JP2000052230A - ウェーハ研磨パッドのツルーイング装置 - Google Patents

ウェーハ研磨パッドのツルーイング装置

Info

Publication number
JP2000052230A
JP2000052230A JP21837198A JP21837198A JP2000052230A JP 2000052230 A JP2000052230 A JP 2000052230A JP 21837198 A JP21837198 A JP 21837198A JP 21837198 A JP21837198 A JP 21837198A JP 2000052230 A JP2000052230 A JP 2000052230A
Authority
JP
Japan
Prior art keywords
truing
polishing pad
arm
grindstone
contact angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21837198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000052230A5 (enExample
Inventor
Jiro Kajiwara
治郎 梶原
Masahito Komazaki
雅人 駒崎
Hitoaki Sano
仁朗 佐野
Kenji Fujimoto
憲司 藤本
Hitoshi Adachi
仁 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAIBEKKU NANO TECHNOL Inc
Mitsubishi Materials Corp
Original Assignee
SAIBEKKU NANO TECHNOL Inc
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAIBEKKU NANO TECHNOL Inc, Mitsubishi Materials Corp filed Critical SAIBEKKU NANO TECHNOL Inc
Priority to JP21837198A priority Critical patent/JP2000052230A/ja
Publication of JP2000052230A publication Critical patent/JP2000052230A/ja
Publication of JP2000052230A5 publication Critical patent/JP2000052230A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP21837198A 1998-07-31 1998-07-31 ウェーハ研磨パッドのツルーイング装置 Pending JP2000052230A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21837198A JP2000052230A (ja) 1998-07-31 1998-07-31 ウェーハ研磨パッドのツルーイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21837198A JP2000052230A (ja) 1998-07-31 1998-07-31 ウェーハ研磨パッドのツルーイング装置

Publications (2)

Publication Number Publication Date
JP2000052230A true JP2000052230A (ja) 2000-02-22
JP2000052230A5 JP2000052230A5 (enExample) 2005-09-29

Family

ID=16718857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21837198A Pending JP2000052230A (ja) 1998-07-31 1998-07-31 ウェーハ研磨パッドのツルーイング装置

Country Status (1)

Country Link
JP (1) JP2000052230A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048147A (ja) * 2001-07-31 2003-02-18 Applied Materials Inc 研磨パッドのコンディショニング装置及びこれを用いた研磨装置
JP2003059873A (ja) * 2001-06-29 2003-02-28 Samsung Electronics Co Ltd 半導体研磨装置のパッドコンディショナ及びそのパッドコンディショナをモニタリングする方法
US9849557B2 (en) 2015-01-30 2017-12-26 Ebara Corporation Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059873A (ja) * 2001-06-29 2003-02-28 Samsung Electronics Co Ltd 半導体研磨装置のパッドコンディショナ及びそのパッドコンディショナをモニタリングする方法
JP2003048147A (ja) * 2001-07-31 2003-02-18 Applied Materials Inc 研磨パッドのコンディショニング装置及びこれを用いた研磨装置
US9849557B2 (en) 2015-01-30 2017-12-26 Ebara Corporation Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body
US10442054B2 (en) 2015-01-30 2019-10-15 Ebara Corporation Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body

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