JP2000095841A - Epoxy resin composition for sealing semiconductor and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high fluidity, excellent quick curability and storage stability, high glass transition temperature, low expansion coefficient, small warpage of BGA package, good adhesion to solder mask and low water-absorption and containing a large amount of an inorganic filler to achieve flame-retardancy without using a brominated phenolic novolak and antimony trioxide. SOLUTION: This epoxy resin composition contains (A) a crystalline epoxy resin, (B) a polyfunctional phenolic resin expressed by the formula (R is H, methyl or ethyl; R' is H or a 1-4C alkyl; (m) is an integer of 1-4), (C) an organophosphorus cure accelerator, (D) an aminosilane coupling agent and (E) >=88 wt.% (based on the whole composition) of an inorganic filler as essential components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition and a semiconductor suitable for sealing a ball grid array (hereinafter referred to as "BGA") having a small amount of package warpage, a small wire flow, and excellent adhesion. It concerns the device.

[0002]

2. Description of the Related Art
Resin-sealed devices have become mainstream in the semiconductor industry. Since epoxy resins generally have better moldability, adhesiveness, electrical properties, mechanical properties, moisture resistance, etc. than other thermosetting resins, semiconductor devices are often sealed with epoxy resin compositions. Have been done.

[0003] In particular, in recent years, a package called BGA has been developed by Motorola, which has a special structure in which a chip is directly mounted on a circuit board and a plastic is sealed thereon. In this method, since only one side of the substrate is resin-sealed, a package warping phenomenon caused by a difference in shrinkage between the substrate and the resin poses a serious problem.

In order to overcome this problem, the high Tg of resin
Various attempts have been made to reduce the difference in shrinkage between the substrate and the resin by reducing the (glass transition temperature) and reducing the expansion, thereby suppressing the amount of package warpage. Specifically, a polyfunctional epoxy resin for the epoxy resin, a polyfunctional phenol resin for the curing agent,
It is a known technique to increase the Tg by using an imidazole compound as a curing accelerator, and to reduce the expansion by highly filling a silica filler. In addition, in order to maintain high fluidity and high silica filler, use spherical silica that does not contain crushed silica, optimize the particle size distribution, and optimize the silica surface treatment with a coupling agent Techniques for performing this are also known. In addition, a property that must be emphasized when evaluating the reliability of the device is the adhesiveness between the solder mask covering the substrate surface and the resin. It is well known that by selecting an epoxy silane coupling agent or a mercapto silane coupling agent as the coupling agent, the adhesiveness between the resin and the solder mask can be dramatically improved.

[0005] However, it has been found that the above prior art has various disadvantages as described below. That is,
If a polyfunctional epoxy resin or phenol resin is used, the free volume in the molecular structure of the cured product will increase, resulting in an increase in water absorption, lowering solder heat resistance after moisture absorption, and causing popcorn cracks. It will be easier. In addition, the viscosity of all non-crystalline epoxy resins, including polyfunctional epoxy resins, is relatively high.If a large amount of inorganic filler such as silica filler is contained in the epoxy resin composition, the melt viscosity increases, and the epoxy resin composition is used for sealing. The stopped BGA package causes molding defects such as wire flow or wire breakage. In addition, when an imidazole compound is used as a curing accelerator, the storage stability is inferior to that of a phosphorus-based curing accelerator. Easily occur, and the workability deteriorates. In addition, since the hydrolyzable chlorine in the epoxy resin is easily extracted, there is a problem in the moisture resistance reliability. Further, in order to cope with an ever-increasing package size, it is necessary to further reduce the expansion. With the current high silica filling, the flow of the wire frequently occurs due to the high viscosity. Further, depending on the type of the coupling agent to be added, the curability at the time of resin sealing may be hindered, resulting in an increase in the amount of package warpage.

[0006] Conventional BGA sealing resin compositions have various problems as described above, and no effective solution has been found yet.

The present invention provides an epoxy resin composition for semiconductor encapsulation which is excellent in workability and reliability because it has a small amount of package warpage, a small wire flow rate, good adhesion to a solder mask and good storage stability. And a semiconductor device sealed with a cured product of the composition.

[0008]

Means for Solving the Problems and Embodiments of the Invention The present inventors have conducted intensive studies in order to achieve the above object, and as a result, (A) a crystalline epoxy resin, (B) the following general formula (1) A polyfunctional phenolic resin represented by the following formula, (C) an organic phosphorus-based curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler in an amount of 8% of the total amount of the composition.
By blending 8% by weight or more, the amount of warpage of the package is remarkably reduced, and a cured product having high adhesiveness and low water absorption is obtained, the wire flow rate is small, the storage stability is excellent, and the semiconductor is highly reliable. The present inventors have found that an epoxy resin composition for semiconductor encapsulation that enables encapsulation, particularly BGA encapsulation, has been obtained, and the present invention has been accomplished.

[0009]

Embedded image (Wherein, R is a hydrogen atom, a methyl group or an ethyl group, R ′ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and m is 1
-4. )

Hereinafter, the present invention will be described in more detail.
The epoxy resin composition for semiconductor encapsulation of the present invention comprises (A) a crystalline epoxy resin, (B) a polyfunctional phenol resin represented by the general formula (1), (C) an organic phosphorus-based curing accelerator, D) an aminosilane coupling agent, which contains at least 88% by weight of an inorganic filler with respect to the total amount of the composition (E).

The epoxy resin used in the present invention is a crystalline epoxy resin, particularly one having a molecular structure represented by the following general formulas (2), (3), (4) and (5). Is preferred. Each of these epoxy resins has a high melting point or softening point of 100 ° C. or higher, and maintains a strong crystal structure until the temperature reaches the melting point or softening point,
Once the temperature reaches the melting or softening point, it melts rapidly and becomes a very low viscosity liquid. Therefore, a large amount of an inorganic filler can be contained in the epoxy resin composition, and the expansion coefficient of the cured product can be reduced.

[0012]

Embedded image (In the above formulas (2) to (4), R ^{1 to} R ^{8 each} represent a hydrogen atom or the same or different alkyl group having 1 to 4 carbon atoms;
Is an integer of 0 to 4. )

[0013]

Embedded image (In the above formula (5), R ^{1 to} R ¹⁰ represent a hydrogen atom or the same or different alkyl group having 1 to 6 carbon atoms, and n represents 0 to
4 is an integer. )

The alkyl group may be linear, branched, or cyclic. Specifically, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert -Butyl group, pentyl group,
Examples include a neopentyl group, a hexyl group, and a cyclohexyl group. N is an integer of 0 to 4, preferably 0 or 1.

As the crystalline epoxy resin as the component (A), a mixture containing two or more resins in which n is an integer of 0 to 4 in each of the above formulas at an arbitrary ratio may be used. .

In the present invention, as the epoxy resin,
In addition to the crystalline epoxy resin, other epoxy resins can be used in combination as long as the effects of the present invention are not impaired. Other epoxy resins include, for example, bisphenol A type epoxy resin, phenol novolak type epoxy resin, novolak type epoxy resin such as cresol novolak type epoxy resin, triphenol alkane type epoxy resin and triphenol alkane such as triphenol propane type epoxy resin. Type epoxy resin, naphthalene ring-containing epoxy resin, phenol aralkyl type epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin and the like. In this case, of all the epoxy resins, the crystalline epoxy resin accounts for 50% by weight or more (that is, 50 to 50% by weight).
100% by weight), particularly preferably 75 to 95% by weight.

The component (B) is a polyfunctional phenol resin represented by the following general formula (1), which acts as a curing agent for an epoxy resin.

[0018]

Embedded image (Wherein, R is a hydrogen atom, a methyl group or an ethyl group, R ′ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and m is 1
-4. )

The polyfunctional phenol resin of the above formula (1) has a glass transition temperature (T
g) is high. That is, BGA
The package is very easily warped because of a so-called bimetal structure, which is a one-sided resin sealing for a circuit board in which an organic resin such as BT resin is impregnated into a glass fiber laminate, and it is necessary to reduce the amount of warpage by selecting a resin. In addition, the BGA package has a problem in that the length of the gold wire is long and the number of wires is large, and the conventional sealing material causes the gold wire to flow, thereby lowering the reliability. In this case, as a method of reducing the amount of warpage, the substrate may be sealed with a resin composition having the same shrinkage ratio as the substrate, that is, a resin composition having substantially the same Tg and expansion coefficient. Therefore, an epoxy resin composition having a high Tg is desirable, but in this regard, the polyfunctional phenol resin of the formula (1) is optimal.

In the above formula (1), R is a hydrogen atom, a methyl group or an ethyl group, preferably a hydrogen atom. R ′ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group. But R '
Are preferably a hydrogen atom, a methyl group and a tert-butyl group. In addition, m is an integer of 1 to 4, and when m is 1 to 4, it is preferable because Tg is sufficiently increased and fluidity of the epoxy resin composition is secured. In order to improve the moisture resistance reliability, it is desirable that the content of alkali metals, alkaline earth metals, halogens and other ionic impurities contained in these epoxy resins is as small as possible.

As the polyfunctional phenol resin of the component (B), a mixture containing two or more kinds of resins each having an arbitrary value of m and an integer of 1 to 4 can be used.

In the present invention, the polyfunctional phenolic resin of the above formula (1) may further include other phenolic resins, for example, novolak phenolic resins such as phenol novolak resins and cresol novolak resins, bisphenol type resins, paraxylylene-modified phenolic resins, There is no problem if used in combination with meta-xylylene-modified phenol resin, ortho-xylylene-modified phenol resin, naphthalene-type phenol resin, biphenyl-type phenol resin, aralkyl-type phenol resin, dicyclopentadiene-modified phenol resin, etc. 70% by weight or more (i.e., 70 to 100% by weight) is desirably a polyfunctional phenol resin curing agent of the formula (1). If the content of the other phenolic resin curing agent exceeds 30% by weight, Tg may decrease and the warpage of BGA may increase.

The ratio (molar ratio) of the total number of epoxy groups in the crystalline epoxy resin used in the present invention to the number of phenolic hydroxyl groups in the phenolic resin curing agent is usually from 0.6 to 0.6.
It may be about 1.5, but preferably 0.8 to 1.2, particularly preferably 0.9 to 1.1. 0.6 molar ratio
If the ratio is lower or higher than 1.5, the epoxy resin composition may not be able to obtain sufficient curability, and various properties may be reduced.

The curing accelerator of the component (C) is not particularly limited as long as it is an organic phosphorus-based one. Examples of the organic phosphorus-based curing accelerator include triphenylphosphine, tributylphosphine, and the like. Triorganophosphines such as tri (p-methylphenyl) phosphine and tri (nonylphenyl) phosphine; salts of triorganophosphines and triorganoboranes such as triphenylphosphine and triphenylborane; tetraphenylphosphonium tetraphenylborates and the like. And salts of tetraorganophosphonium with tetraorganoborate. Among these, those represented by the following general formula (6) are particularly preferable.

[0025]

Embedded image (In the formula, R ¹¹ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)

Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group and a tert-butyl group. R ¹¹ is preferably a hydrogen atom or a methyl group.

Specific examples of such an organic phosphorus compound include tris-o-tolylphosphine, tris-m-tolylphosphine, and tris-p-tolylphosphine. Among them, when tristriphosphine, particularly tris-p-tolylphosphine, is used, the curability is fast, the cycle time during molding is shortened, and the storage stability is good. Further, package warpage is small because of rapid curing, and is a preferable curing accelerator.

The addition amount of these curing accelerators is not particularly limited, but may be an epoxy resin or a curing agent (phenol resin).
0.0005 to 0.1 mol, particularly preferably 0.001 to 0.05 mol, per 100 parts by weight of the total amount of Also,
It is preferably 0.1 to 20 parts by weight, particularly preferably 0.2 to 10 parts by weight. If the amount is too small, the curing reaction does not easily occur sufficiently, and the mold releasability may be deteriorated.If the amount is too large, the viscosity at the time of molding is increased, and the reliability such as moisture resistance may be deteriorated. .

The curing accelerators exemplified above can be used in combination of two or more as necessary. If necessary, a known curing accelerator such as a tertiary amine compound including a cycloamidine compound and an imidazole compound can be used in combination. Further, the curing accelerator of the present invention may be preliminarily mixed with a resin component (that is, an epoxy resin and / or a phenol resin) and pulverized so as to be easily dispersed in the resin composition.

As the aminosilane coupling agent as the component (D), an amino-functional alkoxysilane compound represented by the following general formula (7) and / or a partially hydrolyzed condensate thereof are particularly preferable.

[0031]

Embedded image (In the formula, A -CH ₃ or -C ₂ H _5, R ¹² is a hydrogen atom,
—C ₂ H ₄ NH ₂ or —C ₆ H ₅ , a represents 0 or 1. )

Specific examples of such an aminosilane coupling agent include compounds having the following structures.

[0033]

Embedded image

As the aminosilane coupling agent of the component (D) of the present invention, one or more of the above-mentioned amino-functional alkoxysilane compounds may be used in combination. Decomposed condensates may be used, or a mixture in which these silane compounds and partially hydrolyzed condensates are mixed at an arbitrary ratio may be used.

When the crystalline epoxy resin of the present invention is used in combination with a polyfunctional phenol resin in an amount of 88% by weight or more of an inorganic filler such as silica, a conventionally well-known epoxy coupling agent is used. Then, the viscosity of the epoxy resin composition increases, the fluidity decreases, and the flow of the gold wire is caused. On the other hand, by using the aminosilane coupling agent of the present invention in the above composition, the viscosity can be reduced. Among them, (CH ₃ O) ₃ SiC ₃ H ₆ NHC ₆
H ₅ is most desirable.

The aminosilane coupling agent is a curing agent such as a crystalline epoxy resin or a polyfunctional phenol resin in an epoxy resin composition, an organic component such as a solder mask on a BGA substrate, or an inorganic component such as a silica surface. Since it has a high affinity for the components, the dispersibility in the resin composition is good. Therefore, the effect of improving the wettability of the organic resin with respect to the inorganic filler, improving the fluidity of the resin composition, improving the adhesive strength at the interface between the organic resin and the inorganic filler, and improving the adhesive strength between the resin composition and the solder mask are high. Such characteristics prevent the flow of the wire because the viscosity of the resin composition can be reduced, and the improvement of the adhesive force leads to the improvement of the reliability at the time of solder immersion.

The addition amount of the aminosilane coupling agent is not particularly limited, but the total amount of the epoxy resin and the curing agent is 1
Usually, 0.1 to 5 parts by weight, preferably 0.2 to 3 parts by weight, particularly preferably 0.5 to 1.5 parts by weight are added to 00 parts by weight.

The aminosilane coupling agent may be used in combination with another type of coupling agent. In general, it is often preferable to use the aminosilane coupling agent in combination with other required performance. When used in combination, the aminosilane coupling agent is preferably incorporated in the entire coupling agent in an amount of 30% by weight or more (i.e., 30 to 100% by weight), particularly preferably 50% by weight or more (i.e., 50 to 100% by weight).

Examples of the inorganic filler used as the component (E) in the present invention include fused silica, crystalline silica, alumina, aluminum nitride, antimony trioxide, and the like. preferable. The average particle size of the inorganic filler is not particularly limited, but is usually 0.1 to 40 μm, preferably 0.3 to 40 μm.
A fine powder of about 20 μm can be used. The average particle diameter can be determined, for example, as a weight average value (or median diameter) by a laser diffraction method.

The amount of these inorganic fillers is at least 88% by weight of the total amount of the epoxy resin composition (usually 88 to 94%).
% By weight), and preferably 90 to 92% by weight, particularly preferably 90.1 to 91.0% by weight, because the desired low expansion and high fluidity of the cured product can be maintained. If the content is less than 88% by weight, the expansion coefficient increases, and the warpage of the package increases.

The inorganic filler may be one whose surface has been previously treated with a silane coupling agent or the like.
In this case, the silane coupling agent used to previously surface-treat the inorganic filler includes the aminosilane coupling agent described above, an epoxy-functional alkoxysilane,
Although a silane coupling agent such as a mercapto-functional alkoxysilane can be used, it is preferable to perform a surface treatment with an aminosilane coupling agent, and in this surface treatment, the silane coupling agent is added to the total amount of the inorganic filler. 0.1 to 0.8% by weight, preferably 0.2 to 0.
When used in an amount of 4% by weight, the wettability of the organic resin with respect to the inorganic filler is improved as in the case of the integral blend, the fluidity of the resin composition is improved, and the adhesive force at the interface between the organic resin and the inorganic filler is improved. Since the viscosity of the resin composition can be reduced, it is possible to prevent the wire from flowing, and it is possible to improve the reliability at the time of solder immersion by improving the adhesive force.

When an aminosilane coupling agent is used as a surface treating agent for the inorganic filler, the aminosilane coupling agent mixes the inorganic filler (E) with other components (A) to (D). Before the treatment, it is independent of the amount of the aminosilane coupling agent (D) in the composition.

In the epoxy resin composition of the present invention, in addition to the above components, if necessary, a coloring agent such as carbon black, a flame retardant such as a brominated epoxy resin, silicone oil, silicone rubber, epoxy resin, phenol resin, etc. A low stress component such as a copolymer of an aromatic resin and an organopolysiloxane can be added.

The resin composition of the present invention is prepared by mixing an epoxy resin, a phenol resin curing agent, an inorganic filler, a curing accelerator, and other additives at room temperature with a mixer and kneading with a general kneading machine such as a roll or an extruder. Then, after cooling, it can be pulverized into a molding material.

In order to prevent the wire from flowing, 1
The melt viscosity of the composition measured at 75 ° C. is desirably 200
It is not more than poise, more preferably not more than 180 poise.

Although the semiconductor device sealed with the epoxy resin composition of the present invention is not necessarily limited, it is particularly effective for BGA sealing. In addition, although a well-known method can be employ | adopted as a shaping | molding method, shaping | molding temperature is 160-180 degreeC normally.

[0047]

EXAMPLES The present invention will be described below in detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. In the following examples, all parts are parts by weight.

Examples 1 to 9 and Comparative Examples 1 to 8 Tables 1 to 4
The components shown in (1) and (2) were uniformly melted and mixed by a hot roll, cooled and pulverized to obtain an epoxy resin composition for semiconductor encapsulation.
In addition, the used epoxy resin, phenol resin curing agent,
The structures of the curing accelerator and the silane coupling agent are as follows.

[0049]

Embedded image

[0050]

Embedded image

[0051]

Embedded image

With respect to these compositions, the following (A) to (A)
Various characteristics of (u) were measured. The results are also shown in Tables 1 to 4. (A) Spiral flow value Using a mold conforming to the EMMI standard, 175 ° C, 70
The measurement was performed under the conditions of kgf / mm ² and a molding time of 90 sec. (B) Gelation time The gelation time of the composition was measured on a hot plate at 175 ° C. (C) Melt viscosity 175 using a high-low flow tester (manufactured by Shimadzu Corporation)
Measured in ° C. (D) Hardness at heating 175 ° C, 70 kgf / m according to JIS-K6944
4 × 10 × 100 m under the conditions of m ² and molding time of 60 sec
When a cured product of m was molded, its hot hardness was measured with a Barcol hardness meter. (E) Glass transition temperature and coefficient of linear expansion A test piece of 5 × 5 × 15 mm was molded under the conditions of 175 ° C., 70 kgf / mm ² , and a molding time of 90 sec. It was measured by raising the temperature at 5 ° C./min with a meter. (F) Storage stability Put the epoxy resin composition in a sealed aluminum bag,
It was left in a high temperature oven at 25 ° C. for 72 hours. The spiral flow value of the composition after standing was measured in the same manner as in (a), and the percentage decreased compared to the initial value was calculated. (G) Package warpage: 175 ° C, 70k on a substrate of 35 × 35 × 0.5mm
gf / mm ² and molding time 90 sec 32 × 32
After molding a test sample of × 1.2 mm, the amount of warpage of the mold resin surface was measured by a laser type undulation measuring device (manufactured by Yasunaga). Further, after the post-curing at 180 ° C. for 4 hours, the same measurement was performed again (indicated by the average value of 8 samples). (H) Substrate adhesion 175 on PSR4000 AUS5 coated BT substrate
° C., 70 kgf / mm ^2, after forming the frustoconical adhesive evaluation sample (area 10 mm ² of bottom surface bonded to the substrate), over a period of 4 hours post-cured at 180 ° C. under conditions of molding time 90 sec, 85 ℃, 85% RH, 72 hours → I
The sample was deteriorated under the condition of performing R reflow twice, and then the shear adhesive force was measured at a shear rate of 1 mm / sec using a push-pull gauge (indicated by the average value of 8 samples). (I) Water absorption 175 ° C., 70 kgf / mm ² , forming time: 90 seconds, forming a disk test piece having a diameter of 50 mm and a thickness of 3 mm; Under high temperature and high humidity conditions of 85% RH.
The weight change after standing for 8 hours was measured as the water absorption. (D) Flame retardancy A test piece having a size of 13 × 127 mm, a thickness of 1/8 inch and a thickness of 1/16 inch is formed under the conditions of 175 ° C., 70 kgf / mm ² , and a forming time of 90 sec. After curing, a flame retardancy test was performed according to the test method of UL-94V-0.

[0053]

[Table 1]

[0054]

[Table 2]

[0055]

[Table 3]

[0056]

[Table 4]

[0057]

The epoxy resin of the present invention containing a crystalline epoxy resin, a polyfunctional phenol resin curing agent, an organic phosphorus-based curing accelerator, and an aminosilane coupling agent and containing an inorganic filler in an amount exceeding 88% by weight. The composition has good fluidity, excellent fast curability, and excellent storage stability. Further, it has a high glass transition temperature, a low expansion coefficient, a small amount of warpage of the BGA package, good adhesion to a solder mask, and low water absorption. Also,
Since a large amount of an inorganic filler is contained, flame retardancy can be achieved without a flame retardant such as brominated phenol novolak or a flame retardant auxiliary such as antimony trioxide. Therefore, a semiconductor device using the epoxy resin composition of the present invention is excellent in crack resistance and reliability during reflow.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 63/00 C08L 63/00 B H01L 23/29 H01L 23/30 R 23/31 (72) Inventor Shiobara Toshio 1-10 Hitomi, Matsuida-machi, Usui-gun, Gunma Prefecture Shin-Etsu Chemical Co., Ltd. Silicone Electronic Materials Technology Laboratory

Claims (5)

[Claims] (A) a crystalline epoxy resin, (B) a polyfunctional phenol resin represented by the following general formula (1),
An epoxy for semiconductor encapsulation, comprising (C) an organic phosphorus-based curing accelerator, (D) an aminosilane coupling agent, and (E) at least 88% by weight of an inorganic filler based on the total amount of the composition. Resin composition. Embedded image (Wherein, R is a hydrogen atom, a methyl group or an ethyl group, R ′ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and m is 1
-4. ) 2. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein (A) the crystalline epoxy resin is represented by the following general formulas (2) to (5). Embedded image (In the above formulas (2) to (4), R ^{1 to} R ^{8 each} represent a hydrogen atom or the same or different alkyl group having 1 to 4 carbon atoms;
Is an integer of 0 to 4. ) (In the above formula (5), R ^{1 to} R ¹⁰ represent a hydrogen atom or the same or different alkyl group having 1 to 6 carbon atoms, and n represents 0 to
4 is an integer. ) 3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein (C) the organic phosphorus-based curing accelerator is represented by the following general formula (6). Embedded image (In the formula, R ¹¹ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.) 4. The (D) aminosilane coupling agent is an amino-functional alkoxysilane represented by the following general formula (7) and / or a partially hydrolyzed condensate thereof.
4. The epoxy resin composition for semiconductor encapsulation according to 2 or 3. Embedded image (In the formula, A -CH ₃ or -C ₂ H _5, R ¹² is a hydrogen atom,
—C ₂ H ₄ NH ₂ or —C ₆ H ₅ , a represents 0 or 1. ) 5. A semiconductor device encapsulated with a cured product of the epoxy resin composition for semiconductor encapsulation according to claim 1. Description: