JP2000150557A5 - - Google Patents
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- Publication number
- JP2000150557A5 JP2000150557A5 JP1998324125A JP32412598A JP2000150557A5 JP 2000150557 A5 JP2000150557 A5 JP 2000150557A5 JP 1998324125 A JP1998324125 A JP 1998324125A JP 32412598 A JP32412598 A JP 32412598A JP 2000150557 A5 JP2000150557 A5 JP 2000150557A5
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- electrode pads
- bumps
- main surface
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 238000007747 plating Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10324125A JP2000150557A (ja) | 1998-11-13 | 1998-11-13 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10324125A JP2000150557A (ja) | 1998-11-13 | 1998-11-13 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000150557A JP2000150557A (ja) | 2000-05-30 |
| JP2000150557A5 true JP2000150557A5 (enrdf_load_stackoverflow) | 2004-10-28 |
Family
ID=18162437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10324125A Pending JP2000150557A (ja) | 1998-11-13 | 1998-11-13 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000150557A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100881389B1 (ko) | 2002-12-26 | 2009-02-05 | 주식회사 하이닉스반도체 | 반도체소자의 패키지 구현방법 |
| JP2004273591A (ja) * | 2003-03-06 | 2004-09-30 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JP4057017B2 (ja) | 2005-01-31 | 2008-03-05 | 富士通株式会社 | 電子装置及びその製造方法 |
| JP4566915B2 (ja) * | 2006-01-10 | 2010-10-20 | 大日本印刷株式会社 | 半導体装置の実装体、半導体装置実装体の製造方法 |
| US8742603B2 (en) * | 2010-05-20 | 2014-06-03 | Qualcomm Incorporated | Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) |
| US8461676B2 (en) | 2011-09-09 | 2013-06-11 | Qualcomm Incorporated | Soldering relief method and semiconductor device employing same |
| JP6635328B2 (ja) | 2014-11-10 | 2020-01-22 | ローム株式会社 | 半導体装置およびその製造方法 |
-
1998
- 1998-11-13 JP JP10324125A patent/JP2000150557A/ja active Pending
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