JP2000150325A - Electronic part and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part and a mounting wiring board, in which the height of the part can be reduced on mounting even when the electronic part has its height as before. SOLUTION: A wiring board 6 has a hole 6a a little larger than a cross section of a case 1 for an electronic part and a wiring pattern 6c formed in accordance with an upper face electrode 5 on the electronic part. As for the electronic part, an outer diameter of a stage plate 2 mounted on the case 1 is made larger than the hole 6, and the upper face electrode 5 is formed so as to be put in contact with the wiring pattern 6c of the wiring board 6. The electronic part is so mounted that the case 1 is inserted in the hole 6a of the wiring board 6, and at the same time the upper face electrode 5 of the electronic part is put in contact with the wiring pattern 6c of the wiring board 6 and joined firmly with solder 7. As a result, the height of the electronic part projected to one side can be reduced as compared with a conventional case when the electronic part is mounted on the wiring board 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component used for thin electric appliances such as a personal computer and a mobile phone, and a wiring board on which the electronic component is mounted.

[0002]

2. Description of the Related Art In recent years, as electronic products and electronic devices have been miniaturized, the miniaturization of electronic components used in these products has also become remarkable. Especially mobile phones, personal computers, digital VT
In R, the thickness of the set becomes extremely thin, and as a countermeasure against this, it is required that both sides of the wiring board on which electronic components are mounted be reduced in thickness to the LSI package thickness.
However, among these electronic components, in particular, electrolytic capacitors and the like have reached an area where it is difficult to reduce the thickness due to the internal structure, which has been an obstacle to reducing the thickness of the mounting substrate.

[0003] Such a conventional electronic component will be described with reference to the drawings, taking a vertical chip electrolytic capacitor as an example.

FIG. 6A is a perspective view showing the structure of the vertical chip type electrolytic capacitor.
Is a capacitor body. The lower surface of the capacitor body 18 is covered with a seat plate 19 so that the capacitor body 18 can stand on its own when mounted on a wiring board, and the lower surface of the seat plate 19 is provided with a lead pulled out from the capacitor body 18. The electrode 20 is formed by bending a tip portion.
Reference numeral 21 denotes a step formed on the seat plate 19 to indicate the polarity.

FIG. 6B is a cross-sectional view of the case where the electrolytic capacitor with a seat plate is mounted on a wiring board 22. The electrodes 20 of the electrolytic capacitor are connected to a wiring pattern 23 formed on the wiring board 22 by solder 24. , Fixed. Also,
Reference numeral 25 denotes a resist of the wiring board 22.

[0006]

However, in the above-mentioned conventional electronic components, since the electronic components are mounted on the surface of the wiring board, the thickness of the mounting board is determined by the height of the electronic components. There is a problem that the mounting board on which is mounted cannot be made thin.

The present invention solves such a conventional problem,
It is an object of the present invention to provide an electronic component capable of reducing the height when mounted on a wiring board even if the height of the electronic component remains the same, and a wiring board on which the electronic component is mounted.

[0008]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a bottomed cylindrical case in which an element having a lead wire for external lead-out is built in and an opening is sealed. The extracted lead wire is attached to the opening side of the case in a state where the lead wire is arranged vertically, and at least an electrode portion conducting to the lead wire is provided on the upper surface serving as the case side, and an outer diameter larger than the outer diameter of the case This is an electronic component having a configuration including a seat plate formed in dimensions. According to the present invention, a hole into which a case of an electronic component fits is formed in a wiring board on which the electronic component is mounted, the case is mounted so as to fit into the hole, and an electrode portion provided on the seat plate is connected to a wiring of the wiring board. By connecting to the pattern, the mounted electronic components are projected on the upper and lower surfaces of the wiring board by approximately 1/2 each, so that the mounting height can be reduced by half.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a bottomed cylindrical case in which an element having a lead wire for external lead-out is built in and an opening is sealed, and the case is drawn out of the case. Along with the above-mentioned lead wire arranged in the vertical direction, an electrode portion which is attached to the opening side of the case and is electrically connected to at least the lead wire is provided on the upper surface serving as the case side,
An electronic component consisting of a seat plate having a mounting portion formed with an outer diameter larger than the outer diameter of the case. The mounting height is increased by mounting the electronic component on a wiring board provided with a hole into which the case fits. It has the effect of being able to reduce the length by half.

According to a second aspect of the present invention, there is provided a bottomed cylindrical case in which an element having a lead wire for external lead-out is built in and an opening is sealed, and the lead wire drawn out of the case is horizontally moved. An electrode portion which is mounted to hold the case in a state of being arranged in the direction and which is at least electrically connected to the lead wire, is provided on the upper surface serving as the case side, and has a mounting portion formed with an outer diameter larger than the outer diameter of the case. The electronic component has a structure including a seat plate, and has the same operation as the operation according to the first aspect of the present invention.

According to a third aspect of the present invention, in the first or the second aspect of the present invention, the electrode portion is formed by a lead wire drawn out of the element. It has the effect that it can be configured at low cost.

According to a fourth aspect of the present invention, in the first or the third aspect of the present invention, the shape of the seat plate is rectangular, and a pair of electrode portions are arranged on a diagonal line thereof. Since a long electrode part can be configured well,
This has the effect that the dimensions of the seat plate can be reduced.

According to a fifth aspect of the present invention, in the third or fourth aspect, a slit is provided in the seat plate, and the lead wire is bent along the slit. Not only can be reliably and easily bent, but also when the external force is applied to the bent lead wire, the slit can protect the lead wire.

[0014] The invention according to claim 6 is the invention according to claims 1, 3 and 3.
In the invention described in any one of the fourth and fifth aspects, the thickness of the seat plate is approximately 1/2 of a value obtained by subtracting the thickness of the wiring board on which the electronic component is mounted from the total height of the electronic component including the seat plate. This has the effect that the mounting height can be reduced most efficiently.

According to a seventh aspect of the present invention, in the first aspect of the invention, the electronic component is a capacitor, and a particularly great effect can be obtained. Has an action.

According to an eighth aspect of the present invention, there is provided a substrate on which the electronic component according to any one of the first to seventh aspects is mounted, wherein the outer diameter of the electronic component is larger than the outer diameter of the case plate. It is a wiring board having a configuration in which a hole having a small size is provided, and a wiring pattern connected to an electrode provided on the seat plate is provided on the periphery of the hole, and by mounting the electronic component of the present invention, This has the effect of reducing the mounting height by half.

Hereinafter, specific embodiments of the present invention will be described. Embodiment 1 FIGS. 1A to 1D are a plan view and a partial cross-sectional front view of a vertical chip type electrolytic capacitor as an electronic component according to a first embodiment of the present invention. FIG. 2 is a bottom view and a side view. In FIG. 1, reference numeral 1 denotes a bottomed cylindrical case in which a capacitor element (not shown) is housed together with a driving electrolyte and the opening is sealed, and 2 denotes an opening side of the case 1. The seat plate 2 has a concave portion 2a into which the case 1 fits, and has an outer diameter
It is formed in a brim shape larger than the outer diameter of. Reference numeral 3 denotes a pair of lead wires drawn from the capacitor element (not shown), and reference numerals 4 and 5 denote a lower electrode portion formed by bending the lead wire 3 along a slit 2b provided in the seat plate 2. In the present embodiment, the case 1 side is defined as an upper surface electrode portion 5.

FIGS. 2A and 2B show a state in which the vertical chip type electrolytic capacitor according to the present embodiment is mounted on a wiring board, and FIG. 2A shows a seat plate. 2 (the same mounting form as in the prior art), and FIG. 2B shows a state in which the seat plate 2 is mounted with the seat plate 2 up. 2, reference numeral 6 denotes a wiring board on which a capacitor is mounted, 6a denotes holes provided in the wiring board 6, 6b and 6c denote wiring patterns provided on the wiring board 6, 7 denotes solder, and 8 denotes mounting on the wiring board 6. And other electronic components such as ICs and LSIs.

The thus constructed electronic component according to the present embodiment is mounted with the seat plate 2 down as shown in FIG. 2 (a). 2 can be mounted by bringing the lower surface electrode portion 4 provided in 2 into contact with the wiring pattern 6b provided on the wiring board 6 and soldering it with the solder 7, and can be mounted in exactly the same manner as the conventional mounting method. is there.

As shown in FIG. 2B, the case 1 of the electrolytic capacitor is fitted into a hole 6a formed in the wiring board 6 with the seat plate 2 facing upward, and the upper electrode provided in the seat plate 2 is formed. The mounting can also be performed by bringing the portion 5 into contact with the wiring pattern 6c provided on the wiring board 6 and soldering it with the solder 7. In this case, the upper surface of the wiring board 6 is 2 and only the upper end of the case 1 protrudes from the lower surface of the wiring board 6, so that the mounting height can be greatly reduced. Since there is no difference other than leaving a gap, two types of mounting methods can be adopted with one type of vertical chip type electrolytic capacitor without special investment.

Further, the electronic component according to the present embodiment is formed by bending the lower electrode portion 4 and the upper electrode portion 5 provided on the seat plate 2 on the lead wire 3 drawn out of a capacitor element (not shown). Therefore, an inexpensive and highly reliable electrode unit can be realized.

Since the two electrode portions 4 and 5 are bent along the slit 2b provided in the seat plate 2,
Not only is it excellent in dimensions and positional accuracy, but even when force is applied to both electrode parts due to external factors, deformation and breakage can be prevented by the slit 2b, and a highly reliable electrode part can be realized. You can do it.

Further, since the two electrode portions 4 and 5 are arranged on a diagonal line of the rectangular seat plate 2, the length of the two electrode portions 4 and 5 can be efficiently secured. The size of the seat plate 2 can be reduced to reduce the size.

(Embodiment 2) FIGS. 3 (a) to 3 (d) are plan views and partial cross sections of a vertical chip type electrolytic capacitor as an electronic component according to a second embodiment of the present invention. FIG. 5 is a front view, a bottom view, and a side view. In the present embodiment, a pair of capacitor elements (not shown) drawn out of a capacitor element (not shown) along a slit 9 b provided in a seat plate 9 having a recess 9 a into which the case 1 fits. The lower electrode portion 11 and the upper electrode portion 12 are formed by bending the lead wire 10, and the same as in the first embodiment except that the bending direction of the upper electrode portion 12 is different from that of the first embodiment. Since the configuration is the same and the effect is the same, detailed description is omitted here.

(Embodiment 3) FIGS. 4A to 4C show, as an electronic component according to a third embodiment of the present invention, a horizontal chip type electrolytic capacitor mounted on a wiring board with a case facing upward. FIG. 5 is a partial cross-sectional front view, a partial cross-sectional front view mounted on a wiring board with a case facing down, and a plan view of the capacitor in the state of FIG.

In the same figure, reference numeral 13 denotes a cylindrical case having a bottom and which accommodates a capacitor element (not shown) together with a driving electrolyte and has an opening sealed, and 14 has a concave portion 14a into which the case 13 fits. The outer diameter of the case 13
The seat plate is formed to be larger than the outer diameter of the seat plate. Reference numeral 15 denotes a lower surface electrode portion formed using a pair of lead wires drawn out from the capacitor element (not shown), and reference numeral 16 denotes a process of bending the pair of lead wires along a slit 14b provided in the seat plate 14. This is the upper surface electrode portion formed by the above. 17 is a wiring board for mounting the electrolytic capacitor, 17
a is a hole provided in the wiring board 17; 17b and 17c are wiring patterns provided in the wiring board 17;
Other electronic components such as an IC and an LSI mounted on the electronic device.

The electronic component according to the present embodiment configured as described above is mounted with the seat plate 14 down as shown in FIG.
The lower surface electrode portion 16 provided on the seat plate 14 can be mounted by bringing the lower surface electrode portion 16 into contact with the wiring pattern 17b provided on the wiring board 17 and soldering with solder (not shown). You can do it.

Further, as shown in FIG.
The electrolytic capacitor case 13 and a part of the seat plate 14 are fitted into holes 17 a provided in the wiring board 17 with the
The upper surface electrode portion 15 provided on the seat plate 14 can also be mounted by bringing the upper surface electrode portion 15 into contact with a wiring pattern 17c provided on the wiring board 17 and soldering with solder (not shown). As in the first embodiment, since only the thickness of the large diameter portion of the seat plate 14 protrudes from the upper surface of the wiring board 17, the mounting height can be greatly reduced. Since there is no difference except that the hole 17a is formed in the hole, two types of mounting methods can be adopted with one type of horizontal chip type electrolytic capacitor without special investment.

The functions and effects of the two electrode portions 15 and 16 formed by lead wires drawn from a capacitor element (not shown) and the provision of the slit 14b in the seat plate 14 are the same as those in the first embodiment. Therefore, detailed description here is omitted.

(Embodiment 4) FIG. 5 is a partial cross-sectional view of a vertical chip type electrolytic capacitor mounted on a wiring board with a seat plate facing upward as an electronic component according to a fourth embodiment of the present invention. Are the same as those in the first embodiment.

However, in the present embodiment, the seat plate 2
And in the thickness h ₂ which was 1/2 of the value obtained by subtracting the thickness t of the circuit board 6 from the height H of the electrolytic capacitor, this arrangement, the projecting dimension of the upper and lower surfaces to each from the wiring board 6 _{h 1 = h 2 = (H} -t) / 2 , and the becomes a value lower than half the height H of the electrolytic capacitor, in which can be most efficiently implemented for thinning.

In particular, in the latest vertical chip type electrolytic capacitors, those having a height dimension of 4.8 mm are frequently used, and when this is mounted on a wiring board 6 with t = 0.8 mm, h ₁ = h ₂ = (4.8−0.8) / 2 = 2 m
m, which is approximately the same height as a flat package of an IC, and can provide a particularly remarkable effect in compact products such as a mobile phone, a mobile personal computer, and a digital VTR.

[0033]

As described above, the electronic component according to the present invention and the wiring board on which the electronic component is mounted are provided with electrodes on the upper and lower surfaces of the seat plate mounted on the electronic component body, and the case of the electronic component fits therein. With the configuration in which the holes are provided in the wiring board, two types of mounting methods can be adopted, one with one type of electronic component, with the seat plate down, and the other with the seat plate up. When mounted, only the seat plate protrudes from the upper surface of the wiring board because the case of the electronic component fits into the hole provided in the wiring board, and the mounting height can be greatly reduced. .

[Brief description of the drawings]

FIG. 1A is a plan view showing an electronic component according to a first embodiment of the present invention. FIG. 1B is a sectional front view of the same part. FIG.

FIG. 2A is a partial cross-sectional front view of the electronic component according to the embodiment mounted with the seat plate down, and FIG. 2B is a partial cross-sectional front view of the electronic component mounted with the seat plate up.

FIG. 3A is a plan view showing an electronic component according to a second embodiment of the present invention. FIG. 3B is a front view showing a cross section of the same part. FIG.

FIG. 4A is a partial cross-sectional front view of the electronic component according to a third embodiment of the present invention mounted with a seat plate facing down; FIG. Partial sectional front view (c) Plan view of electronic component in state (b)

FIG. 5 is a partial cross-sectional front view of the electronic component according to a fourth embodiment of the present invention mounted with the seat plate facing upward;

6A is a perspective view showing a conventional electronic component, and FIG. 6B is a partial cross-sectional front view showing a state of being mounted on the wiring board.

[Explanation of symbols]

 1,13 case 2,9,14 seat plate 2a, 9a, 14a concave portion 2b, 9b, 14b slit 3,10 lead wire 4,11,15 lower surface electrode part 5,12,16 upper surface electrode part 6,17 wiring board 6a , 17a Hole 6b, 6c, 17b, 17c Wiring pattern 7 Solder 8 Other electronic components

Claims (8)

[Claims] 1. A bottomed cylindrical case in which an element having a lead wire for external lead-out is built in and an opening is sealed, and a case in which the lead wire drawn out of the case is vertically arranged. An electronic component comprising a seat plate provided on an upper surface serving as a case side and having at least an electrode portion mounted on the opening side and electrically connected to the lead wire, and having a mounting portion formed with an outer diameter larger than the outer diameter of the case. 2. A bottomed cylindrical case in which an element having a lead wire for external lead-out is built in and an opening is sealed, and a case in which the lead wire drawn out of the case is arranged in a horizontal direction. An electronic component comprising: a seat plate having an electrode portion mounted on the upper surface serving as a case side, the electrode portion being electrically connected to at least the lead wire, the mounting portion having an outer diameter larger than the outer diameter of the case. 3. The electronic component according to claim 1, wherein the electrode portion is formed by a lead wire drawn out of the element. 4. The electronic component according to claim 1, wherein a shape of the seat plate is rectangular, and a pair of electrode portions are arranged on a diagonal line thereof. 5. The electronic component according to claim 3, wherein a slit is provided in the seat plate, and the lead wire is bent along the slit. 6. The thickness of the seat plate is set to approximately 1/2 of a value obtained by subtracting the thickness of the wiring board on which the electronic component is mounted from the total height of the electronic component including the seat plate. 6. The electronic component according to claim 1, wherein 7. The electronic component according to claim 1, wherein the electronic component is a capacitor.
7. The electronic component according to any one of 6. 8. A substrate on which the electronic component according to claim 1 is mounted, wherein a hole having a size larger than an outer diameter of a case of the electronic component and smaller than an outer diameter of a seat plate is provided. ,
A wiring board provided with a wiring pattern connected to an electrode provided on the seat plate on the periphery of the hole.