AU2001291016A1 - Polishing pad comprising particulate polymer and crosslinked polymer binder - Google Patents
Polishing pad comprising particulate polymer and crosslinked polymer binderInfo
- Publication number
- AU2001291016A1 AU2001291016A1 AU2001291016A AU9101601A AU2001291016A1 AU 2001291016 A1 AU2001291016 A1 AU 2001291016A1 AU 2001291016 A AU2001291016 A AU 2001291016A AU 9101601 A AU9101601 A AU 9101601A AU 2001291016 A1 AU2001291016 A1 AU 2001291016A1
- Authority
- AU
- Australia
- Prior art keywords
- particulate
- crosslinked
- polymer
- polishing pad
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A polishing pad is described as comprising, (a) particulate polymer selected from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) crosslinked organic polymer binder (e.g., crosslinked polyurethane binder and/or crosslinked polyepoxide binder), which binds the particulate polymer together. The particulate polymer and crosslinked organic polymer binder are distributed substantially uniformly throughout the polishing pad, and the pad has a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad. Polishing pad assemblies are also described.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09663180 | 2000-09-15 | ||
US09/663,180 US6477926B1 (en) | 2000-09-15 | 2000-09-15 | Polishing pad |
PCT/US2001/028948 WO2002022309A1 (en) | 2000-09-15 | 2001-09-14 | Polishing pad comprising particulate polymer and crosslinked polymer binder |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001291016A1 true AU2001291016A1 (en) | 2002-03-26 |
Family
ID=24660789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001291016A Abandoned AU2001291016A1 (en) | 2000-09-15 | 2001-09-14 | Polishing pad comprising particulate polymer and crosslinked polymer binder |
Country Status (8)
Country | Link |
---|---|
US (1) | US6477926B1 (en) |
EP (1) | EP1318891B1 (en) |
CN (1) | CN100346930C (en) |
AT (1) | ATE293516T1 (en) |
AU (1) | AU2001291016A1 (en) |
DE (1) | DE60110248T2 (en) |
TW (1) | TW550165B (en) |
WO (1) | WO2002022309A1 (en) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020016139A1 (en) * | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
US6846225B2 (en) * | 2000-11-29 | 2005-01-25 | Psiloquest, Inc. | Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
US20030045214A1 (en) * | 2001-08-29 | 2003-03-06 | Shepherd Ross L. | Decorative applique remover |
US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
US7399516B2 (en) * | 2002-05-23 | 2008-07-15 | Novellus Systems, Inc. | Long-life workpiece surface influencing device structure and manufacturing method |
US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
WO2004028744A1 (en) * | 2002-09-25 | 2004-04-08 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
EP1542831A1 (en) * | 2002-09-25 | 2005-06-22 | PPG Industries Ohio, Inc. | Polishing pad for planarization |
US7267607B2 (en) * | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
JP3910921B2 (en) * | 2003-02-06 | 2007-04-25 | 株式会社東芝 | Polishing cloth and method for manufacturing semiconductor device |
US7066801B2 (en) | 2003-02-21 | 2006-06-27 | Dow Global Technologies, Inc. | Method of manufacturing a fixed abrasive material |
US6910951B2 (en) | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
GB2402941B (en) * | 2003-06-09 | 2007-06-27 | Kao Corp | Method for manufacturing substrate |
US7074115B2 (en) * | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
US7335239B2 (en) * | 2003-11-17 | 2008-02-26 | Advanced Technology Materials, Inc. | Chemical mechanical planarization pad |
US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
US7132033B2 (en) * | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
TWI385050B (en) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
SG160368A1 (en) * | 2005-03-08 | 2010-04-29 | Toyo Tire & Rubber Co | Polishing pad and process for producing the same |
KR100949560B1 (en) * | 2005-05-17 | 2010-03-25 | 도요 고무 고교 가부시키가이샤 | Polishing pad |
JP4884725B2 (en) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | Polishing pad |
JP5031236B2 (en) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | Polishing pad |
WO2008026451A1 (en) | 2006-08-28 | 2008-03-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5008927B2 (en) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | Polishing pad |
US8591764B2 (en) * | 2006-12-20 | 2013-11-26 | 3M Innovative Properties Company | Chemical mechanical planarization composition, system, and method of use |
US7824249B2 (en) * | 2007-02-05 | 2010-11-02 | San Fang Chemical Industry Co., Ltd. | Polishing material having polishing particles and method for making the same |
JP5078000B2 (en) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | Polishing pad |
US20080274674A1 (en) * | 2007-05-03 | 2008-11-06 | Cabot Microelectronics Corporation | Stacked polishing pad for high temperature applications |
US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
US8303375B2 (en) | 2009-01-12 | 2012-11-06 | Novaplanar Technology, Inc. | Polishing pads for chemical mechanical planarization and/or other polishing methods |
WO2010123744A2 (en) * | 2009-04-23 | 2010-10-28 | Cabot Microelectronics Corporation | Cmp porous pad with particles in a polymeric matrix |
TWI404596B (en) * | 2009-09-22 | 2013-08-11 | San Fang Chemical Industry Co | Method for manufacturing polishing pad and polishing pad |
SG181890A1 (en) * | 2009-12-22 | 2012-07-30 | 3M Innovative Properties Co | Polishing pad and method of making the same |
WO2011129433A1 (en) * | 2010-04-15 | 2011-10-20 | 三井化学株式会社 | Spun-bonded nonwoven fabric, process for producing same, and use thereof |
US8992643B2 (en) * | 2010-12-30 | 2015-03-31 | Saint-Gobain Abrasives, Inc. | Imide cross-linked binders for abrasive articles |
US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
US9439334B2 (en) | 2012-04-03 | 2016-09-06 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
WO2014149926A1 (en) | 2013-03-15 | 2014-09-25 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
CN103878707B (en) * | 2014-03-31 | 2016-04-13 | 湖北鼎龙化学股份有限公司 | Polishing pad of chemically mechanical polishing and preparation method thereof |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
SG10202002601QA (en) | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
TWI689406B (en) * | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | Polishing pad and method of fabricating the same |
WO2016062879A1 (en) * | 2014-10-24 | 2016-04-28 | Basf Se | Abrasive elements and method for producing said abrasive elements |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
CN106041719B (en) * | 2016-06-03 | 2018-10-23 | 湖北鼎龙控股股份有限公司 | A kind of polishing layer and preparation method thereof and chemical mechanical polishing pads |
NL2017319B1 (en) * | 2016-08-16 | 2018-02-21 | Van Blitterswijk Johannes | Composition comprising thermoset polyurethane polymer particles provided with thermoplastic polymer particles |
US20180134918A1 (en) * | 2016-11-11 | 2018-05-17 | Jh Rhodes Company, Inc. | Soft polymer-based material polishing media |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
KR101949905B1 (en) * | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | Porous polyurethane polishing pad and preparation method thereof |
US11179822B2 (en) * | 2017-08-31 | 2021-11-23 | Hubei Dinghui Microelectronics Materials Co., Ltd | Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material |
WO2019173455A1 (en) | 2018-03-07 | 2019-09-12 | X-Card Holdings, Llc | Metal card |
CN112654655A (en) | 2018-09-04 | 2021-04-13 | 应用材料公司 | Advanced polishing pad formulations |
US11845156B2 (en) * | 2019-07-12 | 2023-12-19 | Cmc Materials, Inc. | Polishing pad employing polyamine and cyclohexanedimethanol curatives |
KR102293765B1 (en) * | 2019-11-21 | 2021-08-26 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (26)
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US3763054A (en) | 1970-12-07 | 1973-10-02 | Bayer Ag | Process for the production of microporous polyurethane (urea) sheet structures permeable to water vapor |
US4576612A (en) * | 1984-06-01 | 1986-03-18 | Ferro Corporation | Fixed ophthalmic lens polishing pad |
US4893439A (en) * | 1987-04-14 | 1990-01-16 | Minnesota Mining And Manufacturing Company | Abrasive article containing helically crimped fibers |
US4880843A (en) | 1988-03-28 | 1989-11-14 | Hoechst Celanese Corporation | Composition and process for making porous articles from ultra high molecular weight polyethylene |
US4933373A (en) * | 1989-04-06 | 1990-06-12 | Minnesota Mining And Manufacturing Company | Abrasive wheels |
US5282900A (en) * | 1992-03-19 | 1994-02-01 | Minnesota Mining And Manufacturing Company | Nonwoven surface treating articles, system including same, and method of treating calcium carbonate-containing surfaces with said system |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5681612A (en) * | 1993-06-17 | 1997-10-28 | Minnesota Mining And Manufacturing Company | Coated abrasives and methods of preparation |
US5667842A (en) * | 1993-10-27 | 1997-09-16 | Minnesota Mining And Manufacturing Company | Abrasive articles incorporating addition polymerizable resins and reactive diluents, and methods of making said abrasive articles |
US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
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WO1996015887A1 (en) | 1994-11-23 | 1996-05-30 | Rodel, Inc. | Polishing pads and methods for their manufacture |
CA2207223A1 (en) | 1994-12-16 | 1996-06-20 | Ppg Industries, Inc. | Isocyanate cured coating having reduced yellowing |
US5976000A (en) | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
WO1998003306A1 (en) * | 1996-07-23 | 1998-01-29 | Minnesota Mining And Manufacturing Company | Structured abrasive article containing hollow spherical filler |
US5876268A (en) * | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
US6022268A (en) | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
EP1015176B1 (en) | 1997-04-04 | 2003-03-12 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
EP1011922B1 (en) | 1997-04-18 | 2002-11-06 | Cabot Microelectronics Corporation | Polishing pad for a semiconductor substrate |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US5876470A (en) * | 1997-08-01 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Abrasive articles comprising a blend of abrasive particles |
EP1011919B1 (en) | 1997-08-06 | 2004-10-20 | Rodel Holdings, Inc. | Method of manufacturing a polishing pad |
US6174227B1 (en) * | 1997-11-07 | 2001-01-16 | Nikon Corporation | Polishing pad and polishing apparatus using the same |
GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6312484B1 (en) * | 1998-12-22 | 2001-11-06 | 3M Innovative Properties Company | Nonwoven abrasive articles and method of preparing same |
-
2000
- 2000-09-15 US US09/663,180 patent/US6477926B1/en not_active Expired - Fee Related
-
2001
- 2001-09-14 TW TW090122915A patent/TW550165B/en not_active IP Right Cessation
- 2001-09-14 EP EP01971086A patent/EP1318891B1/en not_active Expired - Lifetime
- 2001-09-14 CN CNB018188664A patent/CN100346930C/en not_active Expired - Fee Related
- 2001-09-14 AT AT01971086T patent/ATE293516T1/en not_active IP Right Cessation
- 2001-09-14 AU AU2001291016A patent/AU2001291016A1/en not_active Abandoned
- 2001-09-14 DE DE60110248T patent/DE60110248T2/en not_active Expired - Fee Related
- 2001-09-14 WO PCT/US2001/028948 patent/WO2002022309A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US6477926B1 (en) | 2002-11-12 |
EP1318891A1 (en) | 2003-06-18 |
DE60110248D1 (en) | 2005-05-25 |
ATE293516T1 (en) | 2005-05-15 |
CN100346930C (en) | 2007-11-07 |
DE60110248T2 (en) | 2006-03-09 |
WO2002022309A1 (en) | 2002-03-21 |
CN1474735A (en) | 2004-02-11 |
TW550165B (en) | 2003-09-01 |
EP1318891B1 (en) | 2005-04-20 |
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