JP2000164121A - Paste for forming barrier rib for plasma display panel, and method of forming barrier rib - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming a barrier rib for plasma display panel having sufficient height and accuracy while perfectly eliminating a non- pattern part without dissolving a pattern part. SOLUTION: In this method of forming a barrier rib, the paste for forming barrier rib including at least the inorganic fine grains, the binder resin and the solvent is used so as to provide a barrier rib forming layer on a glass board, and after forming a resist pattern on the barrier rib forming layer, water or alkali solution is injected with pressurization for development, and a barrier rib is thereby formed. The resist pattern can be formed by any one of a method of patterning while providing a photosensitive resist layer and a method of screen printing the non-photosensitive paste for resist.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a microfabrication technique for forming a fine pattern.
In particular, the present invention relates to a method for forming a partition for a plasma display by microfabrication, and more particularly to a method for effectively manufacturing a partition using a paste for forming a partition for a plasma display panel.

[0002]

2. Description of the Related Art In recent years, in the field of displays and circuit materials, there has been a strong demand for a technique of patterning inorganic materials with high precision. In particular, in the field of displays, the miniaturization and high definition of image elements have been progressing, and accordingly,
Improvements in pattern processing technology are also desired. For example,
Materials and techniques capable of patterning an inorganic material such as glass with high accuracy are desired for forming a wall partition that is a partition of each pixel of a plasma display panel.

A plasma display panel is a display panel that displays an image or the like by emitting light from a large number of gas discharge tubes. The structure has a large number of cells as a small discharge space sandwiched between two substrates, and discharges and emits light for each cell, or emits phosphor by ultraviolet rays generated by the discharge. ing. Partitions are provided between these minute cells in order to prevent interference between the cells or to keep the distance between the two substrates constant. In order to form the partition, a pattern has been generally formed by a screen printing method using a paste for forming a partition.

[0004] In the plasma display panel, in order to enlarge the discharge space as much as possible and obtain high-luminance light emission,
It is desirable to have a partition wall whose wall is cut vertically and has a small width and a high height (expressed as having a high aspect ratio). In particular, for a high-definition display, a partition having a high aspect ratio of, for example, 30 to 50 μm in width with respect to 100 μm in height is required.

As a method of forming a pattern such as a partition wall, JP-A-1-296534 and JP-A-2-16553
No. 8 and JP-A-5-342992 propose a method of forming a pattern by microphotolithography using a photosensitive paste. However,
Due to the low sensitivity and resolution of the photosensitive paste, it is difficult to obtain high definition partition walls with a high aspect ratio. For example, 8
When patterning a material having a thickness exceeding 0 μm, development is not effectively performed to the deep part, and the non-pattern part does not elute sufficiently, or even if the non-pattern part elutes, non-dissolvable inorganic fine particles are formed. There is a drawback that a residue is left inside the cells partitioned by the partition walls.

Japanese Patent Application Laid-Open No. 2-165538 discloses a method in which a photosensitive paste is coated on a transfer paper or a transfer film, and then a partition pattern is transferred from the transfer material onto a glass substrate to form a partition. ,Also,
Japanese Patent Application Laid-Open No. 3-57138 proposes a method of forming a partition by filling a groove of a photoresist layer with a dielectric paste. Further, JP-A-4-109536
In Japanese Patent Application Laid-Open Publication No. H11-264, a method of forming a partition using a photosensitive organic film is proposed. However, even with these methods, in order to obtain a partition having a high definition and a high aspect ratio, insufficient solubility of the non-pattern portion in development, incomplete removal of residual inorganic substances, and physical strength of the partition forming material and non-pattern. A satisfactory method has not been obtained due to incompatibility with the solubility of the pattern portion.

[0007] In order to improve this drawback, Japanese Patent Application Laid-Open No. 8-32 is disclosed.
No. 1257 discloses a method in which a resist film is provided on a partition wall forming layer and sandblasting is performed via a resist pattern. However, even with this method, there is a problem that the etching by the sandblast does not reach a sufficiently deep portion, and a partition wall having a high aspect ratio cannot be accurately formed.

[0008] To overcome this difficulty, the inventor has:
A method was proposed in which a photosensitive composition containing inorganic fine particles was used as a partition wall forming layer, and this layer was subjected to patternwise exposure, followed by high-pressure jetting of water or an aqueous alkaline solution to remove non-patterned portions. It has been recognized that this method improves pattern accuracy and aspect ratio. However, since there is a great demand for higher definition and higher brightness of the plasma display, there is a demand for a method of forming a partition wall having higher accuracy and a higher aspect ratio. This demand is also desired in the pattern processing of the necessary insulator layer and dielectric layer together with the partition in the plasma display.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a plasma display partition having a uniform shape, a small number of defects, and excellent precision even if the aspect ratio is high, and a method of forming the partition. It is to be.

[0010]

In order to achieve the above object, the present inventor has further improved a partition forming method which incorporates the above-described development in which non-pattern portions are removed by high-pressure injection of water or an alkaline aqueous solution. In order to achieve this, it is important to balance the two opposing required characteristics that the developing effect is sufficiently exerted on the bottom of the base wall and that the surface portion of the pattern portion is not collapsed by the injection pressure. In order to achieve this, the inventors of the present invention have reached the present invention as a result of intensive research, considering that means for enhancing the physical protection of the surface portion of the pattern and facilitating removal of the non-pattern portion are indispensable. . That is,
The present invention has the following configuration.

1. A partition wall forming paste for a plasma display panel containing at least inorganic fine particles, a binder resin, and a solvent, a partition wall forming layer is provided on a substrate using the paste, and a resist pattern is further provided on the partition wall forming layer. A paste for forming a partition for a plasma display panel, wherein the paste is used in a method for forming a partition by developing by spraying water or an alkaline aqueous solution under pressure.

2. 2. The paste for forming a partition wall according to the above item 1, wherein the binder resin contains at least either a cellulose resin or an acrylic resin.

3. 3. The paste for forming a partition wall according to the above 1 or 2, further comprising a silicon dioxide powder.

4. The resist pattern is a resist pattern obtained by applying and drying a paste containing a photosensitive resin or laminating a photosensitive dry film to expose and develop a resist film provided on the partition wall forming layer. The paste for forming a partition according to any one of the above 1 to 3, which is characterized by the following.

[0015] 5. 4. The paste for forming a partition wall according to any one of 1 to 3 above, wherein the resist pattern is a resist pattern provided on the partition wall forming layer by screen printing a paste containing a binder that is hardly soluble in water.

6. Using the partition wall forming paste according to any one of the above 1 to 5, a partition wall forming layer is provided on a glass substrate, a resist pattern is provided on the partition wall forming layer, while protecting the partition wall forming layer in the pattern portion. A method for forming a partition wall for a plasma display panel, wherein the partition wall is formed by development in which water or an alkaline aqueous solution is injected under pressure.

[7] 7. The method for forming a partition wall according to the above item 6, wherein the binder resin contains at least either a cellulose resin or an acrylic resin.

[8] 8. The method for forming a partition according to the above 6 or 7, wherein the partition forming paste contains a silicon dioxide powder.

9. After coating and drying a paste containing a photosensitive resin or laminating a photosensitive dry film, after providing a resist film on the partition wall forming layer,
9. The method for forming a partition according to any one of the above items 6 to 8, wherein the resist film is exposed and developed to obtain a resist pattern.

[10] 9. The method for forming a partition wall according to any one of the above items 6 to 8, wherein a resist pattern is provided on the partition wall forming layer by screen printing a paste containing a binder which is hardly soluble in water.

11. (6) The water or alkali aqueous solution used for development performed by pressurized injection of water or an alkaline aqueous solution is a gas-liquid mixture containing microbubbles.
11. The method for forming a partition according to any one of items 10 to 10.

12. Water or an alkaline aqueous solution having an applied pressure of 50 kgf / cm ² or more is applied at right angles to a surface including the fan by a spray nozzle which spreads the solution in a fan shape and sprays the solution by pressurizing and spraying water or an alkaline aqueous solution. The method for forming a partition according to any one of the above items 6 to 11, wherein the jetting is performed on a partition forming layer that moves at a constant speed in the direction.

13. 4. A material for forming a partition wall for a plasma display panel, wherein the paste for forming a partition wall according to any one of the above 1 to 3 is applied and formed to a thickness of 50 to 200 [mu] m on a flexible support.

14. A partition structure for a plasma display panel formed by the partition forming method according to any one of the above 6 to 13.

The essential points of the present invention are to provide a resist layer on the surface of the partition wall forming layer to protect the pattern portion forming the partition wall, weaken the adhesive force of the binder of the partition wall forming layer, and reduce the adhesive strength of the non-patterned partition wall forming material. The three points are that removal is facilitated and that a developing method involving an impact action by spraying a liquid is employed. That is, firstly, by providing a resist layer having a patterning function by photosensitivity and a surface protection function, destruction of the pattern portion of the partition wall forming layer is prevented. It is possible to reduce the amount of the binder resin, or it is possible to use a binder resin having a relatively weak binding force (for example, a cellulose derivative) without necessarily reducing the weight, so that it is possible to further facilitate the removal of the non-patterned portion. As a result, the discriminability between the pattern portion and the non-pattern portion is improved. Third, by a developing method of jetting water or an alkaline aqueous solution at a high pressure (hereinafter referred to as high-pressure spray developing),
Because the chemical dissolution and the physical impact work together, the development effect extends to the deep part of the partition wall forming layer, and the binding structure between the binder resin and the inorganic fine particles in the non-patterned part has a dissolution effect. In addition, it is destroyed by spraying, and the removal of inorganic fine particles is promoted. Therefore, as a result of removing only the non-pattern portions without collapsing the partition portions, it is possible to obtain partition walls having a uniform shape, high accuracy, and a high aspect ratio.

[0026]

Further features of the present invention will be described in detail in the following description of embodiments. First, the composition of the paste for forming barrier ribs of the present invention will be described. The paste composition contains at least inorganic fine particles, a binder resin, and a solvent for kneading both, as essential components, and may further contain other components described below.

(Inorganic Fine Particles) As the inorganic fine particles, the method of the present invention can be applied without any particular limitation as long as they are generally used in this technical field. Examples of the inorganic fine particles include glass, ceramics, and metals (gold, platinum, silver, Particles such as copper, nickel, palladium, tungsten, ruthenium and alloys thereof, metal oxides of the above metals, oxides of rare earth elements, and phosphors which are composite compounds of these oxides are usually used in many cases. Among them, glass and ceramics containing silicon oxide, boron oxide or aluminum oxide as an essential component are often used. These are insulators and are used for forming insulating patterns, particularly for forming partitions of plasma displays and plasma addressed liquid crystal displays.

The particle size of the inorganic fine particles is selected in consideration of the shape of the pattern to be produced. The higher the height of the partition walls, the finer the particles are desired. Usually, the average particle diameter is 20 μm or less, particularly 0.01 to 10 μm.

In order to form a highly transparent partition wall, it is important to smoothly bake the developed patterned composition. However, a lower baking temperature saves heat energy, and the substrate, Since the range of selection of filters and other materials is widened, the thermal softening temperature (Ts) is 400 to 600 ° C.
It is preferable to use glass fine particles of the above. In order to prevent the substrate glass from warping during firing, the linear thermal expansion coefficient (linear thermal expansion coefficient) is 50 to 90 × 10 ⁻⁷ ,
60-90 × 10 ^-7 glass fine particles
Preferably, it is used in an amount of at least% by weight.

As a composition in the glass fine particles, silicon oxide is preferably blended in a range of 3 to 80% by weight, more preferably 20 to 60% by weight. If the content is less than 3% by weight, the denseness, strength and stability of the glass layer decrease,
Further, the coefficient of thermal expansion deviates from a desired value, and a mismatch with the glass substrate is likely to occur. Further, when the content is set to 60% by weight or less, there is an advantage that the heat softening point is lowered and baking on a glass substrate becomes possible.

Glass fine particles containing at least one of bismuth oxide and lead oxide and having a total content of 5 to 60% by weight, or boron oxide, bismuth oxide or lead oxide are used. 8 in total
And at least one of lithium oxide, sodium oxide and potassium oxide is contained in 3 to 15% by weight.
Glass using glass fine particles having a content of 10% by weight is preferred because of its low melting point.

When various metal oxides are added as inorganic fine particles, the pattern after firing can be colored by adding the metal oxides. For example, a black pattern can be formed by including 1 to 10% by weight of a black metal oxide in the partition wall forming paste. Oxides of Cr, Fe, Co, Mn, Cu, and Ru are selected as black or other colored metal oxides used for this purpose. By containing 10% by weight, a black pattern with higher light opacity can be formed. Although not a coloring material, ceramic powders such as alumina, magnesia, cordierite, calcia, silica, and zircon are used as refractory fillers.

Further, a pattern of each color can be formed by using a paste composition to which an inorganic pigment which develops a color such as red, blue, green or the like in addition to black is added. These coloring patterns can be suitably used for a color filter of a plasma display and the like. On the other hand, in some cases, it is better to whiten the partition walls in order to effectively guide the light emission of the phosphor to the front surface of the panel. In such a case, titania, which is a fire-resistant white pigment, is used.

Preferably, silicon dioxide powder is added to the partition wall forming layer. The silicon dioxide powder to be added may be a crystalline or amorphous powder, or may be a silica powder obtained by pulverizing natural silicon oxide or a synthesized silica powder. Particularly preferable silicon dioxide powder is amorphous fine powder silica, so-called colloidal silica. The preferred particle size of the silicon dioxide powder is such that the average particle size is 0.05 to 20 microns, more preferably 0.1 to 20 microns.
2 to 10 microns. For example, two types of silicon dioxide powders having different average particle sizes are mixed and used, for example, a colloidal silica fine powder is used in combination with silica particles of several microns as a partition wall structural material in terms of strengthening the binding force. May be. As the silicon dioxide powder used in the present invention, commercially available silicon dioxide powder, in particular, commercially available colloidal silica can be used.

As the inorganic fine particles, fine particles having different components can be used in combination. In particular, by using glass fine particles or ceramic fine particles having different thermal softening points, the shrinkage during firing can be suppressed. Since the inorganic fine particles become the main constituent material of the partition walls, they are used in an amount of 60% by weight or more, preferably 70 to 95% by weight of the total solid components in the paste composition.

(Binder Resin) As the binder,
In addition to its function as a binder, it needs to be burned and vaporized at a relatively low temperature, so that carbides do not remain in the barrier.Ethyl cellulose, methyl cellulose, ethyl propyl cellulose, nitrocellulose, cellulose acetate,
Cellulose resins such as cellulose propionate, cellulose acetate butyrate, cellulose butyrate, poly (methyl methacrylate), poly (ethyl methacrylate), poly (n-butyl methacrylate), poly (isobutyl methacrylate), poly (isopropyl methacrylate) , Poly (2-ethylmethyl methacrylate), poly (2-hydroxyethyl methacrylate)
Such as a methacrylate polymer resin, a corresponding acrylate polymer resin and a copolymer resin of the above components, polyvinyl alcohol, polyvinyl butyral, α
Known binder components such as -styrene polymer and α-methylstyrene polymer are used. Preferred binder resins are cellulose resins and (meth) acrylate polymer resins. Among them, a cellulose derivative is a preferred binder for the composition for forming a partition wall.
The substitution rate of the substituent of the cellulose derivative is 10 to 90%, preferably 30 to 80% of the cellulose hydroxyl group. For example, ethyl cellulose having a substitution rate of 45 to 60% is suitable. These binders may use a single type of polymer, or may be used as a mixture with other cellulose derivatives or non-cellulosic polymers as long as they are miscible with each other. The mixing ratio is arbitrary as long as it can be mixed and the function as a binder is maintained.

As the cellulose derivative used as a binder, in addition to the above, a cellulose derivative substituted with a water-soluble group may be added as a secondary component. In addition to the water-soluble group, the resin may be a lower alkyl group or a lower acyl group. A group may be included as a substituent. The water-soluble group of the substituent is a hydroxyalkyl group (having 1 to 3 carbon atoms) and a carboxymethyl group.

The hydroxyalkyl group substitution rate of these hydroxyalkyl celluloses is 1.3 to 7.0 equivalents per glucose unit, and preferably 1.5 to 7.0 equivalents.
5.0 equivalents. When the substitution rate exceeds 3.0 per glucose unit, it means that the hydroxyalkyl-substituted hydroxyalkyl group is further substituted. If the substitution ratio is 1.3 equivalents or less, the solubility and miscibility become insufficient, and if the substitution ratio exceeds 7.0 equivalents, it is difficult to increase the degree of substitution and the production cost increases. Particularly preferred water-soluble group-substituted cellulose derivatives are hydroxypropyl cellulose, hydroxymethyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, carboxyethyl cellulose, hydroxypropyl methyl cellulose, hydroxymethyl phthalate cellulose, hydroxypropyl methyl cellulose phthalate, hydroxypropyl methyl cellulose acetate phthalate, cellulose sulfate It is.

Methyl cellulose is synthesized from alkali cellulose and methyl chloride or dimethyl sulfate by a conventional method. Further, hydroxyethyl methylcellulose is obtained by reacting with ethylene oxide in a conventional manner. Ethyl cellulose is obtained by reacting alkali cellulose with ethyl chloride under pressure. Other alkyl celluloses can be synthesized in the same manner. Hydroxyethylcellulose is synthesized from cellulose and ethylene oxide by a conventional method. Carboxymethyl cellulose is obtained by reacting cellulose and monochloroacetic acid in the presence of caustic in a conventional manner. Cellulose sulfate is obtained by reacting cellulose and dimethylformamide by a conventional method. Other cellulose derivatives can be synthesized by the same known method. It is also commercially available.

It is also possible to use a monomer-substituted cellulose derivative to which a monofunctional or polyfunctional polymerizable monomer is added. A particularly preferred polymerizable functional group-containing cellulose derivative is the aforementioned hydroxyalkyl cellulose or a urethane acrylate adduct of a hydroxyalkyl / alkyl co-substituted cellulose derivative. Specific examples thereof include a reaction product of 2,4-tolylene diisocyanate and 2-hydroxyethyl methacrylate, and a reaction of one isocyanate group of 2,4-tolylene diisocyanate with 2-hydroxyethyl methacrylate, followed by further reaction. Reaction products obtained by reacting the remaining isocyanate groups with triethanolamine are exemplified.

The preferred amount of the binder in the wall material layer is 0.005 to 10.0% by weight, more preferably 0.01 to 5.0% by weight, based on the total solids in the wall material layer. is there. Further, a binder obtained by mixing a water-soluble group-substituted cellulose derivative with another miscible polymer may be used. When mixing the water-soluble group-substituted cellulose derivative, the mixing ratio has an appropriate range depending on the type of the polymer to be combined, but usually the water-soluble group-substituted cellulose derivative is 80% by weight or less, preferably 5% by weight of the total binder resin amount.
It is 0% by weight or less, and may not be added.

(Hydrolysable organometallic compound) It is preferable to add a hydrolyzable organometallic compound to the wall material layer in which the inorganic fine particles are dispersed to strengthen the bonds between the particles or between the particles and the binder. Often. The hydrolyzable organometallic compound means a hydrolyzable polymerizable compound represented by the following general formula (1). (R ¹ ) _n -X- (OR ² ) _4-n (1) In the general formula (1), R ¹ and R ² may be the same or different and represent an alkyl group or an aryl group. , X
Represents Si, Al, Ti or Zr, and represents an integer of 0 to 2. When R ¹ or R ² represents an alkyl group, it preferably has 1 to 4 carbon atoms. Further, the alkyl group or the aryl group may have a substituent. This compound is a low molecular compound and preferably has a molecular weight of 1,000 or less.

The compound containing aluminum in the hydrolyzable polymerizable compound includes, for example, trimethoxyaluminate, triethoxyaluminate, tripropoxyaluminate and tetraethoxyaluminate. Examples of those containing titanium include, for example, trimethoxy titanate, tetramethoxy titanate, triethoxy titanate, tetraethoxy titanate, tetrapropoxy titanate, chlorotrimethoxy titanate,
Chlorotriethoxytitanate, ethyltrimethoxytitanate, methyltriethoxytitanate, ethyltriethoxytitanate, diethyldiethoxytitanate,
Examples include phenyltrimethoxytitanate and phenyltriethoxytitanate. As a material containing zirconium, for example, a zirconate corresponding to the material containing titanium can be given.

Examples of compounds containing silicon in the hydrolyzable polymerizable compound include, for example, trimethoxysilane, triethoxysilane, tripropoxysilane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane,
Methyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, methyltriethoxysilane, ethyltriethoxysilane, propyltriethoxysilane, dimethyldimethoxysilane, diethyldiethoxysilane, γ-chloropropyltriethoxysilane, γ-mercapto Propyltrimethoxysilane, γ-
Mercaptopropyltriethoxysilane, γ-aminopropyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltripropoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, and the like can be given. Of these, particularly preferred are tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, methyltriethoxysilane, ethyltriethoxysilane, dimethyldiethoxysilane,
Phenyltrimethoxysilane, phenyltriethoxysilane, cyphenyldimethoxysilane, diphenyldiethoxysilane, and the like can be given.

The compound represented by formula (1) may be used alone or in combination of two or more. Further, the compound of the general formula (1) may be partially hydrolyzed and then dehydrated and condensed. In addition, a trialkylmonoalkoxysilane can be added as needed to adjust the physical properties of the product. The hydrolysis-polymerizable organometallic compound is a compound constituting the inorganic phase in the present invention, and the storage stability of the inorganic phase, particularly, the storage of the image-forming material in a solution state before being applied to the substrate of the lithographic printing plate. In order to enhance the stability, an active metal hydroxyl group, for example, a silanol group (Si-OH) of an inorganic polymer partially hydrolyzed and polymerized by a hydrolyzable organic metal compound represented by the general formula (1) is protected. Is valid. The protection of the silanol group can be achieved by etherifying (Si-OR) the silanol group with a higher alcohol such as t-butanol or i-propyl alcohol (where R is alkyl in the above alcohols). Group). Specifically, it can be carried out by adding the higher alcohol to an inorganic phase in which silica fine particles are dispersed. At this time, depending on the properties of the inorganic phase, for example, the inorganic phase can be dehydrated by using a means such as heating the inorganic phase to distill off water desorbed, and the storage stability can be further improved.

The hydrolysis-polymerizable organometallic compound is not an essential component in the wall material layer, but when used, the amount of the hydrolysis-polymerizable organometallic compound can be used in a wide range. It is used in the range of 1 to 80%, preferably 1 to 50%, more preferably 1 to 20% of the inorganic fine particles in the wall material layer.

(Other compounds added to the wall material layer) If necessary, the composition of the wall material layer may be improved in the affinity between the organic component and the inorganic component to improve the stability and dispersibility of the composition. For this purpose, a radical polymerizable monomer can be added. The radically polymerizable monomer may be any monomer capable of radical polymerization, and is particularly preferably a silane compound. Examples of the radical polymerizable monomer include N- (3-acryloxy-2-hydroxypropyl) 3-aminopropyltriethoxysilane, 3-acryloxypropyldimethylmethoxysilane, and 3-acryloxypropylmethylbis (trimethylsiloxy) silane , 3-acryloxypropylmethyldichlorosilane, 3-acryloxypropyltrichlorosilane, 3-acryloxypropyltrimethoxysilane, allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane, allyltris (trimethylsiloxy) silane, methacryloxy Propenyltrimethoxysilane, 3-methacryloxypropyldimethylchlorosilane, 3-methacryloxypropyldimethylethoxysilane, 3-methacryloxypropylmethyldic Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltrichlorosilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltris (methoxyethoxy) silane, 3-methacryloxypropyltris (tremethyl Siloxy) silane, vinyldimethylchlorosilane, vinyldimethylethoxysilane, vinylethyldichlorosilane, dinymethylbis (methylethylketoximine) silane, vinylmethylbis (trimethylsiloxy) silane, vinylmethyldiacetoxysilane,
Vinylmethyldichlorosilane, vinylmethyldiethyl and silane, vinyltriacetoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltrimethoxysilane, vinyltrimethylsilane, vinyltrifexysilane, vinyltris-t-butoxy Silane, vinyltris (t-butylperoxy) silane, vinyltrisisopropenoxysilane, vinyltris (2-methoxyethoxy) silane, KBM1003 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.), KBM1403 (trade name; Shin-Etsu Chemical Co., Ltd.) Company), KBM503 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.), KBM 5102 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.), KBM5403 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) That.

Although the above-mentioned radical polymerizable compound is not an essential component of the wall material layer, the content thereof when added therein is 10 to 500% of the amount of the hydrolyzable organometallic compound,
Preferably, it is used in the range of 30 to 400%.

(Solvent) In the present invention, an appropriate solvent is used to mix the binder with components such as inorganic fine particles. Suitable solvents are good solvents or good dispersants for the binder resin, specifically, acetone, methyl ethyl ketone, ketones such as diethyl ketone, hexane, cyclohexane, benzene, toluene, hydrocarbons such as xylene, methyl Ester such as acetate, ethyl acetate and isopropyl acetate, alcohols such as methanol, ethanol, isopropanol, n-butanol, toluene and xylol, ethyl ether, glycols such as 2-ethoxyethanol, water, methylene chloride, methyl cellosolve, Ethyl cellosolve, glycerin, and other known solvents suitable for the properties of the components can be used. Further, the coating properties of the composition for the partition wall constituting layer may be adjusted by adding a small amount of a high boiling point solvent.

Further, as additives, plasticizers such as phthalic acid esters and glycolic acid esters, surfactants, defoamers, antioxidants, and acid or alkali agents for adjusting pH may be added. In order to enhance the effect of the high-pressure spraying, it is preferable to keep the amount to a small amount, and it is desirable that the total amount of these additives does not exceed 20% by weight of the binder resin.

[Coating of partition wall forming layer] The partition wall forming layer for plasma display is formed of inorganic fine particles such as glass frit, a binder resin, a solvent, and if necessary, an ultraviolet absorber, a hydrolyzable polymerizable organic metal compound, and the above-mentioned silane compound. Are prepared so as to have a predetermined composition, and then uniformly mixed and dispersed with a three-roller, a ball mill, or a suitable kneader to produce a mixture. The solvent is
An appropriate combination is selected from the above solvents according to the type of the binder resin. When the resin is a water-soluble substituent-containing cellulose derivative, water is preferred. In the case of a composition using another cellulose derivative, a mixed solvent of a water-soluble solvent and an alkaline aqueous solution is used. For acrylic acid and methacrylate resins,
The above-mentioned organic solvents and mixed solvents of a water-soluble solvent and an alkaline aqueous solution are suitable.

When composed of various components, the inorganic fine particles and the hydrophilic component are mixed with an aqueous mixed solvent, and the other components are dissolved in a polar organic solvent to form an organic phase. Dispersion and mixing can also be performed. Alternatively, after mixing the organic component and the inorganic component, two or more solvents may be added in order and dispersed.

The viscosity of the partition wall forming layer composition is appropriately adjusted by the addition ratio of inorganic fine particles, a thickener, an organic solvent, a plasticizer, a suspending agent and the like.
10,000 cps (centipoise). For example, when applying to a glass substrate by a spin coating method, 200 to 500
0 cps is preferred. In order to obtain a film thickness of 10 to 20 μm by applying once by a screen printing method, 50,000 to 200,000 cps is preferable. When a blade coat method, a die coater method, or the like is used, 1000 to 30000 cps is preferable.

On a glass substrate or a ceramic substrate,
As a method for providing the partition wall forming layer composition, a transfer method may be used in addition to the above-described coating method. In the transfer method, a composition is applied on an intermediate film and transferred to a glass substrate. Alternatively, a partition wall forming layer and a resist layer may be formed on the film side, and these may be simultaneously transferred to a glass substrate.

As the application method, general methods such as screen printing, bar coating, roll coating, die coating, blade coating, spray coating, and extrusion coating can be used. The coating thickness can be adjusted by selecting the number of coatings, the coater gap, the screen mesh, and the viscosity of the composition.

[Resist Pattern] The resist pattern provided on the partition wall forming layer can be provided by any method. A preferable method is to apply a non-photosensitive resist paste on the partition wall forming layer by a screen printing method. A method of forming and applying a photosensitive resist material on the partition wall forming layer, and performing a pattern exposure on this,
This is a method of forming a pattern by developing and removing a non-pattern portion.

(Resist Pattern by Screen Printing Paste) For screen printing of the non-photosensitive resist paste, a known or commercially available paste for this purpose can be used. For example, a screen printing paste manufactured by Asahi Glass Industry Co., Ltd. Paste RPW025 or the like can be used. Further, a composition in which components other than photopolymerizable components, a polymerization initiator, a photopolymerization contributing component such as a photopolymerization accelerator, etc. from the composition of the photosensitive resist material described below are formed in a paste-like composition. Can also be preferably used. In addition, the above-mentioned binder resin as a partition wall forming layer may be added to this composition to be blended in a paste form, and further, a composition component of the partition wall forming layer other than the binder resin may be added.

(Resist Pattern by Photosensitive Resist) Any of known resist materials may be used for the resist layer provided on the partition wall forming layer. Further, a resist solution may be applied on the partition wall forming layer, or a resist material in the form of a dry film may be laminated on the partition wall forming layer. Further, a positive resist material or a negative resist material may be used. When a dry film is used, a preferable resist film is a positive resist, particularly a positive resist comprising a mixture of an alkali-soluble phenol resin and naphthoquinonediazide. Among them, a dry film resist comprising a cresol novolak resin and an o-naphthoquinonediazidosulfonic acid derivative is preferable. These are available as commercial products. In addition, a negative resist may be used, and a preferable negative resist is mostly in the form of a coating solution. As a resist film forming material, a cyclized rubber such as a chain polymer having an alicyclo ring and an aromatic bisazide are used. Cyclic rubber-bisazide-based resist in which bisazide compound such as compound is combined, novolak resin-azide-based resist in which 1-azidopyrene is combined with meta-cresol novolak resin, acrylic-based resist solution in which acrylic monomer and photopolymerization initiator are combined And the like,
Particularly, an acrylic resist solution is preferable.

In the acrylic resist solution, the polymerizable monomer is a photopolymerizable group such as an acryloyl group, a methacryloyl group, an acrylamide group, an allyl group.
It is a compound having a vinyl ether group, a vinyl thioether group, a vinyl amino group, a glycidyl group, an acetylenically unsaturated group, and the like.

Specific examples thereof include methyl acrylate, ethyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, Phenoxyethyl acrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate,
Dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, acrylamide, phenyl acrylate, phenoxyethyl acrylate,
Benzyl acrylate, 1-naphthyl acrylate, 2
-Naphthyl acrylate, bisphenol A diacrylate, aminoethyl acrylate, or styrene, p-methylstyrene and the like. One or more of these can be used in the acrylic negative resist solution. Also, a macromonomer in which these monomers are added as a side chain to an oligomer or a polymer may be used.

The negative resist material contains a polymerization initiator together with the photopolymerizable monomer. In the present invention, the polymerization initiator refers to a photoradical generator, a photoacid generator and a photobase generator. Here, those having both properties of a photoradical generator and a photoacid generator or a photobase generator are also included in the polymerization initiator.

Examples of the photo-radical generator include DB
E [CAS No. 10287-53-3], benzoin methyl ether, anisyl (p, p'-dimethoxybenzyl), TAZ-110 (trade name, manufactured by Midori Kagaku Co., Ltd.), benzophenone, TAZ-111 (trade name: manufactured by Midori Kagaku Co., Ltd.) ), IR-651 and 369 (trade name: Ciba-Geigy).

Examples of the photoacid generator include a photoinitiator for photocationic polymerization, a photoinitiator for photoradical polymerization, a photodecolorant for dyes, a photochromic agent, and a known photoinitiator used for microresist. , A compound capable of generating an acid and a mixture thereof can be appropriately selected and used. Examples of preferable compounds include (a) an oxazole derivative or an s-triazine derivative substituted with a trihalomethyl group, (b) an iodonium salt or a sulfonium salt bonded to two or three aryl groups, (c) a disulfone derivative or an imino derivative. Sulfonate derivatives and (d) benzoin tosylate derivatives.

Examples of the photobasic generator include NBC
-101 (trade name: manufactured by Midori Kagaku Co., Ltd.), α, α-
Dimethyl-3,5-dimethoxybenzyl carbamate and the like can be mentioned.

<Application of Photoresist Layer> To form a photoresist layer, when the resist material is a resist solution, a photoresist solution is applied in layers immediately after application of the partition wall forming layer or after drying. The coating includes a bar coater, roll coater, die coater, spin coater,
The coating can be performed using a general device such as a blade coater. When the photoresist material is a dry film photoresist, a dry film is laminated on the partition wall forming layer.

<Pattern Formation> In the case of using a photoresist, a pattern such as a partition is formed after coating or laminating. Usually, exposure through a mask is often performed using an exposure apparatus. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component. Also, without using a photomask, red or blue visible laser light, Ar ion laser, U
A direct drawing method using a V ion laser or the like may be used.

As an exposure device, a stepper exposure device, a proximity exposure device, or the like can be used. In the case of performing a large-area exposure, after exposing the photosensitive composition onto a substrate such as a glass substrate, and performing the exposure while transporting, a large-area exposure is performed using an exposure machine having a small exposure area. Can be.

The active light source used at this time is, for example,
Visible light, near-ultraviolet light, ultraviolet light, electron beam, X-ray, laser light, etc. are preferable, and among them, ultraviolet light is preferable. Etc. can be used. Among these, an ultra-high pressure mercury lamp is preferred.
Exposure conditions vary depending on the coating thickness, but 1 to 100 mW / c
Exposure is performed for 0.1 to 30 minutes using an ultrahigh pressure mercury lamp having an output of m ² . The irradiation energy required for pattern formation is 2
0 to 500 mJ / cm ² .

After the exposure, the exposed resist film is developed by dissolving the non-pattern portion while leaving the pattern portion by utilizing the difference in solubility between the photosensitive portion and the non-photosensitive portion in water or an alkaline aqueous solution. The aqueous solution used is water, sodium hydroxide, sodium carbonate, an inorganic alkali aqueous solution such as a calcium hydroxide aqueous solution, tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, an organic alkali aqueous solution such as diethanolamine, or These are mixed solutions. This processing solution is also called a developer,
It is generally different from the developing solution for forming a partition described below. However, depending on the properties of the resist film, the development for forming the resist pattern and the development for forming the barrier ribs may be able to proceed simultaneously in the same step. This concludes the description of pattern formation by screen printing of a non-photosensitive paste and pattern formation by layer formation, exposure, and development of a photosensitive resist (liquid, paste, or laminating method). Next, a partition forming step will be described.

[Partition Forming Step] In the present invention, the development for forming the partition is performed by the above-described high-pressure spray development in which water or an alkaline developer is injected under pressure. Since the effect of the pressure injection is strong and extends deep, the non-pattern portion is substantially removed by development with water. In particular, the partition wall forming layer composition containing the water-soluble group-substituted cellulose derivative described above,
It is suitable for water development by pressurized injection of the present invention. On the other hand, in the pattern portion, the resist layer is photo-cured or the resist layer becomes soluble by light to form a resist pattern, thereby protecting the partition wall forming layer in the pattern portion.

(Developer) The developer is not necessarily limited to water. An organic solvent in which the organic component in the partition wall forming layer can be dissolved can also be used. When a compound having an acidic group such as a carboxyl group is present in the partition wall forming layer, development can be performed with an aqueous alkali solution. In this case, an aqueous inorganic alkali solution such as sodium hydroxide, sodium carbonate, or an aqueous calcium hydroxide solution can be used as the aqueous alkali solution. However, it is preferable to use an aqueous organic alkali solution since the alkaline component can be easily removed during firing.

As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 10% by weight.
~ 5% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not preferable. The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.

(High-Pressure Spray Development) Preferred embodiments of high-pressure spray development can be classified into ultra-high-pressure spray development and bubble jet development according to the manner of operation of the developer.

First, the ultra-high pressure spray development will be described. The injection angle of the pressurized injection of water or an alkaline aqueous solution has a great effect on the developing action. The developing action is the strongest when it is perpendicular to the surface of the photosensitive multilayer constituting layer. On the other hand, the removal of inorganic fine particles derived from the partition material for plasma display is not sufficient simply by a strong developing action, and unnecessary inorganic fine particles must be removed from the substrate by mechanical impact of a developer. For this purpose, it is preferable that the fuel is injected at an angle of obliquely forward or obliquely backward from the vertical direction by 0 to 35 degrees, preferably 0 to 20 degrees. The applied pressure for injecting water or an alkaline aqueous solution varies depending on the shape of the injection nozzle. In the case of a cat-eye type nozzle (cross section is a concave lens shape) which is a preferred embodiment of the present invention, 50 to 350 kgf / cm ² , preferably 100
Pressure of ~300kgf / cm ² is effective.

It is practical to employ a continuous development step as an economical embodiment of the present invention. In such a case, the fan or the aqueous solution is spread evenly in the width direction of the composition layer. A single nozzle or a plurality of nozzles that spray with a mold spread are arranged in the spreading direction of the fan, and the photosensitive layer forming layer is moved at a constant speed in the direction perpendicular to the fan surface while passing through the water or alkali aqueous solution spraying part. Therefore, it is preferable to carry out continuous development.

A high-pressure jet type developing apparatus having the above-mentioned jet pressure, impact angle, water flow spreading shape and the like, which can be used particularly preferably, has a function for satisfying the object of the present invention. The ultra-high pressure jet precision cleaning system AF series (Asahi Sanac) (stock))
It is. Among them, AF5400S is suitable for high pressure, and AF2800II is suitable for low pressure. However, as long as the apparatus has the above-described injection pressure, impact angle, and water flow spreading shape, the present invention is not limited to this model, and can be applied to the developing means of the partition wall forming method of the present invention.

Next, bubble jet development will be described. In the high-pressure spray development of the present invention, the jetted water or alkaline aqueous solution may be in the form of a so-called bubble jet containing microbubbles therein. Bubble jet is a water jet obtained by sending compressed air into pressurized water (or an alkaline aqueous solution) at a pressure of 5 to ²⁰ kg / cm ^2.
When this mixed fluid is jetted at high pressure and applied to the partition wall forming layer, the impact effect of bubbles, water droplets and water flow and the surface rubbing effect of the bubbles are added to the partition wall forming layer, resulting in insolubility. The removal of the gender residue is particularly smooth. Therefore, in the case of the bubble jet method, that is, the method in which the microbubbles and the water droplets are simultaneously applied, the injection pressure is 5-2.
0 kg / cm ^2, preferably from 5 to 10 kg / cm ^2, the ultra-high pressure spray development does not depend on the microbubbles as described above is considered that there are some differences in mechanisms of action. The preferred size of the microbubbles is 0.01 to 1.0 mm. In order to perform the development by the bubble jet method, a bubble jet apparatus usually used for cleaning of equipment can be used.
A preferred apparatus includes, but is not limited to, a single-wafer cleaning apparatus manufactured by Shimada Rika Kogyo Co., Ltd.

In either type of high pressure spray development,
In the method of the present invention, the inorganic fine particles that are not deposited in the formation of the partition wall are effectively removed even in the deep part of the non-patterned part, so that the height of the partition wall can be increased, and in general, a large-sized hard to remove. It is also possible to use inorganic particles. Therefore, in the method of the present invention, the thickness of the partition wall forming layer applied at one time can be as high as 15 to 300 microns, and preferably 50 to 200 microns. In particular, when a partition having a high wall is formed, the thickness can be increased by overlapping coating. By the high-pressure injection, even a partition forming layer having a height of 300 μm can be effectively developed and a partition can be formed.

The partition wall forming method of the present invention can be widely applied to known partition wall forming composition layers.
A composition layer containing inorganic fine particles, a water-soluble group-substituted cellulose derivative, and a hydrolyzable polymerizable organometallic compound.
Cellulose derivatives have a good affinity for the components in the composition, and therefore maintain the transparency of the composition. This contributes to the improvement of pattern accuracy. In addition, since it can be developed with water, it is suitable for high pressure spray jet development. Further, since the sintering is performed at a relatively low temperature, the sintering temperature can be relatively low, and the sintering can be performed at 400 to 600 ° C.

[Firing Step] Next, firing is performed in a firing furnace.
The firing atmosphere and temperature vary depending on the type of the composition and the substrate, but firing is performed in an atmosphere such as air, nitrogen, or hydrogen. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used. Firing temperature is 400-600
Perform at ° C. Further, a heating step of 50 to 300 ° C. may be introduced for the purpose of drying and preliminary reaction during each of the coating, exposure, development and baking steps.

The glass substrate having the partition layer obtained by the above steps can be used on the front side or the back side of the plasma display. Further, it can be used as a substrate for discharging an address portion of a plasma addressed liquid crystal display.

After the phosphor was applied between the formed partition layers, the glass substrates on the front and rear surfaces were sealed together, and helium,
By encapsulating rare gases such as neon and xenon,
A panel portion of a plasma display can be manufactured. Furthermore, by mounting a driver IC for driving,
A plasma display can be manufactured.

In order to increase the definition of the plasma display, that is, to increase the number of pixels with a fixed screen size, it is necessary to reduce the size of one pixel. In this case, it is necessary to reduce the pitch between the partition walls. However, when the pitch is reduced, the discharge space is reduced and the coated area of the phosphor is reduced, so that the luminance is reduced. Specifically, a 42-inch high-definition television (1
In order to realize an OA monitor (920 × 1035 pixels) or a 23-inch OA monitor (XGA: 1024 × 768 pixels), the pixel size must be 450 μm square, and the partition walls for each color are formed at a 150 μm pitch. There is a need. In this case, if the line width of the partition is large, it is difficult to improve the luminance because a space for discharge cannot be secured or the application area of the phosphor is reduced.

By using the technique of the present invention, the width of the partition can be reduced. In particular, the partition wall width is 20 to 4
It is possible to obtain a plasma display in which stripe-shaped partition walls of 0 μm are formed, which is effective for improving luminance at the time of high definition.

Further, by forming a high-definition partition having a height of 100 to 170 μm and a pitch of 100 to 160 μm, a high-definition plasma display which can be used for a high-definition television or a computer monitor can be provided.

The embodiments of the present invention have been described above with reference to the example of plasma display panel fabrication. However, the method of the present invention is not limited to application to plasma display panel fabrication. It can be used for the purpose of improving the termination.

[0087]

The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. [Example 1] As the composition for the partition wall forming layer, the following components were mixed to prepare a paste-like composition.

<Paste composition for partition wall forming layer> Alumina powder (average size 0.1 μm) 10 parts Low melting glass A (average size 1 μm, see Table 1) 60 parts Ethyl cellulose 1 part Hydroxypropyl cellulose 1 part Colloidal silica NPC-ST -30 (manufactured by Nissan Chemical Industry Co., Ltd.) 2 parts Epoxy ester 1600A (manufactured by Kyoei Chemical Co., Ltd.) 1 part N-methyl-2-pyrrolidone 10 parts 2- (2-n-butoxyethoxy) ethyl acetate 10 parts α -5 parts of terpineol

This composition was applied to a 30 cm square soda glass substrate by a plurality of applications to a coating thickness of 120 μm to form a partition wall forming layer.
For 30 minutes. A dry film resist (NCP225 manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) is formed on the partition wall forming layer.
Was laminated.

[0090]

[Table 1]

Next, the mask was exposed through a photomask having a pitch of 150 μm and a line width of 30 μm. Exposure dose 120 ultra high pressure mercury lamp with an output of 200 mW / cm ²
UV exposure of mJ / cm ² . After the exposure, spray development was performed at a liquid temperature of 30 ° C. with a 1 wt% aqueous solution of sodium carbonate to form a resist pattern. Subsequently, after drying at 50 ° C. for 2 hours, the partition wall formation and development using the next pressurized water was performed.

In the development for forming the partition wall, an ultra-high pressure jet precision cleaning system AF5400S (manufactured by Asahi Sunac Co., Ltd.) was used while the partition wall forming layer with the resist pattern was conveyed on the sample table at a constant speed of 5 mm / sec. The spraying was performed by spraying a water spray of a fan-shaped thin layer onto the surface of the photosensitive composition. Water was sprayed at an angle such that the fan-shaped spray surface was perpendicular to the direction of travel of the composition and the spray ran perpendicular to the composition surface. The injection pressure at that time is 1
It was set to 50 kg / cm ² . After the development, the resist pattern was stripped by spraying a stripping solution of a 2.0 wt% aqueous solution of sodium hydroxide. Then, after drying at 100 ° C. for 15 minutes, baking was performed as follows.

The developed partition wall forming layer is heated at 580 ° C. for 30 minutes.
It was baked for a minute while maintaining some air permeability. The organic components in the partition wall forming layer were completely volatilized during firing, and no residual components were observed.

Example 2 A paste composition was prepared by mixing the following components as a composition for a partition wall forming layer.

<Paste composition for partition wall forming layer> Alumina powder (average size 0.1 μm) 15 parts Low melting point glass A (average size 1 μm, see Table 1) 60 parts Carboxymethyl cellulose 0.4 part Water 24.6 parts This composition The material was applied to a 30 cm square soda glass substrate by a bar coater to a coating thickness of 120 μm to provide a partition wall forming layer, and then dried at 100 ° C. for 30 minutes. A paste for forming a resist pattern having the following composition was formed on this partition wall forming layer by screen printing to a thickness of 20 μm.
m, a resist pattern having a line width field of 30 μm was formed at a pitch of 150 μm.

<Paste composition for forming resist pattern> Alumina powder (average size: 0.1 μm) 15 parts Low melting glass A (average size: 1 μm, see Table 1) 60 parts Ethyl cellulose 2 parts N-methyl-2-pyrrolidone 8 parts Acetic acid 2- (2-n-butoxyethoxy) ethyl 10 parts α-terpineol 5 parts After drying at 100 ° C. for 10 minutes, similarly as in Example 1, pressurized water is injected to perform development for forming partition walls, After drying at 30 ° C. for 30 minutes, baking was performed in the same manner as in Example 1.

[Comparative Example 1] RPW025 manufactured by Asahi Glass Industry Co., Ltd. was used as a paste for forming partition walls, and the same dry film as used in Example 1 was used for forming resists. Were formed in the same manner as in Example 1 except that the development of was a sandblasting treatment. The sand blasting treatment was performed under the conditions of a distance of 10 cm between the nozzle and the resist film surface and a blowing pressure of 3 kg / cm ² using brown fused alumina # 1000 as an abrasive.

[Results] Example 1, Example 2, and Comparative Example 1
The partition wall sample formed by the above was cut, and a cross section was observed with a scanning electron microscope. Each of the partition wall samples of Example 1 and Example 2 had a pattern lack, cut off, and defective removal of an unexposed portion due to poor development (local excessive dissolution or insufficient dissolution) as compared with the partition wall formed in Comparative Example 1. In addition, defects such as the residual of the dissolved residue and the like were extremely small, and a partition wall structure for a plasma display having a good shape could be obtained.

[0099]

According to the present invention, a partition wall forming layer is formed by using a paste containing at least inorganic fine particles, a binder and a solvent, a resist pattern is provided thereon, and the partition wall is formed by developing by pressurizing injection of water or an alkaline aqueous solution. According to the method, a high-precision pattern can be formed without residual inorganic fine particles and without pattern disturbance even in a high partition wall. In particular, partition walls and other wall structures for plasma display can be formed.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03F 7/40 501 G03F 7/40 501 5C040 G09F 9/30 324 G09F 9/30 324 5C094 9/313 9 / 313 E H01J 11/02 H01J 11/02 B (72) Inventor Soichiro Nagata 4000 Kawajiri, Yoshida-cho, Haibara-gun, Shizuoka Pref. FA17 FA29 2H096 AA27 BA20 CA05 CA12 CA16 GA08 GA21 HA01 JA04 LA19 4G059 AA08 AB07 AB09 AB11 AC01 CA01 CA08 CB09 CB10 EA01 EA05 4G062 AA04 AA09 BB05 DA05 DB03 DC04 DD01 DE03 DF03 DF04 EA03 EB03 EA01 EB01 EC01 EB03 MM27 NN01 PP15 PP16 5C027 AA09 5C040 GB08 GF18 GF19 JA03 JA04 JA15 KA07 KA16 KA17 KB04 KB19 L A17 MA23 MA24 5C094 AA05 AA43 BA31 CA19 EC04 FB01 FB02 FB03 FB15 GB10 JA08

Claims (14)

[Claims] 1. A partition wall forming paste for a plasma display panel containing at least inorganic fine particles, a binder resin, and a solvent, wherein a partition wall forming layer is provided on a substrate using the paste, and further formed on the partition wall forming layer. A paste for forming a partition for a plasma display panel, wherein the paste is used for a partition forming method in which a resist pattern is provided and the partition is formed by developing by pressurizing and jetting water or an alkaline aqueous solution. 2. The partition wall forming paste according to claim 1, wherein the binder resin contains at least either a cellulose resin or an acrylic resin. 3. The partition wall forming paste according to claim 1, further comprising silicon dioxide powder. 4. A resist pattern obtained by exposing and developing a resist film provided on a partition wall forming layer by applying and drying a paste containing a photosensitive resin or laminating a photosensitive dry film. The partition wall forming paste according to any one of claims 1 to 3, wherein the paste is a pattern. 5. The resist pattern according to claim 1, wherein the resist pattern is a resist pattern provided on the partition wall forming layer by screen printing a paste containing a binder that is hardly soluble in water. For forming barrier ribs. 6. A partition wall forming layer is provided on a glass substrate using the partition wall forming paste according to any one of claims 1 to 5, and a resist pattern is provided on the partition wall forming layer. A method for forming a partition for a plasma display panel, comprising forming a partition by development in which water or an alkaline aqueous solution is injected under pressure while protecting a formation layer. 7. The method according to claim 6, wherein the binder resin contains at least one of a cellulose resin and an acrylic resin. 8. The method for forming a partition according to claim 6, wherein the partition-forming paste contains silicon dioxide powder. 9. A resist film is provided on the partition wall forming layer by applying and drying a paste containing a photosensitive resin or laminating a photosensitive dry film, and then exposing and developing the resist film to form a resist. The method according to claim 6, wherein a pattern is obtained. 10. The partition wall forming method according to claim 6, wherein a resist pattern is provided on the partition wall forming layer by screen printing a paste containing a binder that is hardly soluble in water. 11. The water or alkali aqueous solution used for development performed by pressurizing and jetting water or an alkali aqueous solution is a gas-liquid mixture containing microbubbles.
11. The method for forming a partition according to any one of items 10 to 10. 12. A developing method in which water or an alkaline aqueous solution is pressurized and sprayed, the water or alkali aqueous solution having an applied pressure of 50 kgf / cm ² or more is applied by a spray nozzle which spreads and sprays the solution in a fan shape. The method for forming a partition according to any one of claims 6 to 10, wherein the jetting is performed on a partition forming layer that moves at a constant speed in a direction perpendicular to the surface. 13. A partition wall forming material for a plasma display panel, wherein the partition wall forming paste according to any one of claims 1 to 3 is applied on a flexible support to a thickness of 50 to 200 μm. . 14. A partition wall structure for a plasma display panel formed by the partition wall forming method according to claim 6. Description: