JP2000164144A - Metallic partition wall for image display device and manufacture therefor and image display device using metallic partition wall for image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve luminance of an image display device by laminating plural metallic thin plates having plural through holes, setting a height after lamination to a specific value, and forming an insulating layer on surfaces of the metallic thin plates. SOLUTION: Fine through holes 4 are formed in metallic thin plates 1 of a metallic partition wall 3. The metallic thin plates 1 are laminated so that the height becomes 0.3 to 1.2 mm. The laminating number is desirably 2 to 6 sheets. Since the metallic partition wall 3 is used in a discharge space, the surface is covered with an insulating layer 2. Glass having a softening point not more than 700 deg.C is desirably used as the insulating layer 2. A chamfering part of a radius not less than 3 μm is desirably formed in a corner part 5 of the metallic partition wall 3. A material including C not more than 0.015%, Si not more than 0.25%, Mn not more than 0.60% and Ni of 30 to 55% in wt.% and being composed of a balance of Fe and an unavoidable impurity, is desirably used as the metallic thin plate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a metal partition for an image display device, a method for manufacturing the same, and an image display device using the metal partition for an image display device.

[0002]

2. Description of the Related Art In general, in an image display device having a plurality of discharge cells, an insulating partition wall is required to prevent crosstalk to adjacent cells. In a certain plasma display panel (hereinafter, referred to as PDP), glass partition walls are used by multilayer printing of a glass paste or sandblasting. However, these production methods increase the production cost and limit the range of application. At present, in particular, PDP is not widely used for consumer use.

For the purpose of reducing the manufacturing cost, Japanese Patent Application Laid-Open No. Hei 3-205538 discloses a metal substrate on which a fine display cell is etched, which is coated with an inorganic dielectric to form a metal partition. It is disclosed to be applied to. Japanese Patent Application Laid-Open No. 5-174715 discloses a technique in which the above-mentioned metal partition is applied to a DC PDP. That is, by laminating a metal partition covered with an inorganic dielectric on the auxiliary partition, an auxiliary discharge space different from the display cell is formed on the back surface of the display cell, and when conventional glass is used. This is a PDP manufacturing technique that does not require a complicated structure or complicated steps, has a simple structure, and is easy to manufacture. However, at present, PDPs using the above metal partition walls
Are not put into practical use.

[0004]

As a result of diligent studies by the present inventors, in the above-mentioned Japanese Patent Application Laid-Open No. Hei 3-205538, since the metal partition is formed in a single layer, it is difficult to use it in an image display device such as a PDP. And found that there was a problem of low brightness. This is because the higher the height of the metal partition, the larger the phosphor application area becomes, so that the brightness of the PDP is improved.
Although it tends to be favorable in terms of performance, the thickness of one metal sheet is limited to 0.20 mm due to the restriction of wet etching processing performed to form a fine partition structure on the metal sheet, and a single-layer metal partition is used. In such a case, the luminance cannot be improved.

Further, Japanese Patent Application Laid-Open No. 5-174715 discloses that a finer or more complicated cell can be formed by using a plurality of metal plates on an auxiliary partition.
However, this method, compared to a single piece,
It is said that it is better to change the etching conditions on the front and back surfaces to form complicated barrier ribs because the cost increases. According to the study of the present inventors, JP-A-5-174715 adopts a method in which metal plates forming auxiliary partition walls, partition walls, and the like are stacked one by one on a panel at the time of assembling the panel. Therefore, the number of parts increases, which is not suitable for mass production.

Further, it is extremely difficult to form a complicated shape from the front and back sides under different etching conditions. Further, for example, when a metal partition having a substantially T-shaped cross section is to be produced, the material of the metal partition material is As the thickness increases, the adjustment of the etching factor becomes more difficult. Since the height of the metal partition walls remains as thin as 0.2 mm or less, improvement in luminance cannot be expected. An object of the present invention is to improve the brightness of an inexpensive image display device using a metal partition,
It is an object of the present invention to provide a metal partition for an image display device having a high partition height, a method for manufacturing the same, and an image display device using the metal partition for an image display device.

[0007]

SUMMARY OF THE INVENTION The present invention proposes to solve the above-mentioned problems, and the height of the metal partition, which contributes to the improvement of the brightness of an image display device using the metal partition, can be easily reduced. It is possible to make it higher. That is,
According to the present invention, a plurality of thin metal plates having a plurality of through holes are stacked, the height after stacking is 0.3 to 1.2 mm, and an insulating layer is formed on a surface of the stacked thin metal plates. Metal partition for an image display device. In addition, metal sheet
Six stacked metal partition walls for an image display device, more preferably, the insulating layer is a metal partition wall for an image display device containing glass having a softening point of 700 ° C. or less, and preferably, a stacked metal thin plate Is a metal partition wall for an image display device in which a chamfered portion having a radius of 3 μm or more is formed at a corner portion of the cross section.

Further, the metal sheet of the present invention contains C:
0.015% or less, Si: 0.25% or less, Mn: 0.
60% or less, Ni: 30 to 55%, the balance being Fe
And an inevitable impurity, and a part of Ni may be replaced by 18% or less by weight of Co. Further, the metal sheet is C: 0.015% by weight.
%, Si: 0.25% or less, Mn: 0.60% or less, Cr: 0.30 to 7.0%, Ni: 30 to 55%, with the balance being Fe and unavoidable impurities It may be a metal partition for a display device. The present invention also provides an image display device using the above-described metal partition for an image display device.

[0009] According to the manufacturing method of the present invention, an insulating layer is formed on a surface of a metal sheet having a plurality of through holes, and then a plurality of the metal sheets are laminated and joined at a temperature range of 450 to 700 ° C. This is a method for manufacturing a metal partition wall for an image display device to be made into a metal partition wall. Further, a method of manufacturing a metal partition wall for an image display device, in which a plurality of thin metal plates having a plurality of through holes are laminated and an insulating layer is formed on the plurality of laminated thin metal plates to form a metal partition. good.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below.
First, the greatest feature of the present invention resides in that a plurality of thin metal plates having a plurality of through holes are laminated to form a metal partition. In the present invention, by stacking a plurality of thin metal plates having a large number of through holes, the height of the metal partition walls themselves can be increased, so that the luminance can be improved, and furthermore, the partition walls having a predetermined height can be adjusted. In order to obtain a metal partition having a large thickness by laminating a plurality of metal sheets having a certain thickness or different thicknesses and performing an insulating process, as shown in a known example, when assembling into a panel, There is no need for a step of positioning or laminating, and the productivity can be dramatically improved.

By the way, in order to obtain the brightness of a cathode ray tube which is in a competitive state at present, it is necessary to increase the application area of the phosphor, so that a partition height of at least 0.3 mm or more is required. As an example, FIG. 1 shows a perspective view of a cross section of a metal partition (3) formed by laminating three thin metal plates (1) having through holes (4). In the present invention, for example, a fine through hole (4) as shown in FIG. 3 is formed in the thin metal plate (1). The pattern to be formed is not limited to that shown in FIG. 3, and the shape, size, position, and the like of the through-hole (4) may be intentionally changed.

On the other hand, as described above, the higher the height of the partition walls, the larger the area of application of the phosphor is, so that the brightness of an image display device such as a PDP is improved, and Although it tends to be favorable, if it is too high, the number of laminations increases, and the accuracy of alignment of the partition walls decreases,
Since the application of the phosphor becomes difficult, the upper limit of the height is 1.2 m.
m. In addition, as the preferable number of laminated layers in the present invention, if the layers are excessively laminated, not only the dimensional accuracy of the partition walls is reduced, but also the manufacturing cost is increased. Good to do.

At this time, the metal sheets used for lamination of the present invention may be of the same type or a combination of several types. For example, a design is made so that the thermal expansion coefficient is inclined in the height direction of the partition walls, and metal sheets having different thermal expansion coefficients are laminated, or those having different thicknesses or different shapes of through holes are laminated. Is also good. Specifically, for example, 3
When laminating two metal sheets with high thermal expansion and sandwiching a metal sheet with low thermal expansion, or when changing the size of the through hole in the height direction of the metal partition, and looking at the metal partition in cross section It may be shaped like a taper.

Further, if a metal thin plate capable of increasing the orientation of the (200) crystal plane and etching deep holes is used, it is possible to increase the partition height even with the same number of stacked layers. Furthermore, a thin metal sheet containing Cr, which has good adhesion to glass but is inferior in etching properties, is used for the thin metal sheets disposed on the front and rear plate sides, and a thicker thin metal sheet rich in the above-mentioned etching properties is used between them. The defects can be compensated for and the adhesion to glass can be improved.

Since the metal partition wall of the present invention is used in a discharge space, its surface must be covered with an insulating layer (2) as shown in FIG. 1, for example. In addition, there is a portion where the temperature locally rises to about 200 ° C. during discharging,
Since heat resistance of at least 200 ° C. or more is required, an inorganic material is preferable for the insulating layer. In addition, in order to form the inorganic insulating layer on the surface of the metal partition wall with good adhesion, it is necessary that both have similar thermal expansion coefficients. For example, the coefficient of thermal expansion of the metal partition wall is adjusted to match that of the front and back plates of the conventional PDP.
In the case of approximating 3 × 10 ⁻⁶ / ° C., the inorganic insulating layer preferably has a thermal expansion coefficient close to that.

The inorganic insulating layer meeting the above conditions includes Al
_There are oxide ceramics such as ₂ O ₃ , BeO, MgO · SiO ₂ , and glass. Oxide ceramics can be formed by a PVD method such as a vacuum evaporation method, a sputtering method, or an ion plating method, or a CVD method. Further, the glass can be formed by applying a glass powder by a dipping method, a spray method, a powder electrostatic coating method, an electrodeposition method or the like, and baking. Among those forming the above-mentioned trunk insulating layer, glass is particularly suitable for this application because the coefficient of thermal expansion can be arbitrarily set depending on the composition. However, if the baking temperature exceeds 700 ° C., the metal sheet is oxidized or thermally deformed. Further, it is preferable to use toxic lead-free glass, for example, Zn-B-Si-O-based or Bi-B-Si-O-based glass.
Systems are preferred.

When a conductive thin metal plate is used as a partition, the dielectric breakdown voltage of an insulating film formed on the thin metal plate is desirably as high as possible. It is preferable to form a chamfer having a radius equal to or larger than the radius. According to the study by the present inventors, for a metal partition having a sharp corner portion with a radius of about 2 μm obtained by ordinary etching, the radius is increased to 4 μm, 7 μm, and 11 μm by processing, so that in the case of facing discharge, Are lower by 12%, 27% and 39%, respectively, than in the case of 2 μm.

Further, in order to use a conductive metal thin plate as a partition wall substrate, the electric field concentration strength must be at least 5 times higher than that obtained by a metal partition wall substrate having a shape after etching.
% Is desired, and the radius for lowering the electric field strength is preferably 3 μm or more. Therefore, the radius of the chamfer at the corner is 3 μm or more. In the chamfered portion in this case, the shape of the corner portion in the cross section may be, for example, a shape with a slight unevenness, a straight shape, or a rounded shape.

Here, the corners (5) referred to in the present invention are four corners seen in a vertical cross section of one sheet metal plate in which a through hole is formed. The corners may be chamfered by, for example, chamfering all of the laminated metal sheets as shown in FIG. 1 in a case where three sheets are laminated. This is to chamfer corners of a thin metal plate disposed on the glass plate side and the front glass plate side.

Here, as the method of forming a chamfered portion having a specific radius or more in the shape of the corner portion according to the present invention, sand blasting by spraying powder of alumina or glass,
A rounded chamfered portion can be provided by electrolytic polishing for electrically polishing a corner portion, chemical polishing for chemically polishing a corner portion, re-etching for etching without a resist, or the like. In particular, re-etching can be performed in the shortest time among these, and the efficiency is high.

Further, in the present invention, it is preferable that the thin metal plate serving as the metal partition has the same thermal expansion coefficient as that of the front and rear glass plates used in an image display device such as a PDP. First, when considering the approximation of this coefficient of thermal expansion, the panel may be damaged if the coefficient of thermal expansion is significantly different at the time of sealing between the metal partition and the glass plates of the front plate and the back plate. ,
In a conventional PDP, as described above, 8.3 × 10 ⁻⁶ / ° C.
Since the glass having a thermal expansion coefficient of is used, the thermal expansion coefficient of the metal partition wall is set to 7.0 to 1 in order to approximate the glass.
It is desirable to set it to ^0.010-6 / C.

As a second consideration when approximating the coefficient of thermal expansion, the difference in thermal expansion due to the temperature difference between a metal partition wall whose temperature rises to about 200 ° C. in actual use and a glass plate whose temperature does not rise is also taken into consideration. It is also considered that a metal partition having a smaller coefficient of thermal expansion is better, and a metal partition having a coefficient of thermal expansion of 7.0 × 10 ⁻⁶ / ° C. or less is also effective. In this case, in order to prevent the panel from being damaged at the time of sealing, it is preferable to make the thermal expansion coefficients of the front plate, the back plate, and the like approximate to those of the metal partition.

In the present invention, the characteristics required for the metal sheet include an etching characteristic in addition to the above-mentioned coefficient of thermal expansion. Since a large number of through holes are formed by wet etching to form cells and partition walls, it is better not to include as much as possible an element that inhibits etching properties. Specifically, as an alloy having the above-mentioned preferable coefficient of thermal expansion and excellent etching characteristics, C: 0.015% or less by weight, Si: 0.25% or less, Mn: 0.60% or less, N
i: a thin plate containing 30 to 55% and the balance being Fe and unavoidable impurities, or a thin plate in which a part of Ni is replaced by 18% or less of Co.

A specific alloy has a thermal expansion coefficient of 4.6.
~ 5.2 × 10^-6/ Ni of 29Ni-17Co-Fe
Gold, coefficient of thermal expansion 4.0 to 4.7 × 10^-6/ N of 42 ℃
i-Fe alloy, coefficient of thermal expansion 8.0 to 8.6 × 10^-6/
48Ni-Fe alloy at ℃ of 9.4 to 10.0
× 10^-6/ Ni alloy of 50 / ° C, coefficient of thermal expansion 9.
8 to 10.4 × 10^-6/ Ni 52Fe alloy at / ° C and
Coefficient of thermal expansion called invar alloy of about 2 × 10^-6/ ℃
36Ni-Fe alloy, called Super Invar alloy
Thermal expansion coefficient 1 × 10^-6/ Ni of 31Ni-5Co-F
e alloy and the like. C: 0.015% or less;
Si: 0.25% or less, Mn: 0.60% or less, Cr:
0.30-7.0%, Ni: 30-55%, remaining
The portion may be a thin plate made of Fe and unavoidable impurities. this
Has a thermal expansion coefficient of 9.1 to 9.8 × 10 ^-6/ C of 42
A Ni-6Cr-Fe alloy or the like is typical.

Here, the chemical composition specified as a preferable range in the present invention will be described. Ni is 30-55%
Outside the range, the coefficient of thermal expansion becomes too large. Preferably, it is 43 to 53%, more preferably 45 to 50%. C is an element that has a large effect on the etching rate. The smaller the value, the faster the etching rate. Preferably,
0.006% or less. Mn and Si are elements used as a deoxidizing agent, but if they are too much, they have an adverse effect on the etching properties. Therefore, Mn ≦ 0.60% and Si ≦ 0.25, respectively.
%. Preferably, Mn ≦ 0.10%, Si ≦ 0.0
3%.

Co is effective in increasing the transition point while keeping the coefficient of thermal expansion relatively low. Since the coefficient of thermal expansion changes largely before and after the transition point, it is difficult to seal the panel if the transition point is too low. Ni: 30-55% of Co
When the substitution is made, the transition point can be set to about the conventional sealing temperature (400 to 450 ° C.) with 18% Co,
It is expensive and the smaller the one, the better. The upper limit is set to 18%. Cr is effective for improving the adhesion to glass, but if it is too much, the etching properties deteriorate. If it is less than 0.30%, there is no effect, and if it exceeds 7.0%, the etching rate becomes extremely slow.

Next, the manufacturing method of the present invention will be described. As a first method of manufacturing a metal partition wall according to the present invention, an insulating layer is formed on a thin metal plate having a large number of through holes, and then a plurality of laminated layers are laminated and aligned at 450 to 700 ° C. under their own weight or under load. This is a method of bonding by pressing. The metal partition obtained by this method has a structure as shown in FIG. 2, for example. In this method, first, an insulating layer is formed on the surface of a thin metal plate having a large number of through-holes constituting display cells and partition walls.
At this time, it is preferable to use a metal sheet that has been chamfered.

Next, a plurality of metal thin plates having an insulating layer formed on the surface thereof are laminated and joined in a temperature range of 450 to 700 ° C. to obtain a metal partition for an image display device having a high partition height. At this time, the temperature range for joining is 450 to 7
The reason for setting the temperature range to 00 ° C. is that if glass having a softening point in the above temperature range is used for the insulating layer, glass for the insulating layer coated with a thin metal plate can also be used for bonding, thereby shortening the manufacturing process. This is because it can be done.

Further, even when an insulating layer is formed by using an oxide ceramic by a PVD method or a CVD method, the metal sheet covered with the insulating layer and softened in the above-mentioned temperature range for bonding between laminated metal sheets. Adhesion can be achieved by sandwiching a glass frit. If the bonding glass is softened in the subsequent phosphor baking step, it will cause a positional shift. Therefore, it is preferable to use a glass having a softening point equal to or higher than the phosphor baking temperature (450 ° C.). Also, 7
When joining at a temperature of 00 ° C. or more, thermal deformation and oxidation of the metal sheet become remarkable, so the upper limit was set to 700 ° C. Since these methods form an insulating layer on each metal thin plate, there is an advantage that the insulating properties of the metal partition walls are high.

Next, as a second method of manufacturing a metal partition wall according to the present invention, after laminating a plurality of metal sheets having a plurality of through holes, an insulating layer is formed on the plurality of laminated metal sheets. This is a manufacturing method for forming a metal partition. In this method, after laminating thin metal sheets, they are covered with an insulating layer. The metal partition obtained by this method has a structure as shown in FIG. 1, for example.

As a laminating method at this time, a method of activating and bonding the surfaces to be bonded of the metal sheets to be laminated, such as a method of directly bonding and laminating the metal sheets, such as a method of bonding, or For example, a method using a glass frit which can bond both of the metal thin plates to be bonded between the surfaces to be bonded, as represented by a method using the glass as an adhesive, may be adopted.

In this method, since a plurality of sheets are stacked first,
It becomes a deep hole, and it is necessary to select a method with good throwing power as a method of forming the insulating layer, but it is excellent in handling properties and is effective. As a method of forming the insulating layer at this time,
Specifically, in particular, the CVD method, the powder electrostatic coating method, and the electrodeposition method are suitable methods for forming an insulating layer with good throwing power and are suitable.

By using the above-described metal partition wall of the present invention, an image display device having good luminance can be obtained. Here, as the image display device of the present invention, a PDP in which a plurality of discharge cells are arranged is typical.
It can also be used for a liquid crystal display using plasma.

[0034]

The present invention will be described below in more detail by way of examples. First, a metal thin plate having the composition shown in Table 1 was formed with a large number of through holes by spray etching of a FeCl ₃ solution.
After processing into the shape of FIG. 3 to make a metal partition wall for DP,
Re-etching was performed to chamfer the corners. The plate thickness was 0.20 mm, and the cross section of the corner was observed with an electron microscope, and it was confirmed that there was a chamfer with a radius of 4 μm.

[0035]

[Table 1]

Next, No. Softening point 585
A Zn-B-Si-O-based glass powder at ℃ was applied by a spray method, and fired at 630 ℃ in the air to form an insulating layer. The thickness was about 10 μm. After three metal sheets having the insulating layer formed thereon were laminated and aligned, they were joined at 600 ° C. in the air under pressure using a special jig to form metal partition walls. The height of the partition walls after lamination is about 0.66 m
m.

Next, No. 5 metal sheets are laminated, and Zn-B-Si having a softening point of 585 ° C. is interposed between the metal sheets.
After sandwiching the -O-based glass frit and bonding at 600 ° C,
Al ₂ O ₃ was coated by a CVD method. In this case, the thickness of the insulating layer was 10 μm, and the height of the metal partition was 1.03 mm. In addition, No. No. 3 for the metal sheet No. 3. Metal partition walls were prepared in the same manner as in Example 1, and the thickness of the insulating layer was 10 μm.
m, and the height of the metal partition wall was 0.66 mm.

When the above-described metal partition was set on a PDP and assembled, as compared with the case where the metal partition was a single layer, the application area of the phosphor was remarkably increased, so that the luminance was improved. According to the present invention, it is possible to put into practical use a metal partition wall whose luminance has been dramatically improved, which was conventionally insufficient, and it is also possible to easily manufacture a metal partition wall having a high height. When assembling in a small area, the number of parts is small and the industrial result is extremely large.

[0039]

According to the present invention, an image display device having a high partition wall height can be provided, and the luminance of an inexpensive image display device using metal partition walls can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cross section of a metal partition wall of the present invention.

FIG. 2 is a perspective view of a cross section of a metal partition wall of the present invention.

FIG. 3 is a schematic view showing an example of a thin metal plate having a through hole for a PDP.

[Explanation of symbols]

1 Metal sheet, 2 Insulation layer, 3 Metal partition, 4 Through hole, 5 corners

Claims (10)

[Claims] 1. A plurality of thin metal plates having a plurality of through holes are stacked, and a height after stacking is 0.3 to 1.2 mm;
A metal partition wall for an image display device, wherein an insulating layer is formed on a surface of the laminated metal thin plate. 2. The metal partition for an image display device according to claim 1, wherein 2 to 6 thin metal plates are laminated. 3. The metal partition wall according to claim 1, wherein the insulating layer contains glass having a softening point of 700 ° C. or lower. 4. The metal for an image display device according to claim 1, wherein a chamfer having a radius of 3 μm or more is formed at a corner of the cross section of the laminated metal thin plate. Partition walls. 5. The metal sheet is C: 0.015% by weight.
Hereinafter, Si: 0.25% or less, Mn: 0.60% or less,
The metal partition wall according to any one of claims 1 to 4, wherein Ni: 30 to 55% is contained, and the balance is composed of Fe and inevitable impurities. 6. The metal partition according to claim 5, wherein a part of Ni is replaced by 18% or less by weight of Co. 7. The thin metal sheet has a C content of 0.015% by weight.
Hereinafter, Si: 0.25% or less, Mn: 0.60% or less,
The image display device according to any one of claims 1 to 4, wherein Cr: 0.30 to 7.0%, Ni: 30 to 55%, and the balance is Fe and unavoidable impurities. Metal partition. 8. An image display device comprising the metal partition for an image display device according to claim 1. Description: 9. After forming an insulating layer on a surface of a metal sheet having a plurality of through holes, a plurality of the metal sheets are stacked, and
A method for producing a metal partition for an image display device, comprising joining the metal partition at a temperature in the range of 0 to 700 ° C. 10. A metal for an image display device, comprising: stacking a plurality of thin metal plates having a plurality of through holes; and forming an insulating layer on the stacked thin metal plates to form a metal partition. A method of manufacturing a partition.