JP2000202762A5 - - Google Patents
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- Publication number
- JP2000202762A5 JP2000202762A5 JP2000000117A JP2000000117A JP2000202762A5 JP 2000202762 A5 JP2000202762 A5 JP 2000202762A5 JP 2000000117 A JP2000000117 A JP 2000000117A JP 2000000117 A JP2000000117 A JP 2000000117A JP 2000202762 A5 JP2000202762 A5 JP 2000202762A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11418298P | 1998-12-30 | 1998-12-30 | |
| US60/114182 | 1998-12-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000202762A JP2000202762A (ja) | 2000-07-25 |
| JP2000202762A5 true JP2000202762A5 (ja) | 2007-02-22 |
| JP4519972B2 JP4519972B2 (ja) | 2010-08-04 |
Family
ID=22353793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000000117A Expired - Fee Related JP4519972B2 (ja) | 1998-12-30 | 2000-01-04 | 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4519972B2 (ja) |
| KR (1) | KR100636455B1 (ja) |
| SG (1) | SG82058A1 (ja) |
| TW (1) | TW434111B (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| KR100423909B1 (ko) * | 2000-11-23 | 2004-03-24 | 삼성전자주식회사 | 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법 |
| KR100492330B1 (ko) * | 2002-10-30 | 2005-05-27 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
| JP3889744B2 (ja) | 2003-12-05 | 2007-03-07 | 株式会社東芝 | 研磨ヘッドおよび研磨装置 |
| US7530153B2 (en) | 2005-09-21 | 2009-05-12 | Applied Materials, Inc. | Attaching components of a carrier head |
| KR100840013B1 (ko) * | 2006-12-28 | 2008-06-20 | 주식회사 실트론 | 균일 압력 연마헤드 |
| JP5236705B2 (ja) * | 2010-09-08 | 2013-07-17 | 株式会社荏原製作所 | 研磨装置 |
| US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| KR102091418B1 (ko) * | 2018-06-01 | 2020-04-23 | 주식회사 케이씨텍 | 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인 |
| KR102138700B1 (ko) * | 2019-11-11 | 2020-07-29 | (주)제이씨글로벌 | 화학적 기계적 연마장치용 연마헤드 |
| US11890715B2 (en) * | 2020-06-24 | 2024-02-06 | Applied Materials, Inc. | Polishing carrier head with piezoelectric pressure control |
| JP2024509549A (ja) * | 2021-03-04 | 2024-03-04 | アプライド マテリアルズ インコーポレイテッド | 変動的なエッジ制御を含む研磨キャリアヘッド |
| US20240082983A1 (en) * | 2021-03-17 | 2024-03-14 | Micro Engineering, Inc. | Polishing head, and polishing treatment device |
| US20220410340A1 (en) * | 2021-06-25 | 2022-12-29 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
| CN114166952B (zh) * | 2021-12-08 | 2023-08-29 | 北京晶亦精微科技股份有限公司 | 一种吸附检测装置及吸附检测方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811360B2 (ja) * | 1987-01-19 | 1996-02-07 | 日本電信電話株式会社 | 均一加圧・接着方法 |
| JPH01101386A (ja) * | 1987-10-13 | 1989-04-19 | Mitsubishi Metal Corp | ウェーハの接着方法 |
| JP3233664B2 (ja) * | 1991-09-13 | 2001-11-26 | 土肥 俊郎 | デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置 |
| JPH08267357A (ja) * | 1995-03-31 | 1996-10-15 | Nec Corp | 基板の研磨装置及びその研磨方法 |
| DE69717510T2 (de) * | 1996-01-24 | 2003-10-02 | Lam Res Corp | Halbleiterscheiben-Polierkopf |
| JPH09246218A (ja) * | 1996-03-07 | 1997-09-19 | Hitachi Ltd | 研磨方法および装置 |
| US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
| JPH10277928A (ja) * | 1997-03-31 | 1998-10-20 | Hitachi Ltd | 研磨装置 |
| US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
| US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
| US6277014B1 (en) * | 1998-10-09 | 2001-08-21 | Applied Materials, Inc. | Carrier head with a flexible membrane for chemical mechanical polishing |
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1999
- 1999-12-24 SG SG9906629A patent/SG82058A1/en unknown
- 1999-12-30 KR KR1019990066061A patent/KR100636455B1/ko not_active IP Right Cessation
-
2000
- 2000-01-04 JP JP2000000117A patent/JP4519972B2/ja not_active Expired - Fee Related
- 2000-02-10 TW TW088123154A patent/TW434111B/zh not_active IP Right Cessation