JP2666700B2 - Photo coupler - Google Patents
Photo couplerInfo
- Publication number
- JP2666700B2 JP2666700B2 JP28599993A JP28599993A JP2666700B2 JP 2666700 B2 JP2666700 B2 JP 2666700B2 JP 28599993 A JP28599993 A JP 28599993A JP 28599993 A JP28599993 A JP 28599993A JP 2666700 B2 JP2666700 B2 JP 2666700B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead frame
- light receiving
- photocoupler
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明はフォトカプラに関し、特
に発光素子と、受光素子とがモールド樹脂封止された構
造のフォトカプラに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocoupler, and more particularly to a photocoupler having a structure in which a light emitting element and a light receiving element are sealed with a molding resin.
【０００２】[0002]
【従来の技術】従来広く用いられているフォトカプラの
内部構造を図３，４に示す。図３を参照すると、発光ダ
イオード１０と受光ＩＣ１２とは互いに対向しており、
１次側リードフレーム１１と２次側リードフレーム１３
とに夫々マウント・ボンディングされており、透光性白
色エポキシ樹脂である１次モールド樹脂８で１回目のモ
ールトディングが成されており、更に外乱光の影響をカ
ットするための黒色エポキシ樹脂の２次モールド樹脂９
によりモールドされた構造になっいる。2. Description of the Related Art The internal structure of a photocoupler conventionally widely used is shown in FIGS. Referring to FIG. 3, the light emitting diode 10 and the light receiving IC 12 face each other,
Primary lead frame 11 and secondary lead frame 13
The first molding is performed with a primary molding resin 8 which is a translucent white epoxy resin, and a black epoxy resin 2 is used to cut off the influence of disturbance light. Next mold resin 9
It is a molded structure.
【０００３】また、図４を参照すると、シングルフレー
ム状に１次側リードフレーム１８と２次側リードフレー
ム２０とを配置し、夫々に発光ダイオード１５と受光Ｉ
Ｃ１９をマウントしており、透光性シリコン樹脂１４を
成形し、更に発光ダイオード１５から出た光を反射によ
り、受光ＩＣ１９へ伝達するためのオーバーコート１７
で、透光性シリコン樹脂１４をコートし、外部光を遮断
するための黒色のモールド樹脂１６でモールドされた構
造となったものである。Referring to FIG. 4, a primary lead frame 18 and a secondary lead frame 20 are arranged in a single frame, and a light emitting diode 15 and a light receiving I
C19 is mounted, a translucent silicon resin 14 is molded, and an overcoat 17 for transmitting light emitted from the light emitting diode 15 to the light receiving IC 19 by reflection.
Thus, the transparent silicon resin 14 is coated and molded with a black mold resin 16 for blocking external light.
【０００４】これらは特開昭６２−２９０１８５号公報
にて開示されている。[0004] These are disclosed in Japanese Patent Application Laid-Open No. 62-290185.
【０００５】[0005]
【発明が解決しようとする課題】上述した構造のフォト
カプラは図５に示すように、１次側リードフレーム１１
と２次側リードフレーム１３とが対向しているため、電
子部品としてみれば、夫々のフレーム間に静電容量Ｃが
等価的に存在している状態にあり、ここに夫々のリード
フレーム間にｄｖ／ｄｔで表わされる急峻なノイズが入
ると、Ｃ・ｄｖ／ｄｔなるノイズ電流が流れ、これが受
光ＩＣ１２に伝達され、このフォトカプラの出力側が誤
動作を起す。As shown in FIG. 5, the photocoupler having the above structure has a primary lead frame 11 as shown in FIG.
And the secondary-side lead frame 13 are opposed to each other, so that when viewed as an electronic component, the capacitance C is equivalently present between the respective frames, and here, between the respective lead frames. When steep noise represented by dv / dt enters, a noise current of C · dv / dt flows, is transmitted to the light receiving IC 12, and the output side of the photocoupler malfunctions.
【０００６】図６においても、１次側リードフレーム１
８と２次側リードフレーム２０とが同一平面上にあるに
もかかわらず、やはりＣ・ｄｖ／ｄｔで表わされるノイ
ズ電流が発生し、更にこのノイズ電流Ｉが図６に示すよ
うに回り込んで流れるので、このノイズ電流Ｃ・ｄｖ／
ｄｔによってやはり受光ＩＣ１９が誤動作するという問
題がある。FIG. 6 also shows the primary lead frame 1
Although the lead frame 8 and the secondary lead frame 20 are on the same plane, a noise current also expressed by C.dv / dt is generated, and this noise current I wraps around as shown in FIG. Flow, the noise current C · dv /
There is also a problem that the light receiving IC 19 malfunctions due to dt.
【０００７】本発明の目的は一対のリードフレーム間に
流れるノイズ電流による受光素子の誤動作のないフォト
カプラを提供することである。An object of the present invention is to provide a photocoupler in which a light receiving element does not malfunction due to a noise current flowing between a pair of lead frames.
【０００８】[0008]
【課題を解決するための手段】本発明のフォトカプラ
は、互いに直接対向する対向面部分を夫々有する第１及
び第２のリ−ドフレ−ムと、前記第１のリ−ドフレ−ム
の前記対向面部分を含む平面の前記対向面部分以外の部
分に搭載された発光素子と、前記第２のリ−ドフレ−ム
の前記対向面部分とは反対の面に搭載された受光素子
と、前記発光素子からの光を前記受光素子に向けて反射
する反射部材とを含み、前記第２のリ−ドフレ−ムの前
記発光素子の直下部分に、前記光を透過せしめるための
貫通孔を設け、この透過光を前記反射部材で反射するよ
う構成されていることを特徴とする。According to the present invention, there is provided a photocoupler comprising first and second lead frames each having opposing surface portions directly facing each other; A light emitting element mounted on a portion of the plane including the opposing surface portion other than the opposing surface portion; a light receiving element mounted on a surface of the second lead frame opposite to the opposing surface portion; the light from the light emitting element seen including a reflecting member for reflecting said light receiving element, the second re - Dofure - previous arm
The portion directly below the light emitting element for transmitting the light
A through hole is provided, and the transmitted light is reflected by the reflection member.
It is characterized by having such a configuration .
【０００９】[0009]
【実施例】以下、図面を参照しつつ本発明の実施例につ
き詳述する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１０】図１は本発明の参考例であるフォトカプラ
の構造を示す断面図である。図１を参照すると、互いに
対向する１次及び２次側リ−ドフレ−ム５、７が設けら
れており、受光ＩＣ６は２次側リ−ドフレ−ム７の下面
（１次側フレ−ム５との対向面とは反対側）にマウント
・ボンディングされている。そして、発光ダイオ−ド２
から発した光はオ−バ−コ−ト４により反射し、受光Ｉ
Ｃ６に到達する。しかし、本例では発光ダイオ−ド２の
位置によっては、発光ダイオ−ド２からの光が直接受光
素子２に到達する経路ができ、電気的ノイズが直接受光
ＩＣ６に流れ込む可能性があった。 FIG. 1 is a sectional view showing the structure of a photocoupler according to a reference example of the present invention. Referring to FIG. 1, primary and secondary lead frames 5 and 7 facing each other are provided, and a light receiving IC 6 is provided on the lower surface of the secondary lead frame 7 (primary frame). 5 is mounted and bonded on the side opposite to the surface facing the surface 5. And a light emitting diode 2
Is reflected by the overcoat 4 and the received light I
Reach C6. However, in this example, the light emitting diode 2
Depending on the position, light from light emitting diode 2 is directly received
A path to element 2 is created, and electrical noise is directly received
There was a possibility of flowing into IC6.
【００１１】尚、フォトカプラ全体は樹脂３でモールド
されている。The entire photocoupler is molded with resin 3.
【００１２】図２は本発明のフォトカプラの実施例を示
す断面図であり、図１と同等部分は同一符号により示し
ている。FIG. 2 is a sectional view showing an embodiment of the photocoupler of the present invention, and the same parts as those in FIG. 1 are denoted by the same reference numerals.
【００１３】本例においても、２次側リードフレーム７
の下面（１次側フレーム５との対向面とは反対面）に受
光ＩＣ６がマウントされている。この例では、この２次
側フレーム７の受光素子２の直下部分に、この発光素子
２からの光を透過せしめるための貫通孔３０が穿設され
ている。Also in this embodiment, the secondary lead frame 7
The light receiving IC 6 is mounted on the lower surface (the surface opposite to the surface facing the primary side frame 5). In this example, a through hole 30 for transmitting light from the light emitting element 2 is formed in the secondary frame 7 directly below the light receiving element 2.
【００１４】従って、発光素子２からの光は、この貫通
孔３０を透過してオーバーコート４へ達し、そこで反射
されて受光ＩＣ６へ入射することになる。Therefore, the light from the light emitting element 2 passes through the through hole 30 and reaches the overcoat 4, where it is reflected and enters the light receiving IC 6.
【００１５】図２に示す実施例は、受光ＩＣ６を２次側
リ−ドフレ−ム７の下側（１次側フレ−ム５との対向面
とは反対側）にマウントしており、２次側フレ−ム７の
発光素子２の直下部分に、この発光素子２からの光を透
過せしめるための貫通孔３０が設けられており、２次側
リ−ドフレ−ム７はグランド電位となっているので、１
次側リ−ドフレ−ム５と２次側リ−ドフレ−ム７間でｄ
ｖ／ｄｔなる急峻なノイズが発生することによるノイズ
電流Ｃ・ｄｖ／ｄｔは、直接受光ＩＣには到達せず、最
低電位となっている２次側リ−ドフレ−ム７を通じてグ
ランドに流れる。よって受光ＩＣ６の誤動作防止が可能
となる。[0015] embodiment shown in FIG. 2, the light receiving IC 6 2 primary Li - Dofure - lower arm 7 (primary frame - the surface facing the arm 5 opposite) are mounted on, 2 Of the next frame 7
The light from the light emitting element 2 is transmitted directly below the light emitting element 2.
A through-hole 30 is provided to allow the lead frame 7 to pass , and the secondary-side lead frame 7 is at the ground potential.
D between the secondary side lead frame 5 and the secondary side lead frame 7
The noise current C.dv / dt caused by the generation of the steep noise of v / dt does not directly reach the light receiving IC, but flows to the ground through the lowest potential secondary side lead frame 7. Therefore, malfunction of the light receiving IC 6 can be prevented.
【００１６】[0016]
【発明の効果】本発明によれば、受光ＩＣを２次側リー
ドフレームの下側（１次側フレームとの対向面とは反対
面）にマウントし、最位電位（グランド）となっている
２次側リードフレームを１次側リードフレームに対向さ
せることにより、１次側リードフレームと２次側リード
フレーム間でｄｖ／ｄｔなる急峻なノイズが発生した場
合のＣ・ｄｖ／ｄｔなるノイズ電流は、受光ＩＣを通ら
ずに最位電位である２次側リードフレームを通じてグラ
ンドに流れるので、受光ＩＣの誤動作防止が可能とな
り、従来１ＫＶ／μｓ程度のノイズ耐量が、本発明によ
り１０ＫＶ／μｓまで、その耐量が向上するという効果
がある。According to the present invention, the light receiving IC is mounted on the lower side of the secondary lead frame (the surface opposite to the surface facing the primary side frame), and is at the highest potential (ground). By making the secondary lead frame face the primary lead frame, a noise current of C · dv / dt occurs when a steep noise of dv / dt occurs between the primary lead frame and the secondary lead frame. Flows through the secondary-side lead frame, which is the highest potential, to the ground without passing through the light receiving IC, so that malfunction of the light receiving IC can be prevented, and the noise immunity of about 1 KV / μs can be reduced to 10 KV / μs by the present invention. This has the effect of improving its resistance.
【図１】本発明の第１の実施例であるフォトカプラの構
造を示す断面図である。FIG. 1 is a sectional view showing a structure of a photocoupler according to a first embodiment of the present invention.
【図２】本発明の第２の実施例であるフォトカプラの構
造を示す断面図である。FIG. 2 is a cross-sectional view illustrating a structure of a photocoupler according to a second embodiment of the present invention.
【図３】従来のフォトカプラの構造を示す断面図であ
る。FIG. 3 is a cross-sectional view illustrating a structure of a conventional photocoupler.
【図４】従来のフォトカプラの構造を示す断面図であ
る。FIG. 4 is a cross-sectional view illustrating a structure of a conventional photocoupler.
【図５】従来のフォトカプラの構造におけるノイズ電流
を示す図である。FIG. 5 is a diagram showing a noise current in the structure of a conventional photocoupler.
【図６】従来のフォトカプラの構造におけるノイズ電流
を示す図である。FIG. 6 is a diagram showing a noise current in the structure of a conventional photocoupler.
【符号の説明】 １ 透明シリコン樹脂 ２ 発光ダイオード ３ モールド樹脂 ４ オーバーコート ５ １次側リードフレーム ６ 受光ＩＣ ７ ２次側リードフレーム ３０ 貫通孔[Description of Signs] 1 Transparent silicon resin 2 Light emitting diode 3 Mold resin 4 Overcoat 5 Primary lead frame 6 Light receiving IC 7 Secondary lead frame 30 Through hole
Claims (2)
する第１及び第２のリ−ドフレ−ムと、前記第１のリ−
ドフレ−ムの前記対向面部分を含む平面の前記対向面部
分以外の部分に搭載された発光素子と、前記第２のリ−
ドフレ−ムの前記対向面部分とは反対の面に搭載された
受光素子と、前記発光素子からの光を前記受光素子に向
けて反射する反射部材とを含み、前記第２のリ−ドフレ
−ムの前記発光素子の直下部分に、前記光を透過せしめ
るための貫通孔を設け、この透過光を前記反射部材で反
射するよう構成されていることを特徴とするフォトカプ
ラ。A first and a second lead frame each having opposing surface portions directly opposing each other; and the first lead and the second lead frame.
A light emitting element mounted on a portion of the plane including the facing surface portion of the frame other than the facing surface portion;
Dofure - and the facing surface portion of the arm and the light receiving device mounted on the opposite face is seen including a reflecting member for reflecting the light from the light emitting element to the light receiving element, the second re - Dofure
-Let the light pass through the portion of the
A through-hole is provided for the transmitted light to be reflected by the reflecting member.
A photocoupler configured to emit light .
あることを特徴とする請求項１記載のフォトカプラ。2. The photocoupler according to claim 1, wherein said reflection member is an inner surface of a mold resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28599993A JP2666700B2 (en) | 1993-10-20 | 1993-10-20 | Photo coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28599993A JP2666700B2 (en) | 1993-10-20 | 1993-10-20 | Photo coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07122779A JPH07122779A (en) | 1995-05-12 |
| JP2666700B2 true JP2666700B2 (en) | 1997-10-22 |
Family
ID=17698702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28599993A Expired - Fee Related JP2666700B2 (en) | 1993-10-20 | 1993-10-20 | Photo coupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2666700B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964410A (en) * | 1995-08-30 | 1997-03-07 | Nec Corp | Semiconductor light receiving and emitting device |
| JPH09148620A (en) * | 1995-09-20 | 1997-06-06 | Sharp Corp | Light reflecting type detector and manufacture thereof |
| JP5865216B2 (en) | 2012-09-12 | 2016-02-17 | ルネサスエレクトロニクス株式会社 | Photo coupler |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476679U (en) * | 1977-11-10 | 1979-05-31 |
-
1993
- 1993-10-20 JP JP28599993A patent/JP2666700B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07122779A (en) | 1995-05-12 |
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