JPH05136452A - Semiconductor relay and its manufacture - Google Patents

Abstract

PURPOSE:To transmit a signal inputted to a light emitting diode to a photovoltaic device efficiently by a method wherein a light transmission path with little light loss is formed between the light emitting diode and the photovoltaic device which are so provided as to face each other for photocoupling. CONSTITUTION:A light emitting diode 1 which is mounted on a first lead frame 2 on an input side and the light receiving part of a photovoltaic device 4 which is mounted on a second lead frame 6 on an output side and drives a MOS-FET device 5 which operates as a switching device are linked with each other with a light shielding insulating tube 3 whose outer wall is so treated as not to transmit a light and the inside of the light shielding insulating tube 3 is filled with transparent insulating filling material 7. With this constitution, light leakage from the inside of the light shielding insulating tube 3 can be avoided and, further, a light transmission path whose shape is fixed and which has little light loss can be formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor relay, and more particularly to the structure of a semiconductor relay having high accuracy and high reliability.
And a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, a semiconductor relay has been constructed as shown in FIG. Referring to FIG. 3, the conventional semiconductor relay includes a light emitting diode 31 that emits light according to an input current,
A light emitting diode is provided which includes a main body of a semiconductor relay including a photovoltaic element 32 which receives light emitted from a light emitting diode to generate an electromotive force and a MOSFET element 33 which operates by the electromotive force of the photovoltaic element. 1st with 31
The lead frame 34 and the second lead frame 35 on which the MOSFET element and the photovoltaic element 32 are mounted face each other. In this semiconductor relay, the photovoltaic element 32 and the light emitting diode 31 are respectively covered with a transparent filling material 36, assembled to face each other, the filling material 36 is connected, and then the outer wall is covered with an opaque resin 37. This formed the optical path.

[0003]

The problem to be solved is to fill the transparent filler on the photovoltaic element and the light emitting diode, and to prevent the filler from flowing out in the process of connecting to the opposing structure. The point is that the optical path of the connecting portion is likely to be narrowed. In addition, when the outer wall of the connecting portion formed of the filling material is covered with an opaque resin, a pinhole or the like is generated to cause light leakage, and the light transmission efficiency is reduced.

[0004]

A light emitting diode that emits light with an input current, a photovoltaic element that receives light emitted from the light emitting diode to generate electromotive force, and operates with electromotive force of the photovoltaic element A semiconductor relay body including a MOSFET element is provided, a light emitting diode is mounted on a first lead frame, and a MOSFET element and a photovoltaic element are mounted on a second lead frame. When configuring the semiconductor relay so that the lead frame of 2 has an opposing structure, an insulative tube with light shielding on the outer wall is fixed in advance on the light receiving part of the photovoltaic element with a silicone resin adhesive. After assembling the lead frame so that the light emitting diode is inserted into the opening of the tube, mount the light emitting diode inside the light-shielding insulating tube. Than the gap of the first side of the lead frame, by filling a transparent insulating filling material,
The feature is that the shape is stabilized and a light transmission path without light leakage is formed.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing a first embodiment of a semiconductor relay according to the present invention. In FIG. 1, 1 is a light emitting diode, 2 is a first lead frame, 3 is a light-shielding insulating tube, 4 is a photovoltaic element, 5 is a MOSFET element, 6 is a second lead frame, and 7 is an insulating filler. , 8 are molding materials. In FIG. 1, the light emitting diode 1 is a first
Mounted on the lead frame 2 of the above, and on the other hand, a photovoltaic element 4 in which a light-shielding insulating tube 3 is connected to the light receiving part, and a MOS
The FET element 5 is mounted on the second lead frame 6. After fixing the first and second lead frames 2 and 6 in a facing structure so that the light emitting diode 1 is inserted inside the light-shielding insulating tube 3, the light-shielding insulating tube 3 is optically transparent. The insulating filler 7 is filled. This is molded with the molding material 7,
The lead frame is cut to complete a semiconductor relay. In this semiconductor relay, the light emitting diode 1 emits light in response to an input signal to an input terminal formed on the side of the first lead frame 2, and this light passes through the inside of the insulating filler 7 inside the light shielding insulating tube 3. The light passes through and is applied to the light receiving portion of the photovoltaic element 4. The received photovoltaic element 4 generates a photovoltaic force, and drives the MOSFET element 4 as a switching element to perform a switching operation. As a result, the pair of output terminals formed on the second lead frame 5 is closed, and the relay is turned on.

Next, a second embodiment of the semiconductor relay according to the present invention will be described. FIG. 2 is a schematic diagram showing a second embodiment of the semiconductor relay according to the present invention. In FIG. 2, 2
1 is a light emitting diode, 22 is a first lead frame, 2
3 is a light-shielding insulating tube, 24 is a photovoltaic element, 25 is a MOSFET element, 26 is a second lead frame, 27
Is an insulating filler, and 28 is a molding material. In FIG. 2, between the light emitting diode 21 mounted on each of the first and second lead frames 22 and 26 and the photovoltaic element 24, a light-shielding insulating tube 23 is provided as in the first embodiment. They are connected by an optical path formed by the insulating filling material 27. In this embodiment, the outer wall of the light-shielding insulating tube 23 is provided with protrusions in advance, and light leakage is most likely to occur when a high voltage is applied between the first and second lead frames 22 and 26. The interface between the electrically insulating tube 23 and the molding material 28, that is, the creeping distance of the light shielding insulating tube 23 is increased.

[0007]

As described above, according to the present invention, the light path between the first and second lead frames forming the input / output terminals in the semiconductor relay is formed of the light-shielding insulating tube and the insulating filler. Therefore, there is an advantage that the light transmission path does not become thin and the light transmission efficiency does not decrease due to defective coating of the opaque resin. Further, by providing a protrusion on the outer wall of the light-shielding insulating tube in advance and increasing the creepage distance, there is an effect of enhancing the insulating property between the first and second lead frames forming the input / output terminals.

[Brief description of drawings]

FIG. 1 is a schematic view showing a first embodiment of a semiconductor relay according to the present invention.

FIG. 2 is a schematic diagram showing a second embodiment of the semiconductor relay according to the present invention.

FIG. 3 is a schematic view showing an example of a conventional semiconductor relay.

[Explanation of symbols]

 1,21,31 Light emitting diode 2,22,34 First lead frame 3,23 Light-shielding insulating tube 4,24,32 Photovoltaic device 5,25,33 MOSFET device 6,26,35 Second lead frame 7,27 Insulating filler 8,28,38 Molding material 36 Filler 37 Opaque resin

Claims (5)

[Claims] 1. A light emitting diode that emits light in response to an input current, and receives light emitted from the light emitting diode,
A first lead frame including a photovoltaic element that generates an electromotive force and a MOSFET element that performs a switch operation by the electromotive force of the photovoltaic element, and mounting the light emitting diode, the MOSFET element, and In a semiconductor relay configured to face a second lead frame on which the photovoltaic element is mounted, a light-shielding insulating tube that optically connects the photovoltaic element and the light-emitting diode, and the light-shielding A semiconductor relay in which a light transmission path is formed by an insulating filler that fills the inside of a flexible insulating tube. 2. The light-blocking insulating tube has a structure that blocks light from the light-emitting diode to be transmitted to the photovoltaic element without leaking, and the insulating filler has an optically transparent property. A semiconductor relay according to claim 1. 3. The semiconductor relay according to claim 2, wherein the light-shielding insulating tube has a smooth outer wall. 4. The semiconductor relay according to claim 2, wherein an outer wall of the light-shielding insulating tube has a protrusion. 5. A light emitting diode which emits light in response to an input current, and receives light emitted from the light emitting diode,
A first lead frame including a photovoltaic element that generates an electromotive force and a MOSFET element that performs a switch operation by the electromotive force of the photovoltaic element, and mounting the light emitting diode, the MOSFET element, and In a semiconductor relay configured to face a second lead frame on which the photovoltaic element is mounted, the photovoltaic element and the light emitting diode are optically connected by a light blocking insulating tube, and the light blocking is performed. A method of manufacturing a semiconductor relay, which comprises an optical transmission path formed by filling an optically insulating tube with an optically transparent insulating filler.