JP2000034416A5 - - Google Patents

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Publication number
JP2000034416A5
JP2000034416A5 JP1999126842A JP12684299A JP2000034416A5 JP 2000034416 A5 JP2000034416 A5 JP 2000034416A5 JP 1999126842 A JP1999126842 A JP 1999126842A JP 12684299 A JP12684299 A JP 12684299A JP 2000034416 A5 JP2000034416 A5 JP 2000034416A5
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JP
Japan
Prior art keywords
water
soluble substance
polymer
thermoplastic polymer
insoluble thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999126842A
Other languages
English (en)
Japanese (ja)
Other versions
JP3918359B2 (ja
JP2000034416A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12684299A priority Critical patent/JP3918359B2/ja
Priority claimed from JP12684299A external-priority patent/JP3918359B2/ja
Publication of JP2000034416A publication Critical patent/JP2000034416A/ja
Publication of JP2000034416A5 publication Critical patent/JP2000034416A5/ja
Application granted granted Critical
Publication of JP3918359B2 publication Critical patent/JP3918359B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP12684299A 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド Expired - Lifetime JP3918359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12684299A JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13352798 1998-05-15
JP10-133527 1998-05-15
JP12684299A JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

Publications (3)

Publication Number Publication Date
JP2000034416A JP2000034416A (ja) 2000-02-02
JP2000034416A5 true JP2000034416A5 (enExample) 2004-12-16
JP3918359B2 JP3918359B2 (ja) 2007-05-23

Family

ID=26462949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12684299A Expired - Lifetime JP3918359B2 (ja) 1998-05-15 1999-05-07 研磨パッド用重合体組成物および研磨パッド

Country Status (1)

Country Link
JP (1) JP3918359B2 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6953388B2 (en) 1999-12-22 2005-10-11 Toray Industries, Inc. Polishing pad, and method and apparatus for polishing
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP2002190460A (ja) 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6855034B2 (en) * 2001-04-25 2005-02-15 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
JP2003311604A (ja) * 2002-04-26 2003-11-05 Chiyoda Kk 研磨パッド
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
EP1588803A1 (en) 2004-04-21 2005-10-26 JSR Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method
EP1637281B1 (en) 2004-09-17 2008-05-28 JSR Corporation Chemical mechanical polishing pad and chemical mechanical polishing process
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
US7357703B2 (en) 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
EP1975985A4 (en) 2006-01-25 2011-08-10 Jsr Corp CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
JP2009117815A (ja) 2007-10-18 2009-05-28 Jsr Corp 化学機械研磨パッドの製造方法
JPWO2009072405A1 (ja) * 2007-12-07 2011-04-21 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
JP5248954B2 (ja) 2008-09-02 2013-07-31 スリーエム イノベイティブ プロパティズ カンパニー 抱接化合物を含む研磨材製品
US8944888B2 (en) 2010-07-12 2015-02-03 Jsr Corporation Chemical-mechanical polishing pad and chemical-mechanical polishing method
KR101656414B1 (ko) * 2014-10-22 2016-09-12 주식회사 케이씨텍 분산성이 개선된 슬러리 조성물
EP3892418B1 (en) 2018-12-03 2026-03-04 Kuraray Co., Ltd. Polyurethane for polishing layers, polishing layer and polishing pad

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63212464A (ja) * 1987-02-26 1988-09-05 Nikko Rika Kk 研磨板
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JPH07214473A (ja) * 1994-02-01 1995-08-15 Takino Gomme Seisakusho:Kk ゴム質研磨材とその製法
JPH10204418A (ja) * 1997-01-27 1998-08-04 Kao Corp 研磨材組成物及びこれを用いたカーボン材料からなる基板の製造方法
KR100499601B1 (ko) * 1997-08-06 2005-07-07 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 개선된 연마용 패드 및 연마 방법
JPH11285961A (ja) * 1998-04-03 1999-10-19 Nikon Corp 研磨パッド及び研磨方法

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