SG82058A1 - Carrier head with controllable pressure and loading area for chemical mechanical polishing - Google Patents

Carrier head with controllable pressure and loading area for chemical mechanical polishing

Info

Publication number
SG82058A1
SG82058A1 SG9906629A SG1999006629A SG82058A1 SG 82058 A1 SG82058 A1 SG 82058A1 SG 9906629 A SG9906629 A SG 9906629A SG 1999006629 A SG1999006629 A SG 1999006629A SG 82058 A1 SG82058 A1 SG 82058A1
Authority
SG
Singapore
Prior art keywords
mechanical polishing
chemical mechanical
loading area
carrier head
controllable pressure
Prior art date
Application number
SG9906629A
Other languages
English (en)
Inventor
M Zuniga Steven
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG82058A1 publication Critical patent/SG82058A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG9906629A 1998-12-30 1999-12-24 Carrier head with controllable pressure and loading area for chemical mechanical polishing SG82058A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11418298P 1998-12-30 1998-12-30

Publications (1)

Publication Number Publication Date
SG82058A1 true SG82058A1 (en) 2001-07-24

Family

ID=22353793

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9906629A SG82058A1 (en) 1998-12-30 1999-12-24 Carrier head with controllable pressure and loading area for chemical mechanical polishing

Country Status (4)

Country Link
JP (1) JP4519972B2 (ja)
KR (1) KR100636455B1 (ja)
SG (1) SG82058A1 (ja)
TW (1) TW434111B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
KR100423909B1 (ko) * 2000-11-23 2004-03-24 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
KR100492330B1 (ko) * 2002-10-30 2005-05-27 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
JP3889744B2 (ja) 2003-12-05 2007-03-07 株式会社東芝 研磨ヘッドおよび研磨装置
US7530153B2 (en) 2005-09-21 2009-05-12 Applied Materials, Inc. Attaching components of a carrier head
KR100840013B1 (ko) * 2006-12-28 2008-06-20 주식회사 실트론 균일 압력 연마헤드
JP5236705B2 (ja) * 2010-09-08 2013-07-17 株式会社荏原製作所 研磨装置
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102091418B1 (ko) * 2018-06-01 2020-04-23 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
KR102138700B1 (ko) * 2019-11-11 2020-07-29 (주)제이씨글로벌 화학적 기계적 연마장치용 연마헤드
KR20220116316A (ko) * 2020-06-24 2022-08-22 어플라이드 머티어리얼스, 인코포레이티드 압전 압력 제어를 갖는 연마 캐리어 헤드
US20220281064A1 (en) * 2021-03-04 2022-09-08 Applied Materials, Inc. Polishing carrier head with floating edge control
CN117083150A (zh) * 2021-03-17 2023-11-17 超微细技研有限公司 抛光头和抛光处理装置
US20220410340A1 (en) * 2021-06-25 2022-12-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN114166952B (zh) * 2021-12-08 2023-08-29 北京晶亦精微科技股份有限公司 一种吸附检测装置及吸附检测方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
WO2000021714A1 (en) * 1998-10-09 2000-04-20 Applied Materials, Inc. A carrier head with a flexible membrane for chemical mechanical polishing
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811360B2 (ja) * 1987-01-19 1996-02-07 日本電信電話株式会社 均一加圧・接着方法
JPH01101386A (ja) * 1987-10-13 1989-04-19 Mitsubishi Metal Corp ウェーハの接着方法
JP3233664B2 (ja) * 1991-09-13 2001-11-26 土肥 俊郎 デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置
JPH08267357A (ja) * 1995-03-31 1996-10-15 Nec Corp 基板の研磨装置及びその研磨方法
JPH09246218A (ja) * 1996-03-07 1997-09-19 Hitachi Ltd 研磨方法および装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
JPH10277928A (ja) * 1997-03-31 1998-10-20 Hitachi Ltd 研磨装置
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
WO2000021714A1 (en) * 1998-10-09 2000-04-20 Applied Materials, Inc. A carrier head with a flexible membrane for chemical mechanical polishing

Also Published As

Publication number Publication date
KR100636455B1 (ko) 2006-10-18
TW434111B (en) 2001-05-16
KR20000048476A (ko) 2000-07-25
JP4519972B2 (ja) 2010-08-04
JP2000202762A (ja) 2000-07-25

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