CN1077292C - Holographic optical isolator utilizing opto-electronic transmitter and receiver disposed in a package - Google Patents
Holographic optical isolator utilizing opto-electronic transmitter and receiver disposed in a package Download PDFInfo
- Publication number
- CN1077292C CN1077292C CN 96190443 CN96190443A CN1077292C CN 1077292 C CN1077292 C CN 1077292C CN 96190443 CN96190443 CN 96190443 CN 96190443 A CN96190443 A CN 96190443A CN 1077292 C CN1077292 C CN 1077292C
- Authority
- CN
- China
- Prior art keywords
- lead frame
- holographic element
- frame part
- optoisolator
- photelectric receiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 26
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 238000005538 encapsulation Methods 0.000 claims description 19
- 230000005611 electricity Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004382 potting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 244000141353 Prunus domestica Species 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- -1 silver halide Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
An opto-isolator (10) increases optical efficiency by using holographic elements (22, 24, 26) to direct a beam of light (34) through an optical waveguide (20). An opto-electronic transmitter (12) and receiver (16) are connected to the waveguide to be in alignment with the beam of light reflected by the holographic elements. The transmitter and receiver are disposed on separate leadframe portions (14, 18), and the opto-isolator is surrounded by a package (32).
Description
The present invention relates generally to optical device, relate in particular to the optically-coupled of photoelectric sender and receiver.
Optoisolator is used in requirement two parts of an electronic circuit is carried out electric isolation place, for example, provides improved noise to isolate or prevents that the user from contacting with high-voltage power supply.Existing optoisolator has adopted light emitting diode and the photodetector on two parts that the electricity that is placed on a lead frame isolates, so light emitting diode and photodetector are in same plane.A kind of light transmissive material surrounds light emitting diode and photodetector, and this material is placed in the chamber that is surrounded by a kind of light reflection encapsulating material.The light that light emitting diode sends is reflexed on the photodetector by the chamber wall.
The problem of this existing optoisolator is that light generally will just can shine on the photodetector through the several reflection of the reflection cavity wall surface in chamber.The result that this parasitic light scattering causes is that most of light that light emitting diode sends can not shine the effective surface of photodetector, and the efficient of optoisolator greatly reduces.Therefore, wishing has a kind of like this optoisolator, and wherein the light emitting diode scattering of light of sending can significantly reduce, and makes the efficient of optoisolator be improved.
Unique accompanying drawing is the sectional view according to the optoisolator of an embodiment of the invention.
In brief, the invention provides the optoisolator optical isolator (being also referred to as opto-isolator here) that a kind of light signal that photoelectric sender is sent sends photelectric receiver to.Transmitter and receiver are positioned on the divided portion of a lead frame, and a plane light wave conduit physically is connected to transmitter and receiver, connect so that optics between the two to be provided.Waveguide has a holographic element that is placed on above it at least, is used for to the beam direction that sends from transmitter, points to receiver through waveguide.An encapsulation has been surrounded at least and has been supported that part of of transmitter and receiver in the lead frame.
Can describe the present invention in detail according to unique accompanying drawing, accompanying drawing has diagrammatically illustrated the sectional view of an optoisolator 10.Photoelectric sender 12 is placed on the first lead frame part 14, and photelectric receiver 16 is placed on the second lead frame part 18.Plane light wave conduit 20 has a bottom surface 30 to be placed on transmitter 12 simultaneously and above the receiver 16.Holographic element 22 and 26 all is placed on the end face 28 of waveguide 20, and holographic element 24 is placed on the bottom surface 30 of waveguide 20.Holographic element 22,24 and 26 is all aimed at each other, and aims at transmitter 12 and receiver 16, and therefore, the light beam 34 that transmits from transmitter 12 is reflected by holographic element 22,24,26, and is received the active region induction of device 16.Encapsulation 32 is with transmitter 12, receiver 16, lead frame part 14 and 18, and waveguide 20 reaches holographic element 22,24 and 26 and all seals.
According to the present invention, the first lead frame part 14 and the second lead frame part 18 are substantially in same plane.One preferred embodiment in, this is by using with a slice conductive material, for example Chang Gui lead frame forms part 14 and 18 and realize.Instead, lead frame part 14 can adopt different sheet metals with 18.Utilization is that with the benefit of a slice conductive material transmitter 12 and receiver 16 can reach assembly process and be adhered on the single lead frame before forming encapsulation 32.The manufacturing cost that this has just simplified assembling and has reduced optoisolator 10.
Waveguide 20 is the electrical insulator of printing opacity normally, for example plastics or glass, even and waveguide 20 giving when providing signal path between transmitter 12 and the receiver 16, it also makes between lead frame part 14 and the lead frame part 18 is that electricity is isolated.
Holographic element 22,24 and 26 is to make with known process with common material.More precisely, each holographic element preferably uses thickness to make less than about 100 microns photo-conductive film (being also sometimes referred to as holographic material).This film can large quantities of supplies, dichromated gelatin for example, silver halide emulsion or photopolymer etc.Preferably with the film latex-coating on waveguide 20, then it is placed on the film that exposure has orienting reflex character with formation in the processing of common laser log.Another method is not the film latex exposure that is coated on the waveguide 20, but the holographic element 22,24 and 26 of the light that do not expose to the sun to be placed on the independent light-transmissive substrates (not drawing on the figure), as resin.Then, element 22,24 and 26 is placed in the common laser technology exposure so that their orienting reflex character to be provided.After the exposure, element 22,24 and 26 is transferred to waveguide 20 from light-transmissive substrates.
Those skilled in the art know that the mutual alignment of holographic element 22,24 and 26, transmitter 12 and receiver 16 has determined must be by the angle of holographic element 22,24 and 26 reflections of transmitting.The angle of these reflections is determined with common technology, and is fixed in the laser explosure process of known photosensitive holographic film.The further details of the use of relevant holographic element in relevant optical application is at United States Patent (USP) the 5th, 061, (be presented to F.Richard on October 29th, 1991 No. 027, name is called " Solder-Bump Attached OpticalInterconnect Structure Utilizing Holographic Elements and Method ofMaking Same " and United States Patent (USP) the 5th, 101, (be presented to F.Richard on March 31st, 1992 No. 460, name is called " Simultaneous Bidirectional Optical Inter-connect ") in be described, therefore, these two patents are all by incorporated by reference.
For example, transmitter 12, receiver 16 and holographic element 22,24 and 26 all by a kind of viscose glue of printing opacity attached on the waveguide 20.Transmitter 12 can be any in many common optical transmitters, comprises light emitting diode and semiconductor laser diode, and receiver 16 can be photosensitive circuit arbitrarily usually, for example, and the common photoelectric detector.
For example with welding wire from transmitter 12 and receiver 16 to they separately lead frame part 14 and 18 electrical connection can make by perforate waveguide 20 on request, for example by cutting or etching waveguide 20.Another kind method is, an end of transmitter 12 or receiver 16 can prolong the edge that stretches out waveguide 20, and welding wire can be made on this termination of exposing.Encapsulation 32 is preferably with lead frame part 14 and 18, and transmitter 12, receiver 16, waveguide 20 and holographic element 22,24 and 26 all seal.The material that is used for forming encapsulation 32 is a kind of common molding compounds, as plastics.The strong point of the sealing of this encapsulation 32 is influences that optoisolator 10 is not subjected to ambient light.Compare with existing optoisolator, another strong point of optoisolator 10 is that the material that is used for forming encapsulation 32 need not made by reflective material.This also is because 34 of light beams by holographic element 22,24 and 26 reflections, do not need folded light beam 34 at waveguide 20 and the interface that encapsulates between 32.
Being used for assembling optoisolator 10 all is conventional with the manufacturing technology that forms encapsulation 32.Encapsulation 32 is preferably in lead frame part 14 and 18 and is just formed around them before the electricity isolation.When utilizing a shared lead frame, after sealing by for example, unwanted part in the shared lead frame that prunes away, as be used to the rail that interconnects, microbot and transverse arm make lead frame part 14 and 18 electricity isolation.
The physical size of encapsulation 32 and the distance between transmitter 12 and the receiver 16 change with specific application certainly.But expectation optoisolator size is littler, and for example, transmitter 12 wherein and receiver 16 are isolated less than about 5 mm distance by one.The thickness of plane light wave conduit 20 is also variable, but preferably thickness less than about 3 millimeters.
Although what show on unique accompanying drawing is an independent photelectric receiver 16, in other embodiment, can come to carry out optically-coupled with a plurality of receivers (not drawing among the figure) with single photoelectric sender 12.This by for example with holographic element 26 with light beam 34 split into two the bundle or more multi beam light realize.In such embodiment, every bundle light is reflected and shines on the different photelectric receivers.For example, second receiver (not drawing among the figure) can be placed on the lead frame part 18 of receiver 16, also contact with the bottom surface 30 of waveguide 20, like this, second light beam irradiates that it can be split off from holographic element 26.
In addition to the above, as another embodiment of the invention, those skilled in the art will appreciate that and can not replace three holographic elements with single holographic element (drawing among the figure).This is by realizing on the surface 28 that single holographic element is placed on optical waveguide 20, directly reflected to single holographic element from the light beam 34 of transmitter 12 by waveguide 20, and return through waveguide 20 to receiver 16, in this embodiment, this holographic element is placed on the surface 28, flatly is placed on transmitter 12 and receiver 16 middle somewheres.Compare with three holographic elements of top use, the different reflection angle of the single holographic element of these embodiment special requirement, and these angles can determine with the geometrical calculation of standard.Can believe, compare with the situation of top three holographic elements of use of describing in the first embodiment, can provide higher optical efficiency for optoisolator 10 as the single holographic element of describing just now of use.
Now, should be understood that and described a kind of new optoisolator that it has improved greatly efficient, because it does not rely on reflectivity chamber wall to the photo-signal channel of scattering of light as it.Replace, the light that photoelectric sender of the present invention sends by holographic film with a kind of controlled, mode reflection orienting repeatably.An advantage is because the light losing minimum that scattering causes.Another advantage of the present invention is that photoelectric sender and receiver can form on same lead frame, and this has just reduced complicacy and the cost made.Owing to can utilize a shared lead frame after this manner, so can seal optoisolator with common, encapsulation cheaply.
Aforementioned discussion disclosure and description only be exemplary method of the present invention and embodiment.After being proficient in people's understanding of technology, invention can the concrete mode with other embody under the situation of not violating essence or essential characteristic.For example, aim at by appropriate change and reflection angle utilizes holographic element more than three.Therefore, instructions of the present invention only is illustrative and not restrictive, for scope of invention, will propose in following claims.
Claims (20)
1. optoisolator comprises:
First lead frame part and the second lead frame part, first lead frame part described here and described second lead frame partly are that electricity is isolated and are placed on the plane of a complete coplane;
Photoelectric sender is placed on described first lead frame part;
First photelectric receiver is placed on described second lead frame part;
The plane light wave conduit that an end face and a bottom surface are arranged, bottom surface described here are placed on described transmitter and the described photelectric receiver;
First holographic element is placed on the described end face of described waveguide, and aims at described transmitter, makes the light beam of launching from described transmitter be entered described optical waveguide by described first holographic element reflection;
Second holographic element is placed on the described bottom surface of described optical waveguide, and aims at described first holographic element, makes described light beam be entered described optical waveguide by described second holographic element reflection;
The 3rd holographic element is placed on the described end face of described optical waveguide, and aims at described second holographic element and described first photelectric receiver simultaneously, and described light beam is reflexed on described first photelectric receiver by described the 3rd holographic element; And
Encapsulation, to the described first lead frame part of major general, the described second lead frame part, described transmitter, and described first photelectric receiver seals.
2. the optoisolator of claim 1, wherein said optical waveguide is selected from the group of being made up of glass and plastics.
3. the optoisolator of claim 1, wherein said encapsulation is made by molding compounds.
4. the optoisolator of claim 1, wherein said photoelectric sender is a light emitting diode.
5. the optoisolator of claim 1, wherein said first photelectric receiver is a photodetector.
6. the optoisolator of claim 1, wherein said first lead frame part and described second lead frame are partly by making with a slice conductive material.
7. the optoisolator of claim 1, the thickness of wherein said first holographic element is less than about 100 microns.
8. the optoisolator of claim 1, the spacing of wherein said photoelectric sender and described first photelectric receiver is less than about 5 millimeters.
9. the optoisolator of claim 1, wherein said encapsulation further seals described optical waveguide, described first holographic element, described second holographic element and described the 3rd holographic element.
10. the optoisolator of claim 1, wherein described at least first, second, and one of the 3rd holographic element be one first light beam and one second light beam with described beam splitting, described first light beam impinges upon on described first photelectric receiver, and described second light beam impinges upon on second photelectric receiver.
11. an optoisolator comprises:
First lead frame part and the second lead frame part, wherein said first lead frame part and described second lead frame partly are that electricity is isolated, be placed on the same plane, and by making with a slice conductive material;
Photoelectric sender is placed on described first lead frame part;
Photelectric receiver is placed on described second lead frame part, and the distance of wherein said photoelectric sender and photelectric receiver is less than about 5 millimeters;
Plane light wave conduit, thickness be less than about 3 millimeters, and an end face and a bottom surface are arranged, and wherein said bottom surface is placed on described photoelectric sender and the described photelectric receiver;
First holographic element, thickness are placed on the described end face of described optical waveguide less than about 100 microns, and aim at described photoelectric sender, and described photoelectric sender emitted light beams is entered in the described optical waveguide by described first holographic element reflection;
Second holographic element, thickness are placed on the described bottom surface of described optical waveguide less than about 100 microns, and aim at described first holographic element, and described light beam is entered in the described optical waveguide by described second holographic element reflection;
The 3rd holographic element, thickness are placed on the described end face of described optical waveguide less than about 100 microns, and aim at described second holographic element and described photelectric receiver simultaneously, and described light beam is reflexed on the photelectric receiver by described the 3rd holographic element; And
Encapsulation, at least the described first lead frame part, the described second lead frame part, described photoelectric sender, and described photelectric receiver seals.
12. the optoisolator of claim 11, wherein said encapsulation be further described optical waveguide, described first holographic element, and described second holographic element and described the 3rd holographic element seal.
13. the optoisolator of claim 12, wherein said first lead frame part and described second lead frame part were got up by described potting before being isolated by electricity.
14. an optoisolator comprises:
First lead frame part and the second lead frame part, wherein said first lead frame part and described second lead frame part are isolated by electricity, and are placed on the same plane;
Photoelectric sender is placed on described first lead frame part;
First photelectric receiver is placed on described second lead frame part;
The plane light wave conduit has a first surface and a second surface, and wherein said second surface is placed on described photoelectric sender and described first photelectric receiver;
Holographic element, be placed on the described first surface of described optical waveguide, and aim at described photoelectric sender and described first photelectric receiver, described photoelectric sender emitted light beams is reflexed on described first photelectric receiver through described optical waveguide by described holographic element; And
Encapsulation, at least the described first lead frame part, the described second lead frame part, described photoelectric sender and described first photelectric receiver seal.
15. the optoisolator of claim 14, wherein said optical waveguide is selected from the group of being made up of glass and plastics.
16. the optoisolator of claim 14, wherein said encapsulation is made by molding compounds.
17. the optoisolator of claim 14, wherein said photoelectric sender is a light emitting diode.
18. the optoisolator of claim 14, wherein said first lead frame part and described second lead frame are partly by making with a slice conductive material.
19. the optoisolator of claim 14, the spacing of wherein said photoelectric sender and described first photelectric receiver is less than about 5 millimeters.
20. the optoisolator of claim 14, wherein said holographic element is one first light beam and one second light beam with described beam splitting, and described second light beam impinges upon on second photelectric receiver.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43383695A | 1995-05-02 | 1995-05-02 | |
| US08/433,836 | 1995-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1155932A CN1155932A (en) | 1997-07-30 |
| CN1077292C true CN1077292C (en) | 2002-01-02 |
Family
ID=23721716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 96190443 Expired - Fee Related CN1077292C (en) | 1995-05-02 | 1996-03-15 | Holographic optical isolator utilizing opto-electronic transmitter and receiver disposed in a package |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH09510835A (en) |
| CN (1) | CN1077292C (en) |
| WO (1) | WO1996036900A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010161202A (en) | 2009-01-08 | 2010-07-22 | Renesas Electronics Corp | Optically coupled device and method of manufacturing the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4087159A (en) * | 1974-09-20 | 1978-05-02 | Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. | Self imaging system using a waveguide |
| GB1514477A (en) * | 1974-09-24 | 1978-06-14 | Post Office | Optical devices |
| FR2622706B1 (en) * | 1987-11-03 | 1992-01-17 | Thomson Csf | DYNAMIC OPTICAL INTERCONNECTION DEVICE FOR INTEGRATED CIRCUITS |
| US5185814A (en) * | 1989-07-13 | 1993-02-09 | British Telecommunications Public Limited Company | Optical fiber communications network including plural amplifiers with single pump source |
| US5101460A (en) * | 1990-09-04 | 1992-03-31 | Motorola, Inc. | Simultaneous bidirectional optical interconnect |
| US5061027A (en) * | 1990-09-04 | 1991-10-29 | Motorola, Inc. | Solder-bump attached optical interconnect structure utilizing holographic elements and method of making same |
-
1996
- 1996-03-15 CN CN 96190443 patent/CN1077292C/en not_active Expired - Fee Related
- 1996-03-15 WO PCT/US1996/003576 patent/WO1996036900A2/en active Application Filing
- 1996-03-15 JP JP8534799A patent/JPH09510835A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996036900A3 (en) | 1997-01-16 |
| WO1996036900A2 (en) | 1996-11-21 |
| JPH09510835A (en) | 1997-10-28 |
| CN1155932A (en) | 1997-07-30 |
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