JPH114016A - Optical coupling element and manufacture thereof - Google Patents
Optical coupling element and manufacture thereofInfo
- Publication number
- JPH114016A JPH114016A JP13590598A JP13590598A JPH114016A JP H114016 A JPH114016 A JP H114016A JP 13590598 A JP13590598 A JP 13590598A JP 13590598 A JP13590598 A JP 13590598A JP H114016 A JPH114016 A JP H114016A
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- resin
- boat
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、従来、透過形光結
合素子の低い絶縁特性を改善し製造の複雑化を解決して
小さいパッケージ（PACKAGE:4PIN類、ARRAY包含）にも適
用ができるようにすると共に、製造が簡単で、かつ使用
が容易で、高信頼性を保障する光結合素子を提供しよう
とするものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention improves the low insulation characteristics of transmission type optical coupling devices and solves the complexity of manufacturing, so that the present invention can be applied to small packages (PACKAGE: 4 PINs, including ARRAY). In addition, it is an object of the present invention to provide an optical coupling element which is easy to manufacture and easy to use and guarantees high reliability.
【０００２】[0002]
【発明が解決しようとする課題】一般に、光結合素子は
入力電流により光を発散する発光素子とその発光素子か
ら発散される光を電流に変換する受光素子を一つのパッ
ケージ内に備えた装置であって、入出力間には電気的に
全く絶縁されており、出力信号が入力信号に影響を及ば
ない単方向性素子であり、発光素子として電流の変換効
率（光−電変換効率）が良い赤外発光ダイオードと可視
発光ダイオードが使用され、受光素子として出力特性が
良好なホトトランジスタ、ホトトライアック及びホトロ
ジック等が使用されている。その応用は、回路におい
て、電位差が違い両回路間の交互作用と高速広大域信号
伝達等に広く使用されている。添付の図面の図１は上記
のような機能を有する従来の光透過性絶縁体を用いた透
過形光結合素子の構造を示したものである。このような
構造の透過形光結合素子は伝導性が優れたリードフレー
ム（１１）（１２）に発光素子（１３）と受光素子（１
４）を各々高伝導性接着剤で接着した後、金属細金線
（１５）（１６）でチップの電極と指定されたリードフ
レーム部に熔融接着させ、相互対向配置のために指定さ
れた機構により固定した後、リードフレームの指定され
た部位を溶接する。In general, an optical coupling device is a device including a light emitting element that emits light by an input current and a light receiving element that converts light emitted from the light emitting element into a current in one package. In addition, the input and output are electrically insulated completely, and the output signal is a unidirectional element that does not affect the input signal. The light emitting element has a high current conversion efficiency (light-to-electric conversion efficiency). An infrared light emitting diode and a visible light emitting diode are used, and a phototransistor, a phototriac, a photologic or the like having good output characteristics is used as a light receiving element. Its application is widely used in circuits, such as interaction between two circuits having different potential differences and high-speed wide-area signal transmission. FIG. 1 of the accompanying drawings shows the structure of a conventional transmissive optical coupling element using a light transmissive insulator having the above functions. The transmissive optical coupling element having such a structure includes a light emitting element (13) and a light receiving element (1) on a lead frame (11) (12) having excellent conductivity.
4) is adhered with a highly conductive adhesive, and then melt-bonded to the chip electrode and the designated lead frame portion with thin metal wires (15) and (16), and the mechanism designated for mutual opposition is arranged. Then, the specified part of the lead frame is welded.
【０００３】次に、光透過性絶縁体（１７）により連結
して光通路を形成した後、黒色エポキシ樹脂（２０）で
トランスファモールディングして光結合素子を製造する
ことになる。このように製造されるシリコンレンジを利
用した透過形光結合素子は入力部へ電流が入力されると
発光素子（１３）が発光することになり、その発散され
る光は形成された光伝達経路を通して受光素子（１４）
に伝達され、受光素子（１４）はその伝達される光を電
流に変換するようになる。[0003] Next, an optical path is formed by coupling with a light transmitting insulator (17), and then transfer molding is performed with a black epoxy resin (20) to manufacture an optical coupling device. In the transmission type optical coupling device using the silicon range manufactured as described above, when a current is input to the input portion, the light emitting device (13) emits light, and the divergent light is transmitted through the formed light transmission path. Through the light receiving element (14)
And the light receiving element (14) converts the transmitted light into a current.
【０００４】しかし、このような従来のシリコンレンジ
を利用した透過形光結合素子は発光素子（１３）と受光
素子（１４）とが相互対向されるように配置されている
ので距離に制限される問題があった。即ち、相互距離を
近づけると光伝達効率は良くなるが、光透過性絶縁体
（１７）とエポキシ樹脂（２０）との接着力が欠けてい
るし、発光素子（１３）と受光素子（１４）との短い絶
縁距離によりその界面（１７、２０）に電気的漏洩が容
易に発生されて絶縁低下の問題点があり、これとは別に
その絶縁距離を確保するため距離を増加させると広い距
離により光伝達効率が低下され、界面（１７）（２０）
の接着力欠如により絶縁向上がないという問題点が生じ
る。従って、かかる構造の透過形光結合素子は大きい絶
縁耐圧用には適用することができなく、その絶縁体の内
部の金属細金線（１５）（１６）も、また、低くしなけ
ればならないという問題点がある。However, in such a conventional transmission type optical coupling device using a silicon range, the distance is limited because the light emitting device (13) and the light receiving device (14) are arranged to face each other. There was a problem. That is, when the mutual distance is reduced, the light transmission efficiency is improved, but the adhesive strength between the light transmitting insulator (17) and the epoxy resin (20) is lacking, and the light emitting element (13) and the light receiving element (14) However, due to the short insulation distance, electrical leakage is easily generated at the interface (17, 20), and there is a problem that insulation is reduced. Apart from this, if the distance is increased to secure the insulation distance, the distance becomes large. The light transmission efficiency is reduced, and the interface (17) (20)
Has a problem that there is no improvement in insulation due to the lack of adhesive strength. Therefore, the transmission type optical coupling element having such a structure cannot be applied to a large withstand voltage, and the metal fine gold wires (15) and (16) inside the insulator must also be lowered. There is a problem.
【０００５】そして、各々のリードフレーム（１１）
（１２）に対し、機械的に溶接しなければならないとい
う煩わしさがあり、リードフレーム（１１）（１２）の
自体の偏差により最適のチップマウントをしても対向配
置がずれることになって、光伝達効率を低下させる問題
があった。また、発光素子（１３）が発光する場合（体
面発光）、光透過性絶縁体（１７）の外部が黒色エポキ
シ樹脂（２０）から成っているので、光の一部が受光素
子（１４）に達する前に吸収され光出力効率を低下させ
る等の問題点もあった。Then, each lead frame (11)
In contrast to (12), there is an inconvenience that the welding must be performed mechanically, and the opposing arrangement is shifted even if the optimal chip mount is performed due to the deviation of the lead frames (11) and (12). There is a problem that the light transmission efficiency is reduced. When the light emitting element (13) emits light (body emission), a part of the light is transmitted to the light receiving element (14) because the outside of the light transmitting insulator (17) is made of the black epoxy resin (20). There is also a problem that the light is absorbed before reaching the temperature and the light output efficiency is reduced.
【０００６】上記の如き低絶縁性の問題点を改善するた
めに従来には添付図面の図２のような半透過性エポキシ
樹脂を用いた二重構造の透過形光結合素子を開発した。
これは伝導性が優れたリードフレーム（２１）（２２）
に発光素子（２３）と受光素子（２４）を各々高伝導性
接着剤で接着した後、金属細金線（２５）（２６）でチ
ップの電極と指定されたリードフレーム部に熔融接着さ
せ、発光素子（２３）の熱的老化を防止するために光透
過性のシリコン樹脂（２７）で保護膜（２７）を形成す
る。その次に相互対向配置のために指定された機構によ
り固定した後、リードフレーム（２１）（２２）の指定
された部位を溶接し、半透明性エポキシ樹脂（２８）で
１次モールディングして光通路を形成した後、黒色エポ
キシ樹脂（３０）で更にモールディングして光結合素子
を製造することになる。In order to solve the above-mentioned problem of low insulation property, a transmission type optical coupling element having a double structure using a semi-transparent epoxy resin as shown in FIG. 2 of the accompanying drawings has been developed.
This is a lead frame with excellent conductivity (21) (22)
After bonding the light emitting element (23) and the light receiving element (24) to each other with a highly conductive adhesive, the metal electrodes (25) and (26) are melted and bonded to the chip electrode and the designated lead frame portion, In order to prevent thermal aging of the light emitting element (23), a protective film (27) is formed of a light transmitting silicone resin (27). Next, after fixing by a mechanism designated for mutual opposition, the designated portions of the lead frames (21) and (22) are welded, and primary-molded with a translucent epoxy resin (28) to form a light. After the passage is formed, the optical coupling element is manufactured by further molding with a black epoxy resin (30).
【０００７】このように製造される半透過性エポキシ樹
脂を用いた二重構造の透過形光結合素子は、図１の如き
光透過性シリコンレンジを用いた透過形光結合素子から
発生する低い絶縁問題は改善したが、反面、光の通路で
あるエポキシ樹脂の半透明性により光ー電流伝達比の低
下による距離を短縮しなければならないし、内部の絶縁
性の確保のために金属細金線（２５）（２６）の高さを
制限しなければならない特別な工程管理を加えなければ
ならないので製造工程が複雑であるという問題点を引き
起こした。また、半透明性エポキシ樹脂（２８）の固状
により発光素子（２３）の動作時、チップ（CHIP）の軸
膨張を円滑にするためシリコン透明樹脂（２７；光透過
性絶縁体）を塗布するが、この時、光透過性絶縁体の投
入量が不安定であるとか、或は未投入の時にはチップの
老化が急速に進められて実装に莫大な支障をもたらす問
題点が生じた。The double-structured transmission type optical coupling device using the semi-transparent epoxy resin manufactured as described above has a low insulation generated from the transmission type optical coupling device using the light transmitting silicon range as shown in FIG. The problem has been improved, but on the other hand, the translucency of the epoxy resin, which is the light path, has to shorten the distance due to the decrease in the light-to-current transfer ratio. (25) Since a special process control for restricting the height of (26) must be added, the problem that the manufacturing process is complicated is caused. Further, when the light emitting element (23) is operated by the solid state of the translucent epoxy resin (28), a silicon transparent resin (27; light transmitting insulator) is applied to smooth the axial expansion of the chip (CHIP). However, at this time, there is a problem that the input amount of the light-transmitting insulator is unstable, or when not supplied, the chip is rapidly aged and the mounting is greatly hindered.
【０００８】そして、シリコン透明樹脂（２７）と半透
明エポキシ樹脂（２８）との間の界面発生により光の屈
折現象が発生して電流伝達が低下される問題点も生じ
た。従来、光結合素子のまた別の構造において、添付図
面の図３は光透過性絶縁体を用いた反射形光結合素子の
構造を示したものである。上記の如き光透過性絶縁体を
用いた反射形光結合素子は、伝導性が優れたリードフレ
ーム（３１）（３２）の同一平面上に発光素子（３３）
と受光素子（３４）を各々高伝導性接着剤で接着した
後、金属細金線（３５）（３６）でチップの電極と指定
されたリードフレーム部に熔融接着させ、光透過性のシ
リコン樹脂（３７）で光の伝達通路を形成し、外壁に反
射性絶縁体（３８）（３９）を塗布した後、黒色エポキ
シ樹脂（４０）でトランスファモールデングして製造す
る。また別の製造方法では、シリコン樹脂（３７）で光
の伝達通路を形成する工程までは同様であり、その後に
反射性絶縁体（３８）（３９）を使用しなく、白色フィ
ラー（FILLER）を含んだエポキシ樹脂（４０）のみでモ
ールデングして製造することになる。Also, there is a problem in that the interface between the silicon transparent resin (27) and the translucent epoxy resin (28) causes the refraction of light to occur and the current transmission is reduced. FIG. 3 of the accompanying drawings shows the structure of a reflection-type optical coupling element using a light-transmitting insulator. The reflection type optical coupling device using the light transmitting insulator as described above is a light emitting device (33) on the same plane of the lead frame (31) (32) having excellent conductivity.
And the light-receiving element (34) are bonded with a highly conductive adhesive, and then melt-bonded to a chip electrode and a designated lead frame portion with a fine metal wire (35) (36), and a light-transmitting silicon resin is bonded. A light transmission path is formed in (37), and reflective insulators (38) and (39) are applied to the outer wall. Then, transfer molding is performed using black epoxy resin (40). In another manufacturing method, the process is the same up to the step of forming a light transmission path with the silicone resin (37). Thereafter, the white filler (FILLER) is added without using the reflective insulators (38) and (39). It will be manufactured by molding only with the epoxy resin (40) containing it.
【０００９】しかし、かかる工程により製造される光透
過性絶縁体を利用した反射形光結合素子も発光素子（３
３）と受光素子（３４）との間隔の制限により透過性シ
リコン樹脂（３７）の塗布に限界があって、絶縁耐圧を
増加させることができないという問題点が生じた。併せ
て、反射性絶縁体（３８）（３９）で反射膜を塗布した
後、硬化させると接着力が低くなってエポキシモールデ
ィング（４０）後、界面が発生し、高絶縁耐圧を克服す
ることができないという問題点もあった。そして、光透
過性シリコン樹脂（３７）で光通路を形成する際、その
形状が円形や楕円形であるが、その形状が下面まで成し
ており、発光素子（３３）の発光後、下面に反射された
光は受光素子（３４）側に達することができないので、
光出力特性が低下される問題点も生じた。However, the reflection type optical coupling device using the light transmitting insulator manufactured by the above process is also a light emitting device (3).
Due to the limitation of the distance between 3) and the light receiving element (34), there is a limit in the application of the transparent silicon resin (37), and there has been a problem that the withstand voltage cannot be increased. At the same time, when a reflective film is applied with the reflective insulators (38) and (39) and then cured, the adhesive strength is reduced, and after epoxy molding (40), an interface is generated to overcome the high dielectric strength. There was also a problem that it could not be done. When the light path is formed by the light-transmitting silicone resin (37), the shape is circular or elliptical, but the shape is formed up to the lower surface. Since the reflected light cannot reach the light receiving element (34) side,
There is also a problem that the light output characteristics are deteriorated.
【００１０】[0010]
【課題を解決するための手段】本発明は上記の如き従来
の光結合素子等の諸般問題点を解決するために提案され
たものであって、本発明の目的は、従来の透過形と反射
形光結合素子の低い絶縁特性と光電流伝達比を改善し製
造の複雑化を解決して小さいパッケージ（PACKAGE:4PIN
類、ARRAY包含）にも適用することができるようにすると
共に、製造が簡単で、かつ使用が容易で、高信頼性を保
障する光結合素子を提供することにある。SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the above-mentioned various problems of the conventional optical coupling device and the like. Small package (PACKAGE: 4PIN)
The present invention is to provide an optical coupling device which can be applied to various types of optical coupling devices (including ARRAY), is easy to manufacture and easy to use, and guarantees high reliability.
【００１１】かかる発明の目的を達成するための方法
は、伝導性が優れたリードフレームの同一平面上に発光
素子と受光素子を各々高伝導性接着剤で接着させる第１
の工程と、上記第１の工程後、金属細金線で上記発光素
子及び受光素子の電極と指定されたリードフレーム部を
熔融接着させる第２の工程と、上記発光素子と受光素子
を含む周辺部の上面のみを光透過性シリコン樹脂で塗布
してボート（BOAT）型の光線伝達通路を形成する第３の
工程と、上記光透過性シリコン樹脂の外壁の上、下面を
高接着性絶縁体で塗布した後、その上と上記リードフレ
ームの一部を黒色エポキシ樹脂でトランスファモールデ
ィングする第４の工程からなる。以下、本願発明の望ま
しい実施形態を添付の図面に基づいて詳細に説明すると
次の通りである。In order to achieve the object of the present invention, a method for bonding a light emitting element and a light receiving element on the same plane of a lead frame having excellent conductivity with a highly conductive adhesive is described.
And a second step of fusing, after the first step, the electrodes of the light emitting element and the light receiving element and the designated lead frame portion with a thin metal wire, and a peripheral area including the light emitting element and the light receiving element. A third step of forming a boat (BOAT) type light transmission path by coating only the upper surface of the portion with a light-transmitting silicone resin, and forming a highly adhesive insulator on the upper and lower surfaces of the outer wall of the light-transmitting silicone resin And a fourth step of transfer molding the upper part and a part of the lead frame with black epoxy resin. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
【００１２】[0012]
【発明の実施の形態】図４の（Ａ）及び（Ｂ）は本願発
明の１実施形態に係るボート（BOAT）型と高接着反射性
絶縁体を用いた反射形光結合素子の構造図（DIP 型）で
あり、図５の（Ａ）及び（Ｂ）は本発明によるボート
（BOAT）型と高接着反射性絶縁体を用いた反射形光結合
素子の他実施形態に係る構造図（MFP 型− GULL −WING
型）である。ここで、ディップ（DIP ）型の反射形光結
合素子の製造工程と GULL −WING型のMFP 小型製造工程
は同一なので、重複記載を避けるために作用を共に説明
する。先ず、伝導性が優れ、“Ｖ溝”（６１〜６４）又
は“Λ”形状の突起（６１′〜６４′）が形成されたリ
ードフレーム（４１）（４２）（５１）（５２）の同一
平面上に発光素子（４３）（５３）と受光素子（４４）
（５４）を各々高伝導性接着剤で接着した後、金属細金
線（４５）（４６）（５５）（５６）でその発光素子
（４３）（５３）及び受光素子（４４）（５４）の電極
と指定されたリードフレーム部を熔融接着させることに
なる。4A and 4B are structural diagrams of a boat type (BOAT) type and a reflection type optical coupling element using a highly adhesive reflective insulator according to an embodiment of the present invention (FIG. 4). 5A and 5B are structural views (MFP) according to another embodiment of a reflection type optical coupling device using a boat (BOAT) type and a highly adhesive reflective insulator according to the present invention. Type − GULL − WING
Type). Here, the manufacturing process of the dip (DIP) type reflection type optical coupling element and the small manufacturing process of the GULL-WING type MFP are the same, and therefore the operation will be described together to avoid redundant description. First, the same lead frame (41), (42), (51), (52) having excellent conductivity and having "V-grooves" (61-64) or "Λ" -shaped projections (61'-64 ') formed thereon. Light emitting elements (43) and (53) and light receiving element (44) on a plane
After bonding (54) with a highly conductive adhesive, the light-emitting elements (43) and (53) and the light-receiving elements (44) and (54) are thinned by fine metal wires (45), (46), (55) and (56). And the designated lead frame portion is melt-bonded.
【００１３】以後、光透過性が良い絶縁体樹脂である光
透過性シリコン樹脂（４７）（５７）を熱的に処理して
上記発光素子（４３）（５３）及び受光素子（４４）
（５４）を含む周辺部の上面のみをボート（BOAT）型の
光伝達通路に形成することになる。上記において、光透
過性のシリコン樹脂（４７）（５７）でボート（BOAT）
型の光伝達通路を作るためにリードフレーム固定部に温
度調節機能を有する装備を設けて最小安全距離（最短距
離）３ｍｍ以上の界面絶縁距離を確保し、かつ下面のド
ーム（DOME）形成を防止し、光伝達出力特性を改善する
ために熱的に光透過性樹脂の流れと形状を制御してボー
ト（BOAT）型の光伝達通路を形成することになる。Thereafter, the light-transmitting silicon resins (47) and (57), which are insulating resins having good light-transmitting properties, are thermally treated to produce the light-emitting elements (43) and (53) and the light-receiving element (44).
Only the upper surface of the peripheral portion including (54) is formed as a boat (BOAT) type light transmission path. In the above, the boat (BOAT) is made of a light-transmitting silicone resin (47) (57).
A device with a temperature control function is provided in the fixed part of the lead frame to create a light transmission path for the mold, ensuring a minimum safe distance (minimum distance) of 3 mm or more, and preventing the formation of a dome (DOME) on the lower surface. Then, in order to improve the light transmission output characteristics, the flow and shape of the light transmitting resin are thermally controlled to form a boat (BOAT) type light transmission passage.
【００１４】次に、次期の工程により形成される反射膜
とエポキシ樹脂との界面密着力の向上と光反射力を増加
させるために反射性絶縁体が全く硬化した後にもねっと
りした高接着力と光反射力を有する反射性フィラーを含
んだ硬化性樹脂である高接着反射性絶縁体（４８）（４
９）（５８）（５９）を上記光透過性シリコン樹脂（４
７）（５７）の外壁の上、下面に所定の厚さで塗布して
反射膜を形成させることになる。そして、その反射膜上
とリードフレーム（４１）（４２）（５１）（５２）の
一部を黒色エポキシ樹脂（４０）（６０）でトランスフ
ァモールディングして光結合素子を製造することにな
る。このような方法で光結合素子を製造するとP-DIP 型
と MFP，即ち、 MINI- FLAT 型パッケージの高耐圧用の
全ての製品（4/8/16PIN ARRAY 等）に適用が可能であ
り、併せて電流入力部に直流型（DC）と交流型（AC）の
装置を全て使用することができるようになる。Next, in order to improve the interfacial adhesion between the reflective film formed by the next step and the epoxy resin and to increase the light reflectivity, the adhesive has a high adhesive strength that is sticky even after the reflective insulator is completely cured. Highly adhesive reflective insulator (48) (4) which is a curable resin containing a reflective filler having light reflectivity.
9) (58) and (59) are replaced with the light transmitting silicone resin (4).
7) A reflective film is formed by applying a predetermined thickness on the upper and lower surfaces of the outer wall of (57). Then, the optical coupling element is manufactured by transfer molding the reflective film and a part of the lead frames (41) (42) (51) (52) with black epoxy resin (40) (60). By manufacturing an optical coupling device in this way, it can be applied to all products (4/8/16 PIN ARRAY, etc.) for P-DIP type and MFP, that is, MINI-FLAT type package for high withstand voltage. As a result, the direct current (DC) and alternating current (AC) devices can all be used in the current input section.
【００１５】[0015]
【発明の効果】前記したように、本発明は、リードフレ
ームの固定部に温度調節機能を有する装備を設置するこ
とにより、一様な距離以上のボート形態を具現させるこ
とができる効果があり、短い時間内に（１分以内）１次
シリコン樹脂（４７）（５７）の硬化が成されるので製
造の自動化が可能であり、１次硬化された光透過性シリ
コン樹脂（４７）（５７）に反射性樹脂（４８）（４
９）（５８）（５９）を注入する際、樹脂の流動性が良
いので上面尖頭部のみに注入すると１分後には全体的に
上面部に塗布され、リードフレーム（４１）（４２）
（５１）（５２）の“Ｖ溝”（６１〜６４）又は“Λ”
形状の突起（６１′〜６４′）前まで抑えられて製造力
と信頼度向上を図ることができる。また、本発明による
ボート型の反射膜がリードフレーム（４１）（４２）
（５１）（５２）を充分に覆い被せているので内外部絶
縁性を向上させることもできる。As described above, according to the present invention, by installing equipment having a temperature control function on the fixed portion of the lead frame, there is an effect that a boat form having a uniform distance or more can be realized. Since the primary silicone resin (47) (57) is cured within a short time (within 1 minute), the production can be automated, and the primary cured light-transmitting silicone resin (47) (57) Reflective resin (48) (4
9) When injecting (58) and (59), since the resin has good fluidity, if it is injected only into the top of the upper surface, it is applied to the entire upper surface one minute later, and the lead frames (41) and (42)
(51) “V-groove” (61-64) or “Λ” of (52)
It can be suppressed up to the shape of the protrusions (61 'to 64'), and the manufacturing power and the reliability can be improved. In addition, the boat-type reflection film according to the present invention is used as a lead frame (41) (42).
(51) Since (52) is sufficiently covered, the inner and outer insulation properties can be improved.
【図１】従来、光透過姓絶縁体を用いた透過形光結合素
子の構造図である。FIG. 1 is a structural view of a transmission type optical coupling element using a conventional light transmission insulator.
【図２】従来、反射透過エポキシ樹脂を用いた二重構造
の透過形結合素子の構造図である。FIG. 2 is a structural view of a transmission type coupling element having a double structure using a reflection-transmission epoxy resin.
【図３】従来、光透過性絶縁体と用いた反射形光結合素
子の構造図である。FIG. 3 is a structural view of a conventional reflection type optical coupling element using a light transmitting insulator.
【図４】（Ａ）及び（Ｂ）は、本発明によるボート型と
高接着反射性絶縁体と用いた反射形光結合素子の第１の
構造図（DIP 型）である。FIGS. 4A and 4B are first structural views (DIP type) of a reflection type optical coupling element using a boat type and a highly adhesive reflective insulator according to the present invention.
【図５】（Ａ）及び（Ｂ）は、本発明によるボート型と
高接着反射性絶縁体を用いた反射形光結合素子の第２の
構造図（MFP 型− GULL −WING型）である。FIGS. 5A and 5B are second structural diagrams (MFP type-GULL-WING type) of a boat type and a reflection type optical coupling device using a highly adhesive reflective insulator according to the present invention. .
４１、４２、５１、５２ リードフレーム ４３、５３ 発光素子 ４４、５４ 受光素子 ４５、４６、５５、５６ 金属細金線 ４７、５７ シリコン樹脂 ４８、４９、５８、５９ 高接着反射性絶縁体 ５０、６０ 黒色エポキシ樹脂 ６１〜６４、６１′〜６４′“Ｖ溝”又は“Λ”型突起 41, 42, 51, 52 Lead frame 43, 53 Light emitting element 44, 54 Light receiving element 45, 46, 55, 56 Fine metal wire 47, 57 Silicon resin 48, 49, 58, 59 High adhesion reflective insulator 50, 60 Black epoxy resin 61-64, 61'-64 '"V groove" or "又 は" type protrusion
Claims (8)
（４２）の同一平面上に発光素子（４３）と受光素子
（４４）を各々高伝導性接着剤で接着させる第１の工程
と、 上記第１の工程後、金属細金線（４５）（４６）で上記
発光素子（４３）及び受光素子（４４）の電極と指定さ
れたリードフレーム部を熔融接着させる第２工程と、 上記発光素子（４３）及び受光素子（４４）を含む周辺
部の上面のみを光透過性シリコン樹脂（４７）で塗布し
てボート（BOAT）型の光伝達通路を形成する第３の工程
と、 上記光透過性シリコン樹脂（４７）の外壁の上、下面を
高接着反射性絶縁体（４８）（４９）で塗布した後、そ
の上とリードフレーム（４１）（４２）の一部を黒色エ
ポキシ樹脂（５０）でトランスファモールディングする
第４の工程からなることを特徴とする光結合素子の製造
方法。1. A lead frame having excellent conductivity.
A first step of bonding the light emitting element (43) and the light receiving element (44) on the same plane of (42) with a highly conductive adhesive, respectively; after the first step, a fine metal wire (45) ( (46) a second step of fusing and bonding the electrodes of the light emitting element (43) and the light receiving element (44) to the designated lead frame part; and a peripheral step including the light emitting element (43) and the light receiving element (44). A third step of forming a boat (BOAT) -type light transmission path by applying only the upper surface with a light-transmitting silicone resin (47), and raising the upper and lower surfaces of the outer wall of the light-transmitting silicone resin (47). A fourth step in which after the adhesive and reflective insulators (48) and (49) are applied, a part thereof and a part of the lead frames (41) and (42) are transfer-molded with a black epoxy resin (50). A method for manufacturing an optical coupling element.
脂（４７）でボート（BOAT）型の光伝達通路を作るため
にリードフレームの固定部に温度調節機能を有する装備
を設けて最小安全側面距離（最短距離）３ｍｍ以上の界
面絶縁距離を確保し、下面のドーム（DOME）形成を防止
することを特徴とする請求項１に記載の光結合素子の製
造方法。2. In the third step, a device having a temperature control function is provided at a fixing portion of the lead frame so as to form a boat (BOAT) type light transmission path with the light transmitting silicone resin (47). 2. The method according to claim 1, wherein an interfacial insulation distance of 3 mm or more is ensured to prevent the formation of a dome (DOME) on the lower surface.
性を改善するために熱的に光透過性樹脂の流れと形状を
制御してボート（BOAT）型の光伝達通路を形成すること
を特徴とする請求項１に記載の光結合素子の製造方法。3. A method of forming a light transmission passage of a boat type by thermally controlling the flow and shape of a light-transmitting resin in order to improve light transmission output characteristics. The method for manufacturing an optical coupling device according to claim 1, wherein:
（４８）（４９）は反射膜とエポキシ樹脂との界面密着
力の向上と光反射力を増加させるために反射性絶縁体が
全く硬化した後にもねっとりした高接着力と光反射力と
有する反射性フィラーを含んだ硬化性樹脂であることを
特徴とする請求項１に記載の光結合素子の製造方法。4. The high-adhesive reflective insulators (48) and (49) in the fourth step are made of a reflective insulator for improving the interface adhesion between the reflective film and the epoxy resin and increasing the light reflectivity. The method according to claim 1, wherein the curable resin is a curable resin containing a reflective filler having high adhesive strength and light reflectivity that is sticky even after being completely cured.
一部には透過性及び半透過性樹脂の流れを抑え、パッケ
ージとリードフレームの間の気密性強化のために“Ｖ
溝”（６１）（６２）を形成することを特徴とする請求
項１に記載の光結合素子の製造方法。5. A part of the lead frames (41) and (42) suppresses the flow of a permeable and semi-permeable resin, and increases the "V" in order to enhance the airtightness between the package and the lead frame.
2. The method according to claim 1, wherein the grooves "(61)" and "62" are formed.
一部には透過性及び反射性樹脂の流れを抑え、パッケー
ジとリードフレームとの間の気密性の強化のために形成
された“Ｖ溝”を突起に切り替えることを特徴とする請
求項１に記載の光結合素子の製造方法。6. A part of the lead frames (41) and (42) which suppresses the flow of a transmissive and reflective resin, and is formed with a "V" formed to enhance airtightness between the package and the lead frame. 2. The method according to claim 1, wherein the groove is switched to a protrusion.
流れを抑えるための手段を有するリードフレーム（４
１）（４２）の同一平面上に各々蒸着されて光を発散
し、その発散された光を電気的な信号に変換する発光素
子（４３）及び受光素子（４４）と、 上記発光素子（４３）及び受光素子（４４）を含む周辺
部の上面のみに形成されて上記発光素子（４３）から発
散された光を上記受光素子（４４）に伝達するためのボ
ート（BOAT）型の光伝達通路（４７）と、 上記光伝達通路（４７）の外壁の上、下面に形成された
絶縁のための絶縁膜（４８）（４９）を包含してなるこ
とを特徴とする光結合素子。7. A lead frame (4) having excellent conductivity and having means for suppressing the flow of a transmissive and reflective resin.
1) A light-emitting element (43) and a light-receiving element (44), each of which is vapor-deposited on the same plane of (42) and emits light, and converts the emitted light into an electric signal; ) And a light transmission path of a boat (BOAT) type formed only on the upper surface of the peripheral portion including the light receiving element (44) and transmitting the light diverged from the light emitting element (43) to the light receiving element (44). (47) An optical coupling element comprising: insulating films (48) and (49) for insulation formed on upper and lower surfaces of an outer wall of the light transmission path (47).
手段としてリードフレーム（４１）（４２）（５１）
（５２）上に“Ｖ溝”（６１〜６４）または、“Λ”形
状の突起（６１′〜６４′）を形成してなることを特徴
とする請求項７に記載の光結合素子。8. A lead frame (41) (42) (51) as means for suppressing the flow of the transmissive and reflective resin.
8. The optical coupling device according to claim 7, wherein a "V groove" (61 to 64) or a "Λ" -shaped projection (61 'to 64') is formed on the (52).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970016922A KR100298880B1 (en) | 1997-05-01 | 1997-05-01 | Optical coupling device and method for manufacturing the same |
| KR97-16922 | 1997-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH114016A true JPH114016A (en) | 1999-01-06 |
Family
ID=19504736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13590598A Withdrawn JPH114016A (en) | 1997-05-01 | 1998-05-01 | Optical coupling element and manufacture thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH114016A (en) |
| KR (1) | KR100298880B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4833701A (en) * | 1988-01-27 | 1989-05-23 | Motorola, Inc. | Trunked communication system with nationwide roaming capability |
| US4901340A (en) * | 1988-09-19 | 1990-02-13 | Gte Mobilnet Incorporated | System for the extended provision of cellular mobile radiotelephone service |
| US10483424B2 (en) | 2015-03-02 | 2019-11-19 | Kabushiki Kaisha Toshiba | Signal coupling device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4101468B2 (en) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | Method for manufacturing light emitting device |
| JP2002314143A (en) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | Light emitting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3296650B2 (en) * | 1994-01-25 | 2002-07-02 | 三洋電機株式会社 | Light receiving module |
| JPH08316370A (en) * | 1995-05-22 | 1996-11-29 | Yazaki Corp | Semiconductor device |
-
1997
- 1997-05-01 KR KR1019970016922A patent/KR100298880B1/en not_active IP Right Cessation
-
1998
- 1998-05-01 JP JP13590598A patent/JPH114016A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4833701A (en) * | 1988-01-27 | 1989-05-23 | Motorola, Inc. | Trunked communication system with nationwide roaming capability |
| US4901340A (en) * | 1988-09-19 | 1990-02-13 | Gte Mobilnet Incorporated | System for the extended provision of cellular mobile radiotelephone service |
| US10483424B2 (en) | 2015-03-02 | 2019-11-19 | Kabushiki Kaisha Toshiba | Signal coupling device |
| US11430926B2 (en) | 2015-03-02 | 2022-08-30 | Kabushiki Kaisha Toshiba | Signal coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100298880B1 (en) | 2001-10-26 |
| KR19980082184A (en) | 1998-12-05 |
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|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050705 |