JP2000165074A - パ―ソナルコンピュ―タ用ｍｐｕの放熱装置 - Google Patents
パ―ソナルコンピュ―タ用ｍｐｕの放熱装置Info
- Publication number
- JP2000165074A JP2000165074A JP2000015543A JP2000015543A JP2000165074A JP 2000165074 A JP2000165074 A JP 2000165074A JP 2000015543 A JP2000015543 A JP 2000015543A JP 2000015543 A JP2000015543 A JP 2000015543A JP 2000165074 A JP2000165074 A JP 2000165074A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- mpu
- storage case
- heat radiating
- personal computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000003860 storage Methods 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000001125 extrusion Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 description 31
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000001816 cooling Methods 0.000 description 7
- 230000000630 rising effect Effects 0.000 description 7
- 229910000639 Spring steel Inorganic materials 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000015543A JP2000165074A (ja) | 2000-01-01 | 2000-01-25 | パ―ソナルコンピュ―タ用ｍｐｕの放熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000015543A JP2000165074A (ja) | 2000-01-01 | 2000-01-25 | パ―ソナルコンピュ―タ用ｍｐｕの放熱装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10305322A Division JP2000133977A (ja) | 1998-10-27 | 1998-10-27 | 電子機器用放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000165074A true JP2000165074A (ja) | 2000-06-16 |
| JP2000165074A5 JP2000165074A5 (enExample) | 2005-11-10 |
Family
ID=18542822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000015543A Pending JP2000165074A (ja) | 2000-01-01 | 2000-01-25 | パ―ソナルコンピュ―タ用ｍｐｕの放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000165074A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130258585A1 (en) * | 2012-04-03 | 2013-10-03 | Google Inc. | Active cooling debris bypass fin pack |
| CN105277036A (zh) * | 2015-10-26 | 2016-01-27 | 重庆盛镁镁业有限公司 | 带盖导流式铝合金散热型材 |
-
2000
- 2000-01-25 JP JP2000015543A patent/JP2000165074A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130258585A1 (en) * | 2012-04-03 | 2013-10-03 | Google Inc. | Active cooling debris bypass fin pack |
| US8699226B2 (en) * | 2012-04-03 | 2014-04-15 | Google Inc. | Active cooling debris bypass fin pack |
| US9454195B2 (en) | 2012-04-03 | 2016-09-27 | Google Inc. | Active cooling debris bypass fin pack |
| US9915986B2 (en) | 2012-04-03 | 2018-03-13 | Google Llc | Active cooling debris bypass fin pack |
| CN105277036A (zh) * | 2015-10-26 | 2016-01-27 | 重庆盛镁镁业有限公司 | 带盖导流式铝合金散热型材 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20050926 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A621 | Written request for application examination |
Effective date: 20050926 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080415 |
|
| A02 | Decision of refusal |
Effective date: 20080812 Free format text: JAPANESE INTERMEDIATE CODE: A02 |