JP2000008190A - Electroplated base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an electroplated base which is manufactured with an easy operation, is excellent in yield and is high in reliability. SOLUTION: In the electroplated base 1 incorporating a base body 11, the plating base 13 consisting of 2 or more kinds of metallic films laminated on the base body 11 and a metallic layer 14 formed on the plating base 13 by electroplating, a metal constituting the uppermost layer 13b on the plating base 13 is a same metal as the metallic layer 14, the thickness of the plating base 13 is <=1/2 of the thickness of the metallic layer 14, and further, the plating base 13 is exposed on the outer circumferential edge part of the base body 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating substrate serving as a basic component of an electric component (surface mount component, lead component), and more particularly, to an inductor (L) and a capacitor using a plating process in a manufacturing process. (C), a single element component such as a resistance element (R), or an electroplating substrate used for a composite element component such as an EMI filter, a common mode choke coil, a current sensor, a signal transformer, etc. It belongs to the electroplating substrate having the characteristic.

[0002]

2. Description of the Related Art FIGS. 3A and 3B show an example of a conventional electroplating substrate, wherein FIG. 3A is a plan view, FIG. 3B is an enlarged view of a portion C shown in FIG. It is sectional drawing in the -D line.

Conventionally, a Cu electroplated substrate 1 shown in FIG.
It has been known. In this conventional electroplating substrate 1, an insulating resin layer 12 is formed on a substrate body 11, and a plating base 19 made of Cr-Pd is formed on the insulating resin layer 12 by a sputtering method (Cr layer is indicated by 19a, Pd layer is indicated by 19a). Is indicated by 19b), a resist 2 is applied on the plating base 19, and the resist 2 is cured into a predetermined shape by exposure or the like to form a pattern 2a for forming a metal pattern or a contact of a circuit element. Then, using the resist 2 having the pattern 2a of a predetermined shape as a mask, the electroplating of Cu is performed on the plating base 19 to form a metal layer 14 such as a metal pattern.

Conventionally, a resist 2 (a portion shown by hatching in FIG. 3A) covering a plating base 19 is
At the outer peripheral edge of the electroplating substrate 1, it is removed at predetermined intervals. As a result, the plating base 19 is partially exposed at the outer peripheral edge of the electroplating substrate 1, and this exposed portion becomes a terminal connected to one electrode during electroplating.

The resist 2 is used only when a Cu metal pattern is formed, and is removed after electroplating. Also,
The plating base 19 of the non-electroplated portion exposed by removing the resist is also removed by dry etching or wet etching.

[0006]

However, Cr-Pd as a plating base is expensive in spattering, and the equipment for dry etching of the non-electroplated portion exposed by removing the resist is expensive. Cr
The wet etching of -Pd has a drawback that workability and safety are low because a highly dangerous chemical is used.

Further, there is a disadvantage that the variation in the thickness of the metal pattern obtained by the electroplating of Cu is about 20%, the variation in the electrical characteristics is large, and the reliability of the electrical characteristics is low.

Therefore, a technical object of the present invention is to provide an electroplated substrate which is easy to manufacture, has excellent yield, and has high reliability.

[0009]

According to the present invention, a substrate body, a plating base made of two or more metal films laminated on the substrate body, and an electroplating formed on the plating base. In the electroplating substrate including the metal layer, the metal serving as the uppermost layer of the plating base is the same metal as the metal layer, and the thickness of the plating base is 以下 or less of the thickness of the metal layer. And further, the plating base is:
An electroplated substrate is obtained, which is exposed all around the outer peripheral edge of the substrate body.

Further, according to the present invention, the metal layer is formed of C
u, and the plating base is Ti-Cu, thereby obtaining an electroplating substrate.

Further, the thickness of the plating base is 0.5 μm.
m or less, and the thickness of the metal layer is 1.0 μm or more.

Further, according to the present invention, there is provided an electronic component characterized by being constructed using the above-mentioned electroplated substrate.

[0013]

By using a plating base other than Cr-Pd, the cost of sputtering and the cost, workability, and safety of etching after removal of the resist are significantly improved.

The plating base is exposed on the entire periphery of the outer peripheral edge of the substrate body, and this exposed portion is used as a terminal connected to one electrode during electroplating. Therefore, the thickness of the metal pattern obtained by electroplating is reduced. Variation is reduced,
As a result, the variation in the electrical characteristics was significantly improved, and the reliability of the electrical characteristics was improved.

With the above-described structure, it has become possible to provide an electronic component which is easy to manufacture, has excellent yield and high reliability and is inexpensive.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS For example, when a Cu metal layer is formed on a substrate body by electroplating, the plating base is made of Ti-
The uppermost layer is Cu metal which is the same as the metal to be electroplated.
In the following, the thickness of the metal layer formed by electroplating was set to 1.0 μm or more, and wet etching was used as the etching of the plating base and the metal layer.

With respect to the variation in the pattern thickness of the metal layer obtained by the electroplating of Cu, the plating base is exposed over the entire outer periphery of the substrate body, and the exposed portion of the plating base is connected to one electrode. The thickness of the metal layer was prevented from being varied by electroplating using the terminal as a terminal.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

FIG. 1 shows an electroplating substrate according to an embodiment of the present invention, wherein (a) is a plan view, (b) is an enlarged view of a portion A shown in (a), and (c) is shown in (b). It is sectional drawing in the BB line.

The electroplating substrate 1 includes a substrate main body 11, an insulating resin 12 formed on the upper surface of the substrate main body 11, and a plurality of metal films formed on the upper surface of the insulating resin 12 by sputtering. 13 are provided. The upper surface of the plating base 13 is covered with a resist 2, and the resist 2 has a circuit element 15 to be obtained by electroplating.
(Consisting of insulating resin 12 and metal pattern 14; FIG. 2
2) for forming the metal pattern 14 of FIG.

Here, since the Cu metal pattern (metal layer) 14 is formed by electroplating, the same metal as that of the metal pattern 14 is used for the uppermost layer 13b of the plating base 13, and the lower layer 13a Is made of Ti. The thickness of the Cu metal pattern 14 formed by electroplating is 1.0 μm or more, and the thickness of the plating base 13 is 0.5 μm or less.

The sputtering of Ti—Cu can be performed at a low cost, and the plating base 1 made of Ti—Cu can be used.
The wet etching of No. 3 can be performed using a safe chemical. In this way, improvements were made in manufacturing cost and workability and safety in the manufacturing process.

As described above, the pattern 2a for forming the metal pattern 14 of the circuit element 15 to be obtained by electroplating with the resist 2 is formed on the electroplating substrate 1; The ring is removed at the outer peripheral edge of the substrate main body 11, and as a result, as shown in FIG.
Is exposed. The plating base 13 exposed at the outer peripheral edge of the substrate body 11 serves as a terminal connected to a cathode when performing electroplating. As described above, since the terminals connected to the cathode during the electroplating are formed on the entire outer peripheral edge of the substrate main body 11, a voltage is uniformly applied to the entire electroplating substrate 1, and the metal is applied. Variations in the thickness of the pattern 14 are reduced. In this way, by significantly reducing the variation in the thickness of the metal pattern 14 of the circuit element 15 formed on the electroplating substrate 1, the variation in the electrical characteristics of the circuit element 15 is reduced, and the quality and reliability as a product are reduced. Improved.

In the electroplating substrate 1, after the metal pattern 14 is formed, the resist is removed, and the exposed plating base 13 is etched to remove the metal pattern 14.
The same shape as above, and the insulating resin 12 and the metal pattern 14
Are repeatedly superimposed to form a circuit element 15
Needless to say, is formed.

FIG. 2 is a perspective view of an electronic component (EMI filter) constructed using the electroplated substrate shown in FIG.

The electroplated substrate 1 formed as described above is cut in units of circuit elements, and external electrode terminals 16 are formed on the cut electroplated substrate 1 ′ to form electronic components 10.
It is set to 0.

In this embodiment, the electronic component 10
Although an EMI filter is illustrated as 0, electronic devices such as a single element component such as an inductor (L), a capacitor (C), and a resistance element (R), or a composite element component such as a common mode choke coil, a current sensor, and a signal capacitance are used. It is obvious that the present invention can be applied to circuit elements of components (surface mount components, lead components) and the like, and is an effective means in the field of plating processes.

In this embodiment, since the metal layer is made of Cu, a plating underlayer of Ti-Cu is combined.
Other than this, the combination of metal layer and plating base
For example, there is a combination of a Ni metal layer and a Ti-Ni plating base.

[0029]

As described above, according to the present invention, when a metal layer is formed on a substrate body by electroplating, the uppermost layer of the plating base is made of the same metal as the metal to be electroplated, and By reducing the thickness of the plating base to half or less of the thickness of the metal layer formed by electroplating, the wet etching is performed to improve the manufacturing cost, workability in the manufacturing process, and safety, and By exposing the plating base in a ring shape all around the outer peripheral edge of the electroplated substrate, the variation in the pattern thickness of the circuit element is reduced, and as a result, the variation in the electrical characteristics can be suppressed, and the manufacturing is easy. Thus, it is possible to provide an electronic component having excellent yield, high quality and high reliability at low cost.

[Brief description of the drawings]

1A and 1B show an electroplating substrate according to an embodiment of the present invention, wherein FIG. 1A is a plan view, FIG. 1B is an enlarged view of a portion A shown in FIG. 1A, and FIG. It is sectional drawing in the B line.

FIG. 2 is a perspective view of an electronic component configured using the electroplating substrate shown in FIG.

FIG. 3 shows an example of a conventional electroplated substrate,
(A) is a plan view, (b) is an enlarged view of a portion C shown in (a),
(C) is a sectional view taken along line DD shown in (b).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electroplating board 11 Substrate main body 12 Insulating resin 13 Plating base (Ti-Cu) 13a Lowermost layer (Ti layer) 13b Uppermost layer (Cu layer) 14 Metal pattern (metal layer) 15 Circuit element 16 External electrode 100 Electronic component 2 Resist 2a pattern

Claims (4)

[Claims] 1. An electroplating substrate comprising: a substrate body; a plating base made of two or more metal films laminated on the substrate body; and a metal layer formed by electroplating on the plating base. The metal serving as the uppermost layer of the plating base is the same metal as the metal layer, and the thickness of the plating base is の of the thickness of the metal layer.
The electroplating substrate according to claim 1, wherein the plating base is exposed all around an outer peripheral edge of the substrate body. 2. The electroplating substrate according to claim 1, wherein said metal layer is Cu, and said plating underlayer is Ti-Cu. 3. The electroplating substrate according to claim 1, wherein a thickness of the plating base is 0.5 μm or less, and a thickness of the metal layer is 1.0 μm or more. 4. An electronic component comprising the electroplated substrate according to claim 1. Description: