JP2000022199A - Semiconductor relay - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor relay in which output signal can be controlled normally. SOLUTION: The semiconductor relay comprises an input terminal 1 arranged with an element 7 for emitting light an optical signal based on an input signal, a terminal 2 arranged with a light receiving element 8 disposed oppositely to the light receiving element 7 in order to receive the optical signal, an output terminal 4 arranged with an element 10 for controlling an output signal based on an optical signal received by the light receiving element 8, an interconnecting terminal 3 connected through a wire 9 with the light receiving element 8 and through a wire 11 with the control element 10, first translucent sealing resin 5 sealing the light receiving element 7, the light receiving element 8 and the wire 9, and second translucent sealing resin 6 for sealing the control element 10 and the wire 11 and also sealing the first sealing resin 5 from the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor relay which opens and closes via transmission and reception of an optical signal.

[0002]

2. Description of the Related Art Conventionally, as this kind of semiconductor relay, there is one shown in FIGS. This is the input terminal
A, light receiving element terminal B, output terminal C, first sealing resin
D, and a second sealing resin E. Input terminal A
A light emitting element F that emits an optical signal based on an input signal is provided. The light receiving element terminal B is provided with a light receiving element G facing the light emitting element F so as to receive an optical signal. The output terminal C is provided with a control element H for controlling an output signal based on an optical signal received by the light receiving element G. The control element H is connected to a light receiving element G and a light receiving element terminal B by a wire J. The first sealing resin D is translucent and seals together the light emitting element F, the light receiving element G, the control element H, and the wire J. The second sealing resin E 2 is light-shielding and seals the first sealing resin D 1 from outside.

[0003]

In the above-described conventional semiconductor relay, the control element H is sealed together with the light emitting element F and the light receiving element G by the first sealing resin D. The light of the element F is irradiated, and the output signal may not be normally controlled by the irradiated light.

Therefore, in order to control the output signal normally, when the light emitting element F and the light receiving element G are both sealed with the first sealing resin D, the control element H is sealed. However, since the control element H is connected to the light receiving element via the wire J, it is impossible to seal both the light emitting element F and the light receiving element G without sealing the control element H. I have.

An object of the present invention is to provide a semiconductor relay capable of normally controlling an output signal, which has been made in view of the above points.

[0006]

According to a first aspect of the present invention, there is provided an input terminal provided with a light emitting element for emitting an optical signal based on an input signal, and a light receiving element for receiving the optical signal. A light-receiving element terminal provided with a light-receiving element facing the light-emitting element, an output terminal provided with a control element for controlling an output signal based on an optical signal received by the light-receiving element, and a light-receiving element. A relay terminal connected to the control element by the control element connecting wire and connected to the control element by the light receiving element connecting wire, and a light-transmitting first sealing both the light emitting element, the light receiving element, and the light receiving element connecting wire. The configuration includes a sealing resin, a light-blocking second sealing resin that seals the control element and the control element connection wire together, and seals the first sealing resin from the outside.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. This semiconductor relay
An input terminal 1, a light receiving element terminal 2, a relay terminal 3, an output terminal 4, a first sealing resin 5, and a second sealing resin 6 are provided.

The input terminal 1 is provided with a light emitting element 7 that emits light according to an input signal. The light-receiving element terminal 2
Light-receiving element 8 opposes light-emitting element 7 to receive an optical signal.
Is provided. The relay terminal 3 is arranged on the same plane as the light-receiving element terminal 2 and is connected by a light-receiving element connection wire 9 connected to the light-receiving element 8. Output terminal
Reference numeral 4 denotes a position where a MOSFET (control element) 10 is provided on the same plane as the relay terminal 3, and the MOSFET 10 is connected to the relay terminal 3 by a control element connection wire 11. The MOSFET 10 controls an output signal based on an optical signal received by the light receiving element 8. Specifically, this MO
The SFET 10 is of a so-called normally closed type, and controls the output of an output signal when the light receiving element 8 receives an optical signal.

The first sealing resin 5 is translucent and seals the light emitting element 7 and the light receiving element 8 and also seals the light receiving element connecting wire 9. The second sealing resin 6 is light-shielding, seals the first sealing resin 5 from the outside, and also includes a MOSFET 10 and a control element connection wire 11.
Is sealed.

Next, a description will be given of a manufacturing procedure of the device. The light receiving element terminal 2 and the relay terminal 3 are formed by cutting from the same lead frame 12.

First, a light receiving element 8 is provided at a predetermined position of a lead frame 12 serving as a light receiving element terminal 2 by die bonding, and a predetermined wire bonding is performed on the light receiving element 8. Specifically, the light receiving element 8 is wire-bonded to a predetermined position of the lead frame 12 to be the light receiving element terminal 2 and the light receiving element 8 is connected to the predetermined position of the lead frame 12 to be the relay terminal 3 by the light receiving element connecting wire 9. Connect. On the other hand, a light emitting element 7 is provided at the tip of the input terminal 1 by die bonding, and predetermined wire bonding is performed.
As shown in (a), this input terminal 1 is
2

Next, as shown in FIG. 3 (b) and FIG. 4 (b), the input terminal 1
The light receiving element 8 in the lead frame 12 is
By sealing the vicinity of the location where is provided, the light emitting element 7,
The light-receiving element 8 and the light-receiving element connection wire 9 are sealed, and the lead frame 12 is cut off.
After the relay terminal 3 is formed, the gate terminal of the MOSFET 10 provided to the output side terminal 4 by die bonding is connected to the relay terminal 3 by the control element connection wire 11, and the MOSFET 10 is connected to the light receiving element terminal 2 by a wire. Bonding.

Next, the first sealing resin 5 is sealed from the outside with the second sealing resin 6 along with the portion of the lead frame 12 where the MOSFET 10 is provided and the relay terminal 3, so that the MOSFET 10 and the Control element connection wire
When 11 is sealed, the semiconductor relay shown in FIGS. 1 and 2 is obtained.

In such a semiconductor relay, MOSF
The ET 10 is not directly connected to the light receiving element 8 by a wire, but is connected to the relay terminal 3 connected to the light receiving element 8 by the light receiving element connecting wire 9 by the control element connecting wire 11. Without sealing, the light-emitting element 7 can be formed by the light-transmitting first sealing resin 4.
And the light receiving element 8 can be sealed, so that the light of the light emitting element 7 is not irradiated to the MOSFET 10, so that the output signal is controlled by irradiating the MOSFET 10 with the light of the light emitting element 7. As a result, the increase in the leakage current at the time of OFF does not occur, and the output signal can be controlled normally.

In this embodiment, the MOSFET 10
The normally-closed type, but the normally-open type, which controls so that the output signal is not output when the light-receiving element 8 receives the optical signal, can also be applied to the output by irradiating the MOSFET 10 with the light of the light-emitting element 7. An increase in the offset voltage at the time of ON, which is an influence of the signal control, does not occur.

[0016]

According to the first aspect of the present invention, the control element is not directly connected to the light receiving element by a wire, but is connected to the relay terminal connected to the light receiving element by the light receiving element connecting wire. Connected by
The light-emitting element and the light-receiving element can be sealed with the light-transmitting first sealing resin without sealing the control element, so that light from the light-emitting element is irradiated to the control element. Since the control element is not irradiated with light from the light emitting element, the control of the output signal is not affected, and the output signal can be controlled normally.

[Brief description of the drawings]

FIG. 1 is a plan sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line YY of FIG.

FIG. 3 is a plan sectional view showing the manufacturing method of the above.

FIG. 4 is a front sectional view showing the manufacturing method according to the first embodiment;

FIG. 5 is a plan sectional view of a conventional example.

FIG. 6 is a sectional view taken along line XX of FIG. 1;

[Explanation of symbols]

 1 input terminal 2 light receiving element terminal 3 relay terminal 4 output terminal 5 first sealing resin 6 second sealing resin 7 light emitting element 8 light receiving element 9 light receiving element connection wire 10 MOSFET (control element) 11 control Element connection wire

Claims (1)

[Claims] An input terminal provided with a light emitting element for emitting an optical signal based on the input signal; a light receiving element terminal provided with a light receiving element opposed to the light emitting element to receive the optical signal; An output terminal provided with a control element that controls an output signal based on the light signal received by the element, is connected to a control element by a control element connection wire, and is connected to a light receiving element connection wire connected to the light receiving element. And a first translucent resin that seals the light emitting element, the light receiving element, and the light receiving element connecting wire together, and the control element and the control element connecting wire. And a light-shielding second sealing resin for sealing the sealing resin from the outside.