JP2000053946A - 研磨材組成物 - Google Patents

研磨材組成物

Info

Publication number
JP2000053946A
JP2000053946A JP10222005A JP22200598A JP2000053946A JP 2000053946 A JP2000053946 A JP 2000053946A JP 10222005 A JP10222005 A JP 10222005A JP 22200598 A JP22200598 A JP 22200598A JP 2000053946 A JP2000053946 A JP 2000053946A
Authority
JP
Japan
Prior art keywords
coupling agent
polishing
abrasive
oxide
abrasive grain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10222005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000053946A5 (enExample
Inventor
Takanori Kido
高徳 貴堂
Kagetaka Ichikawa
景隆 市川
Nobuo Uotani
信夫 魚谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP10222005A priority Critical patent/JP2000053946A/ja
Publication of JP2000053946A publication Critical patent/JP2000053946A/ja
Publication of JP2000053946A5 publication Critical patent/JP2000053946A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP10222005A 1998-08-05 1998-08-05 研磨材組成物 Pending JP2000053946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10222005A JP2000053946A (ja) 1998-08-05 1998-08-05 研磨材組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10222005A JP2000053946A (ja) 1998-08-05 1998-08-05 研磨材組成物

Publications (2)

Publication Number Publication Date
JP2000053946A true JP2000053946A (ja) 2000-02-22
JP2000053946A5 JP2000053946A5 (enExample) 2005-10-27

Family

ID=16775616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10222005A Pending JP2000053946A (ja) 1998-08-05 1998-08-05 研磨材組成物

Country Status (1)

Country Link
JP (1) JP2000053946A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020055308A (ko) * 2000-12-28 2002-07-08 박종섭 화학적 기계적 연마용 패드 및 그 제조 방법
WO2002067309A1 (en) * 2001-02-20 2002-08-29 Hitachi Chemical Co., Ltd. Polishing compound and method for polishing substrate
JP2003277731A (ja) * 2002-03-26 2003-10-02 Catalysts & Chem Ind Co Ltd 研磨用粒子および研磨材
JP2004502824A (ja) * 2000-07-05 2004-01-29 キャボット　マイクロエレクトロニクス　コーポレイション Ｃｍｐのためのシラン含有研磨組成物
US7354861B1 (en) 1998-12-03 2008-04-08 Kabushiki Kaisha Toshiba Polishing method and polishing liquid
US8084363B2 (en) 2001-10-31 2011-12-27 Hitachi Chemical Co., Ltd. Polishing slurry and polishing method
WO2012169515A1 (ja) * 2011-06-08 2012-12-13 株式会社 フジミインコーポレーテッド 研磨材及び研磨用組成物
WO2026078797A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 砥粒、スラリ、研磨方法、及び、部品の製造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7354861B1 (en) 1998-12-03 2008-04-08 Kabushiki Kaisha Toshiba Polishing method and polishing liquid
JP2004502824A (ja) * 2000-07-05 2004-01-29 キャボット　マイクロエレクトロニクス　コーポレイション Ｃｍｐのためのシラン含有研磨組成物
KR20020055308A (ko) * 2000-12-28 2002-07-08 박종섭 화학적 기계적 연마용 패드 및 그 제조 방법
CN1746255B (zh) * 2001-02-20 2010-11-10 日立化成工业株式会社 抛光剂及基片的抛光方法
WO2002067309A1 (en) * 2001-02-20 2002-08-29 Hitachi Chemical Co., Ltd. Polishing compound and method for polishing substrate
US6786945B2 (en) 2001-02-20 2004-09-07 Hitachi Chemical Co., Ltd. Polishing compound and method for polishing substrate
US8084362B2 (en) 2001-10-31 2011-12-27 Hitachi Chemical Co., Ltd. Polishing slurry and polishing method
US8084363B2 (en) 2001-10-31 2011-12-27 Hitachi Chemical Co., Ltd. Polishing slurry and polishing method
US8481428B2 (en) 2001-10-31 2013-07-09 Hitachi Chemical Co., Ltd. Polishing slurry and polishing method
JP2003277731A (ja) * 2002-03-26 2003-10-02 Catalysts & Chem Ind Co Ltd 研磨用粒子および研磨材
WO2012169515A1 (ja) * 2011-06-08 2012-12-13 株式会社 フジミインコーポレーテッド 研磨材及び研磨用組成物
CN103596727A (zh) * 2011-06-08 2014-02-19 福吉米株式会社 研磨材料和研磨用组合物
JPWO2012169515A1 (ja) * 2011-06-08 2015-02-23 株式会社フジミインコーポレーテッド 研磨材及び研磨用組成物
WO2026078797A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 砥粒、スラリ、研磨方法、及び、部品の製造方法
WO2026079355A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 砥粒、スラリ、研磨方法、部品の製造方法、及び、半導体部品の製造方法
WO2026079357A1 (ja) * 2024-10-08 2026-04-16 株式会社レゾナック 砥粒、スラリ、研磨方法、部品の製造方法、及び、半導体部品の製造方法

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