having a heat treatment unit and a cooling unit / COL) 29 and a cooling unit (COL) 30.

Further, a resist coating unit (C
T) 22 and an edge remover (ER) 23,
A drying processing unit (VD) 40 is provided. Thus, the substrate G on which the color resist is applied is transported to the drying processing unit (VD) 40 to be dried, and thereafter, the edge is removed by the edge remover (ER) 23.

Further, the rear section 2c is provided with a main transport device 19 movable along the transport path 14,
On one side, three development processing units 24a, 24
b and 24c are arranged, and on the other side of the transport path 14, a heat treatment unit 31 that is stacked in two layers vertically and two heat treatment units that are stacked vertically in a heat treatment unit and a cooling unit. Cooling unit (HP / CO
L) 32, 33 are arranged.

The processing section 2 includes a cleaning processing unit 21a and a resist processing unit 2 on one side of the transport path.
2. Only a spinner unit such as the development processing unit 24a is arranged, and only a heat processing unit such as a heating processing unit or a cooling processing unit is arranged on the other side.

Further, a chemical solution supply unit 34 is arranged in a portion of the relay units 15 and 16 on the side where the spinner system unit is arranged, and a space 35 for maintenance is provided.

The main transfer device 17 transfers the substrate G to and from the arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from the respective processing units in the front section 2 a. It has a function of transferring the substrate G between the two. Further, the main transfer device 18 is connected to the relay unit 1.
5 and transfer the substrate G to the middle section 2
b has a function of loading / unloading the substrate G to / from each processing unit and transferring the substrate G to / from the relay unit 16. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, and loads and unloads the substrate G to and from each processing unit in the subsequent unit 2 c, and transfers the substrate G to and from the interface unit 3. Has the function of performing Note that the relay sections 15 and 16 also function as cooling plates.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a substrate G between these and an exposure apparatus (not shown)
And a transport mechanism 38 for carrying in and out the wafer. The transport mechanism 38 includes the extension 36 and the buffer stage 3
The transfer arm 39 is provided along the transfer path 38a provided along the arrangement direction of the transfer unit 7 and the transfer arm 39 transfers the substrate G between the processing unit 2 and the exposure apparatus. By consolidating and integrating the processing units in this manner, space saving and processing efficiency can be achieved.

In the coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing section 2, where the cleaning unit (SCR) 21a, The scrubber is washed at 21 b, and is heated and dried at one of the heat treatment units (HP) 26, and then cooled at one of the cooling units (COL) 27.

Thereafter, the substrate G is transported to the middle section 2b,
A predetermined color resist is applied by a resist coating unit (CT) 22, dried by a drying unit 40, and an extra color resist on the periphery of the substrate G is removed by an edge remover (ER) 23. Then, the substrate G
Is prebaked in one of the heat treatment units (HP) in the middle section 2b, and is cooled in the lower cooling unit (COL) of the unit 29 or 30.

Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And
The substrate G is carried in again via the interface unit 3,
The image is developed by any of the development processing units (DEV) 24a, 24b, and 24c. The developed substrate G is
After the post-baking process is performed in any one of the heat processing units (HP) in the rear section 2c, the cooling unit (CO
Cooled in L).

Such a series of processing for each color is executed according to a preset recipe. For example, the substrate G that has been subjected to the red coating, exposure, and development processing is sequentially subjected to green, blue, and black coating, exposure, and development processing. As described below, the coating processing unit (CT) 22
, Each color is processed in substantially the same manner except that nozzles of different colors are used. The completed color filter substrate is transferred to the main transfer devices 19, 18, 17 and the transfer mechanism 10
Is stored in a predetermined cassette on the cassette station 1.

Next, referring to FIG. 2 to FIG. 4, the developing units (DEV) 24a, 24
4b and 24c will be described. 2 is a plan view of the developing unit (DEV) according to the present embodiment, FIG. 3 is a cross-sectional view thereof, and FIG. 4 is a rinse attached to the developing unit (DEV) shown in FIGS. FIG. 5 is a cross-sectional view of the liquid jet nozzle, and FIG. 5 is a perspective view showing the nozzle of FIG.

As shown in FIGS. 2 and 3, the developing units (DEV) 24a, 24b and 24c are provided with a horizontally rotatable spin chuck 41 for holding the substrate G by suction. A cylindrical inner cup 42 surrounding the substrate G thus provided is provided, and a cylindrical outer cup 43 is provided so as to surround the outer periphery of the inner cup 42. A sink 52 that covers the entirety is provided outside the outer cup 43.

On one side of the outer cup 43, there is provided a developing solution nozzle arm 44. Below the developing solution nozzle arm 44, a developing solution having a plurality of discharge ports 53a for discharging the developing solution is provided. A supply nozzle 53 is provided. The nozzle arm 44 is configured to move across the substrate G along a guide rail 45 by a drive mechanism (not shown) such as a belt drive, so that when the developer is applied, the nozzle arm 44 The developer supply nozzle 53 stops at the center of the substrate G and is rotating on the substrate G.
The developing solution is discharged from a plurality of developing solution discharge ports 53a provided on the lower surface of the developing device.

On the other side of the outer cup 43, a high-pressure rinsing liquid nozzle arm 46 for moving a nozzle for injecting a rinsing liquid such as pure water at a high pressure is provided. Under the nozzle arm 46, as shown in FIGS. 4 and 5, a rinsing liquid injection nozzle 4 for injecting a rinsing liquid at a high pressure.
7 are provided. This rinsing liquid injection nozzle 47 is
Nozzle head 48a extending along the width direction of substrate G
And a plurality of injection units 48b provided below the nozzle head 48a. And from the injection part 48b,
At a high pressure equal to or higher than a predetermined pressure (for example, 15 kg / cm2),
The rinsing liquid is injected at a predetermined flow rate (for example, 15 l / min). Thus, as described later, even if an excess resist remaining after reacting with the developing solution remains on the substrate G after the developing process is completed, it can be removed by the rinsing solution sprayed at a high pressure.

The nozzle arm 46 for the high-pressure rinsing liquid, like the nozzle arm 44 for the developer, is moved along the guide rail 45 by a driving mechanism such as a belt drive (not shown).
The nozzle arm 46 is configured to move over the stationary substrate G in a state where the rinsing liquid is jetted at a high pressure from the jetting part 48b of the rinsing liquid jetting nozzle 47 when the rinsing liquid is jetted. It is designed to scan.

A rinsing liquid pipe 49 extending upward is connected to the upper portion on both ends of the nozzle head 48a.
The rinsing liquid is supplied to the nozzle head 48a through the pipe 49, and the nozzle arm 46
And the nozzle head 48a are connected.

As shown in FIGS. 4 and 5, a rinsing liquid injection nozzle 47 for injecting a rinsing liquid at a high pressure has side walls 50a and upper walls 50 so as to cover the sides and the upper side thereof.
A box-shaped cover 50 having the letter “b” is provided.
A predetermined gap d (for example, 2 to 5 mm) is formed between the lower end of the cover 50 and the substrate G.

Since such a cover 50 is provided, the substrate G is ejected from the ejection section 48b of the rinse liquid ejection nozzle 47.
When the rinsing liquid is jetted at a high pressure toward the substrate G, a film of the rinsing liquid can be formed on the substrate G while temporarily storing the rinsing liquid. As will be described later, the film of the rinsing liquid has a buffering effect on the injected rinsing liquid, and can prevent damage to the circuit pattern and the like of the substrate G.

A rinsing liquid discharge nozzle (not shown) for discharging a rinsing liquid such as pure water at a relatively low pressure is provided between the high pressure rinsing liquid nozzle arm 46 and the outer cup 43.
The nozzle arm 51 for the low-pressure rinsing liquid having at the tip thereof is provided rotatably around the pivot 51a. The rinsing liquid discharge nozzle at the tip of the nozzle arm 51 plays a role of, for example, rinsing the rinsing liquid at a high pressure by the rinsing liquid injection nozzle 47 and then discharging the rinsing liquid at a relatively low pressure to finish the cleaning. When discharging the rinsing liquid, the nozzle arm 51 rotates around the pivot 51a to position the rinsing liquid discharging nozzle at the center of the substrate G, and the rinsing liquid discharging nozzle rinses the rotating substrate G from the rinsing liquid discharging nozzle. The liquid is discharged.

As shown in FIG. 3, the inner cup 42 and the outer cup 43 are connected by a connecting member 60, and can be moved up and down integrally by a lifting mechanism (not shown). The upper end of each of the inner cup 42 and the outer cup 43 is inclined inward, so that the developer or the rinsing liquid can be prevented from scattering to the outside. The upper end of the inner cup 42 having the smallest opening diameter has a size that can be inserted in a state where the substrate G is horizontal. The upper end position of the outer cup 43 is higher than the upper end position of the inner cup 42. By adjusting the rotation of the spin chuck 41, it is possible to separate and collect the developer and the rinsing liquid as described later. ing.

Below the inner cup 42, a developer tray 55 for storing and discharging the developer flowing downward through the inner wall or the inside of the inner cup 42 when the developer is applied and shaken off. , Is provided so as to cover the bottom of the inner cup 42, and the receiving tray 55 is provided with a discharge port 56. A discharge pipe 56a is connected to the discharge port 56. Further, the developing solution tray 55 is inclined so as to collect the developing solution at the discharge port 56.

Under the outer cup 43, the rinsing liquid that has flowed downward through the inner wall of the outer cup 43 or between the outer cup 43 and the inner cup 42 when the rinsing liquid is discharged and shaken off is stored. A rinsing liquid tray 57 to be discharged is provided so as to cover the bottom of the outer cup 43.
8 are provided. A discharge pipe 58 is provided at the discharge port 58.
a are connected. The rinsing liquid tray 57 is
It is inclined to collect the rinsing liquid at the outlet 58.
The bottom of the sink 52 is provided with a discharge port 59 for discharging the developer and the rinsing liquid stored in the bottom.

Next, the developing operation in the developing units (DEV) 24a, 24b and 24c configured as described above will be described. As shown in FIG. 1, the substrate G subjected to the exposure processing is carried into one of the development processing units (DEV) 24a, 24b, and 24c by the main transfer device 19. Development processing units (DEV) 24a, 24
b and 24c, as shown in FIG.
Is sucked and held by the spin chuck 41. The nozzle arm 44 for the developing solution moves and stops at the center of the substrate G along the guide rail 45, and is provided on the lower surface of a developing solution supply nozzle (not shown) while the substrate G is rotated by the spin chuck 41. The developing solution is discharged from the plurality of discharge ports and applied to the entire surface of the substrate G, and the developing process proceeds.

Thereafter, the substrate G is rotated by the spin chuck 41 to shake off the developing solution. At this time, the inner cup 42 and the outer cup 43 are arranged at the raised positions shown in FIG.
For example, 1 to 3 sec at a relatively low speed of 50 to 150 rpm
Rotated. Accordingly, the shaken-out developer passes through the inner wall of the inner cup 42 or the inside thereof, reaches the developer receiver 55, and is collected from the outlet 56 through the discharge pipe 56a separately from the rinse liquid. Note that the developing solution scattered from the substrate G during the developing process also reaches the tray 55 through the inside of the inner cup 42.

Next, the nozzle arm 46 for the high-pressure rinsing liquid
Makes the rinsing liquid jet at a high pressure from the jetting part 48b of the rinsing liquid jetting nozzle 47 provided thereunder while scanning on the substrate G which is stationary along the guide rail 45.
When the rinsing liquid is ejected in this manner, the inner cup 42 and the outer cup 43 are arranged at the lowered position.

When the rinsing liquid is jetted from the jetting section 48b toward the substrate G at a high pressure, since the above-mentioned cover 50 is provided, the film of the rinsing liquid is deposited on the substrate G while temporarily storing the rinsing liquid. After that, the rinsing liquid can flow out onto the substrate G through the gap. At the start of the scan of the nozzle arm 46, there is a possibility that the film of the rinsing liquid may not be formed, but the outer peripheral portion of the substrate G from which the scan is started is a portion that does not become a product, and after a certain period of time after the start of the scan, Since the film of the rinsing liquid is sufficiently formed, there is substantially no adverse effect on a portion of the substrate G which will be a product.

As described above, the rinsing liquid is sprayed at a predetermined pressure (for example, 15 kg / cm 2) by the rinsing liquid injection nozzle 47.
At the above pressure and at a predetermined flow rate (for example, 15 l / mi)
Since the rinsing liquid is sprayed in n), the developing process is completed, and after the reaction between the developing solution and the resist is completed, the substrate G
Even if the reacted resist remains on the substrate G, the remaining resist can be reliably removed by the rinsing liquid sprayed at a high pressure, and when the rinsing liquid is sprayed at a high pressure, the cover 50 covers the substrate G. Since the rinsing liquid film is formed on the substrate G, damage to the substrate G such as damage to the circuit pattern can be avoided by the buffering action.

Since the cover 50 for forming a film of the rinsing liquid is disposed with a predetermined gap d formed between the cover 50 and the substrate G, the gap d may be, for example, 2 to 5 mm.
The thickness of the film of the rinsing liquid can be easily adjusted by adjusting the distance between the two. Therefore, the thickness of the rinse liquid film and the pressure of the rinse liquid can be adjusted to optimize the cleaning while preventing damage to the substrate G.

After rinsing the substrate G in this manner, the spin chuck 41 is rotated at a high speed, and the rinsing liquid remaining on the substrate G is shaken off. At this time, as described above, the inner cup 42 and the outer cup 43
Is disposed at a position where the developer is lowered, and the spin chuck 41 is rotated at a higher rotation speed than when the developer is shaken off, for example, 100 to
Rotated for 18 seconds at 200 rpm, inner cup 4
It passes through the inner wall of the outer cup 43 or the inner cup 42 at a position higher than 2 to reach the rinse liquid tray 57, and is collected separately from the developer through the discharge port 58 and the discharge pipe 58a. Note that the rinsing liquid scattered from the substrate G when the rinsing liquid is supplied also reaches the receiving tray 57 through the space between the outer cup 43 and the inner cup 42.

Thereafter, if necessary, the nozzle arm 51
Is rotated about a pivot 51a, and a rinsing liquid discharge nozzle (not shown) is positioned at the center of the substrate G, and the rotating substrate G is rotated.
The rinsing liquid is discharged at a low pressure. This completes the cleaning after the high-pressure cleaning. Next, the substrate G is rotated at a high speed by the spin chuck 41 and shaken off and dried, whereby a series of development processing ends. At the time of shaking off, it is collected separately from the developer via the receiving tray 57 in the same manner as in the case of high-pressure rinsing.

As described above, the outer cup 43 is connected to the inner cup 42 at a height higher than that of the inner cup 42, and when the developer is collected, the inner cup 42 and the outer cup 43 are raised. At the same time, since the rotation speed of the spin chuck 41 is relatively low,
The developing solution passes through the inner wall and the inner side of the inner cup 42 and reaches the developing solution tray 55. On the other hand, when the rinsing liquid is collected, the inner cup 42 and the outer cup 43 are collected.
Is lowered, and the spin chuck 41 is operated at a relatively high speed.
Through the inner wall and the inside to the rinsing liquid receiving tray 57. Then, the developer is recovered from the tray 55 through the discharge port 56 and the discharge pipe 56a, and the rinse liquid is collected in the tray 57.
From the discharge port 58 and the discharge pipe 58a.

Therefore, the developer and the rinsing liquid can be efficiently separated, and the rinsing liquid is collected not through the sink 52 but through the tray 57, so that the rinsing liquid can be collected with high efficiency. Further, since the trays 55 and 57 are provided to be inclined toward the discharge ports 56 and 58, respectively, the developer and the rinsing liquid can be quickly collected.

Incidentally, in the above-described embodiment,
Although the gap d between the cover 50 and the substrate G has been described as being set to, for example, 2 to 5 mm, a more appropriate value of the gap d and high-pressure rinsing conditions will be discussed below. FIG. 6 is a graph showing the relationship between the transmittance and the wavelength of a glass substrate that has been rinsed after development under the high-pressure rinse setting conditions shown in Table 1.
The rinsing liquid has a high rinsing effect for removing the resist remaining on the substrate, and when the developing process is performed well, the residue of the resist decreases and the transmittance of the substrate increases. In the graph of FIG.
And are the sample Nos. Of the high-pressure rinse setting conditions shown in Table 1. ,,, And, respectively. In the high-pressure rinsing, a cover having a lower surface dimension (inner dimension of a plane parallel to the substrate) of 40 (mm) × 400 (mm) was used.

[0057]

[Table 1]

As shown in FIG.
Under high pressure rinsing conditions of and
m has achieved a transmittance of 99% or more in the entire region,
The rinsing effect is high, and the development processing is performed extremely well. As shown in Table 1, the sample No. Is a condition in which the gap d is 3 mm, the flow rate is 11.0 (l / min), and the number of scans is 2 (reciprocation). Is a condition in which the gap d is 5 mm, the flow rate is 11.0 (l / min), and the number of scans is one.

The sample No. was set under the same conditions except for the number of scans. When the results of Sample No. and Sample No. with a large number of scans are compared. Has a higher transmittance. This result indicates that the greater the number of scans, the higher the rinsing effect. Further, the sample No. under the same conditions except for the gap d. When the results are compared, the same transmittance is obtained at a wavelength shorter than 570 nm.
Sample no. Has a higher transmittance. This result indicates that the rinsing effect is higher under the condition that the gap d is large. However, if the gap d exceeds 5 mm, it is difficult to form a rinse liquid film in the cover, which is not preferable.

In view of the above-described conditions for setting the high-pressure rinse and the relationship between the obtained transmittance and wavelength, the gap d: 3
(Mm), flow rate: 11 (l / min), number of scans: 2
It is practical to set the number of times (round trip) and the scanning speed to 500 (mm / s). By setting the gap d and the flow rate as described above, the rinsing liquid is effectively retained on the substrate,
A good rinsing effect can be obtained.

In order to improve the rinsing effect, it is effective to use a nitrogen bubbling method in which nitrogen is jetted into a rinsing liquid retained on a substrate during high-pressure rinsing to form bubbles. Hereinafter, a configuration for performing the nitrogen bubbling method and an operation thereof will be described. FIG. 7 is a sectional view of a cover 50 provided with pipes 61a, 61b and 61c as nitrogen bubbling means for performing the nitrogen bubbling method. FIG. 8 is a sectional view of the pipes 61a, 61b and 61c in the cover 50. FIG. 3 is a perspective view schematically showing a position of the hologram.

The pipes 61a, 61b, 61c are attached to the inside of the cover 50 at the front side in the scanning direction and at the lower part on both sides. These pipes 61a, 61b, 6
1c is provided with a large number of small holes 63,
A nitrogen gas supply means (not shown) is connected, and the small holes 63 are supplied by supplying nitrogen gas from the nitrogen gas supply means.
Nitrogen gas can be spouted from the nozzle.

Next, as described above, the pipes 61a and 61
The operation of performing high-pressure rinsing by the nitrogen bubbling method using the cover 50 in which b and 61c are arranged will be described. In the high-pressure rinsing by the nitrogen bubbling method, the rinsing liquid is jetted at a high pressure from the jetting part 48b of the rinsing liquid jet nozzle 47, and the pipes 61a, 61b, 61c
Nitrogen gas is ejected from the small holes 63 of the
The resist remaining on the substrate is removed while bubbling a film of a rinsing liquid formed at the lower portion inside the substrate. By performing high-pressure rinsing while bubbling the rinsing liquid, the rinsing effect can be further improved.

The pipe 6 as nitrogen bubbling means
The direction in which nitrogen gas is ejected from 1a, 61b, 61c is best on the front side in the scanning direction, but the direction in which gas is ejected along the length direction of the rinsing liquid ejection nozzle 47 may be changed. When changing the gas jetting direction, if both ends are directed downward and the center is directed upward, the rinsing liquid is mainly foamed at both ends where the rinsing liquid has a low rinsing effect due to the low pressure of the rinsing liquid. This is preferable because the rinsing effect can be compensated. Further, the amount of gas jetted along the length direction of the rinsing liquid jet nozzle 47 may be changed. When changing the gas ejection amount, it is preferable to increase the ejection amount at both ends because the rinsing effect at both ends can be compensated for as described above.

Since the resist tends to remain at both ends of the rinsing liquid injection nozzle 47 in the lateral direction due to the rinsing liquid injection direction, the end pipe 61 is used as nitrogen bubbling means.
Only the b and 61c may be provided to reinforce the rinsing effect at both lateral ends.

Next, another example of the developing operation in the developing units (DEV) 24a, 24b, 24c configured as described above will be described focusing on the supply of the rinsing liquid and the rotation speed of the substrate G. FIG. 9 is a diagram showing the rotation speed of the substrate G in this developing operation over time. In the cleaning after development, first, as shown in FIG.
The substrate is rotated at a speed of 50 to 100 rpm while the rinse liquid is discharged from the rinse liquid discharge nozzle onto the substrate. Next, once the rotation speed of the substrate is increased to 500 rpm, the speed is again reduced to 50 to 100 rpm, and scanning by high-pressure rinsing is performed while rotating the substrate at this speed. After that, the rotation speed of the substrate is accelerated to 200 rpm, a normal rinsing is performed while rotating the substrate at this speed, bubbles and the like generated by high-pressure rinsing are removed, and the substrate is rotated at a high speed of 2,000 rpm. dry.

As described above, the rinsing liquid is obtained by sequentially performing the development processing, the high-pressure rinsing performed while rotating the substrate at a low speed, the normal rinsing performed while rotating at a high speed, and the drying by rotating the substrate at an ultra-high speed. As a result, the resist remaining on the substrate can be reliably removed, and the substrate can be processed in a favorable state.

It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above-described embodiment, a coating / developing processing system for a color filter has been described. However, the present invention is not limited to this, and can be applied to a coating / developing processing system for another substrate such as an LCD substrate. Further, although a box-shaped cover is used to form the rinse liquid film, the present invention is not limited to this, and any mechanism may be used as long as the rinse liquid film is formed.

[0069]

As described above, according to the present invention,
When the rinsing liquid is injected at a high pressure, a rinse liquid film is formed on the substrate, so that the resist remaining on the substrate while avoiding damage to the substrate due to the high-pressure rinsing liquid due to the buffering action of the rinse liquid film. Can be reliably removed. That is, since the rinsing liquid is sprayed while forming the rinsing liquid film on the substrate, the pressure of the rinsing liquid to be sprayed and the thickness of the rinsing liquid film can be adjusted without damaging the substrate. The remaining resist can be reliably removed.

Further, the rinsing liquid film forming means surrounds the rinsing liquid injection nozzle and is disposed at a predetermined gap from the substrate, and temporarily stores the rinsing liquid injected from the rinsing liquid injection nozzle. When the rinsing liquid is sprayed at a high pressure by providing a cover for forming the rinsing liquid film on the substrate while the rinsing liquid is temporarily stored, the rinsing liquid film is temporarily stored on the substrate by the cover. Therefore, the resist remaining on the substrate can be reliably removed while avoiding damage to the substrate due to the high-pressure rinsing solution by the buffer action of the rinsing solution film. Moreover,
By adjusting the gap, the thickness of the rinse liquid film can be easily adjusted, and the thickness of the rinse liquid film and the pressure of the rinse liquid can be adjusted to prevent damage to the substrate while preventing damage to the substrate. Optimization can be achieved.

Further, according to another configuration of the present invention, the processed developer is caused to flow downward through the inner side of the inner cup, and is stored and discharged / recovered by the developer tray, while being washed. The subsequent rinse liquid flows downward between the outer side of the inner cup and the inner side of the outer cup, and is stored and discharged / recovered by the rinse liquid tray, so that the developer and the rinse liquid are separated and recovered. Rinsing solution can be efficiently collected.

[Brief description of the drawings]

FIG. 1 is a plan view showing a system for applying and developing a color filter of an LCD to which the present invention is applied.

FIG. 2 is a development processing unit (DE) according to the embodiment;
FIG.

FIG. 3 is a development processing unit (DE) according to the embodiment;
Sectional drawing which shows V).

4 is a development processing unit (DE shown in FIGS. 2 and 3);
Sectional drawing which shows the rinse liquid injection nozzle attached to V).

FIG. 5 is a development processing unit (DE shown in FIGS. 2 and 3);
FIG. 5 is a partially cutaway perspective view showing the rinse liquid injection nozzle attached to V).

FIG. 6 is a graph showing the relationship between the transmittance and the wavelength of a glass substrate rinsed after development under each high-pressure rinse setting condition.

FIG. 7 is a cross-sectional view of a cover provided with nitrogen bubbling means.

FIG. 8 shows pipes 61a, 61b, 61 in a cover.
The perspective view which showed roughly the position of c.

FIG. 9 is a diagram showing a change in the rotation speed of the substrate G in another example of the developing processing operation.

[Explanation of symbols]

 24a, 24b, 24c; development processing unit 41; spin chuck 42; inner cup 43; outer cup 44; nozzle arm 45 for developing solution; guide rail 46; nozzle arm 47 for high-pressure rinsing solution 47; Head 48b; Injection unit 50; Cover (rinse liquid film forming means) 51; Low pressure rinsing nozzle arm 52; Sink 55; Developing solution tray 56; Outlet 57;

Claims (15)

[Claims] 1. A developing apparatus for applying a developing solution to a substrate after an exposure process and performing a developing process, comprising supplying a developing solution to the substrate, applying the developing solution to the substrate and performing a developing process on the substrate. A nozzle, a rinsing liquid jet nozzle for jetting a rinsing liquid to the substrate at a high pressure after the substrate is developed, and a rinsing liquid film for forming a rinsing liquid film on the substrate when the rinsing liquid is jetted by the rinsing liquid jet nozzle And a forming means. 2. The rinsing liquid film forming means surrounds a side of the rinsing liquid injection nozzle and is arranged with a predetermined gap between the rinsing liquid injection nozzle and a substrate. A cover for forming a film of a rinsing liquid on the substrate while storing the film on the substrate.
3. The developing apparatus according to claim 1. 3. The predetermined gap between the cover and the substrate is set so that a film of a rinsing liquid can be formed on the substrate and a pressure of the rinsing liquid can be maintained at a predetermined level or more. 3. The development processing apparatus according to 2. 4. The method according to claim 1, wherein the rinsing liquid ejecting nozzle is moved over a substrate that is stationary or is rotating at a low speed in a state where the rinsing liquid is ejected.
The development processing device according to any one of the above. 5. The developing apparatus according to claim 4, wherein the rinsing liquid injection nozzle is moved so as to cross over the substrate. 6. A rinsing liquid discharge nozzle for discharging a rinsing liquid to a substrate at a predetermined pressure or less after the rinsing liquid is injected by the rinsing liquid injection nozzle. 2. The development processing apparatus according to claim 1. 7. The apparatus according to claim 1, further comprising a cylindrical inner cup surrounding the substrate, and a cylindrical outer cup surrounding the outer periphery of the inner cup. The development processing apparatus according to the above. 8. A developing solution nozzle arm provided above the outer cup, and a developing solution supply nozzle provided below the developing solution nozzle arm and having a plurality of discharge ports for discharging the developing solution. The developing device according to claim 7, wherein: 9. The inner cup and the outer cup are integrally liftable, and have upper ends that are inclined inward to prevent the developer or rinse liquid from scattering outside. The developing device according to claim 7, wherein: 10. The rinsing liquid injection nozzle has a nozzle head extending along the width direction of the substrate G, and a plurality of injection units provided below the nozzle head. 10. The development processing apparatus according to any one of 1 to 9. 11. The development processing apparatus according to claim 1, wherein the rinsing liquid injection nozzle includes a nitrogen bubbling unit for bubbling a film of the rinsing liquid. 12. The development processing apparatus according to claim 11, wherein said nitrogen bubbling means is constituted by means for ejecting nitrogen gas into said rinsing liquid film. 13. A developing apparatus for applying a developing solution to a substrate after an exposure process and performing a developing process, wherein the developing solution is supplied to the substrate by supplying the developing solution and applying the developing solution to the substrate. A nozzle, an inner cup surrounding the periphery of the substrate when applying the developing solution, and an inner cup for storing and discharging the developing solution flowing downward through the inner side of the inner cup when applying the developing solution. A developing solution receiving tray, a rinsing liquid discharging nozzle for discharging a rinsing liquid to the substrate after the substrate is developed, and an outer cup surrounding the substrate outside the inner cup when discharging the rinsing liquid. When discharging the rinsing liquid, a rinsing liquid tray for storing and discharging the rinsing liquid flowing downward through between the outside of the inner cup and the inside of the outer cup is provided. Developing processing equipment . 14. The developing solution tray is disposed so as to cover the bottom of the inner cup, and is inclined to collect the developing solution. The rinsing solution tray is disposed to cover the bottom of the outer cup. 14. The developing apparatus according to claim 13, wherein the developing apparatus is inclined so as to collect a rinsing liquid. 15. A step of developing the substrate, a step of rotating the substrate at a first speed while discharging a rinsing liquid onto the substrate, and changing the rotation speed of the substrate to a second speed higher than the first speed. Once accelerating and then decelerating to a third speed; and rotating the substrate at the third speed while injecting a high-pressure rinsing liquid onto the substrate while scanning the high-pressure rinsing liquid on the substrate. Accelerating the rotation speed of the substrate to a fourth speed higher than the first and third speeds, and performing a normal rinsing while rotating the substrate at the fourth speed; Rotate at a fifth speed higher than the speed,
Drying the substrate.