JP3018830B2 - Electronic component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a capacitor, an inductor or a filter, which is surface-mounted on a printed wiring board or the like and constitutes various electronic circuits, and a method of manufacturing the same .

[0002]

2. Description of the Related Art Conventionally, the internal conductor of a conventional electronic component has been formed by printing and applying a conductive paste on the surface of an insulating substrate, followed by drying and baking. The inner conductor obtained in this manner has a minimum line width and a minimum line interval of about 100 to 200 μ, a large dimensional variation in the line width and the line interval, and there is a limit in increasing the density. In addition, in order to form an internal conductor having stable characteristics, it is necessary to use a high-temperature sintering-type conductive paste, and it is necessary to cope with characteristic deterioration caused by raising the temperature of an electronic component.

On the other hand, the outer conductor of an electronic component is usually dried and baked after applying a conductive paste to the surface of a substrate.
It was formed by electroplating or electroless plating thereon. However, when a conductive paste is used, as described above, it is necessary to cope with the characteristic degradation caused by the high temperature of the electronic component. In the case of plating, there has been a problem of deterioration of characteristics due to immersing the electronic component in a reactive plating solution.

[0004] Therefore, an object of the present invention has an inner conductor having excellent dimensional accuracy, the electronic components and the characteristics of components in forming the inner and outer conductors is no possibility to degrade
It is to provide a manufacturing method .

[0005]

In order to solve the above-mentioned problems, an electronic component according to the present invention comprises: (a) an internal conductor formed on the surface of an insulating substrate ; (B) an outer conductor formed at least at an end portion of the insulating substrate includes an adhesive layer and a solder provided on the surface of the adhesive layer; And (c) an adhesive layer for the internal conductor and an adhesive layer for the external conductor.
Are made of the same material, and the adhesive layers are connected to each other; (d) each of the adhesive layers, the conductor layer, the solder crack preventing layer, and the oxidation preventing layer is a dry plating layer,
It is characterized by the following.

Further, the electronic component according to the present invention includes: (e) an insulating substrate having an inner conductor provided on each of the front and back surfaces.
And an insulating substrate with an internal conductor on either side
A structure with a plate and an insulating adhesive bonded together,
An outer conductor is provided at an end of the structure; and (f) the inner conductor is provided on an adhesive layer and a surface of the adhesive layer.
Consists in vignetting conductor layer, (g) said outer conductor, set on the surface of the adhesive layer and the adhesive layer
Table of the solder crack prevention layer and the solder crack prevention layer
It is composed of antioxidant layer provided on the surface, and the adhesive layer of the outer conductor and the adhesive layer (h) the inner conductor
Are made of the same material, the adhesive layers are connected to each other, and (i) the adhesive layer, the conductor layer, and the solder crack preventing layer.
And the antioxidant layer are each a dry plating layer, this
And features.

Further, the method for manufacturing an electronic component according to the present invention includes: (j) forming an adhesive layer film and a conductor layer film on a surface of an insulating substrate by a dry plating method; Etching a part of the film to form a desired inner conductor composed of an adhesive layer and a conductor layer provided on the surface of the adhesive layer; and (k) at least an end of the insulating substrate. In addition, each of which consists of a dry plating layer, a desired layer comprising an adhesive layer, an anti-scratch layer provided on the surface of the adhesive layer, and an antioxidant layer provided on the surface of the anti-solder layer Forming an outer conductor ; (l) an adhesive layer of the inner conductor and an adhesive layer of the outer conductor;
Are made of the same material, the adhesive layers are connected to each other, and
The adhesive layer, the inner conductor, the insulating substrate and
The external conductor is adhered .

Further, a method for manufacturing an electronic component according to the present invention.
After masking the unnecessary parts for forming the outer conductor,
Dry the adhesive layer, solder crack prevention layer and oxidation prevention layer in order.
Formed on the adhesive layer and provided on the surface of the adhesive layer.
Solder crack prevention layer and the surface of this solder crack prevention layer
Desired external conductor composed of an antioxidant layer provided on
To form Or adhesive layer film, solder crack prevention layer
A film and an antioxidant layer film were sequentially formed by a dry plating method.
Thereafter, the adhesive layer film, the solder crack preventing layer film and the acid
A part of the anti-oxidation layer film is etched to
Anti-scratch layer provided on the surface of the adhesive layer and this solder
It consists of an antioxidant layer provided on the surface of
The desired outer conductor is formed.

As a material of the adhesive layer, a material having excellent adhesion to an insulating member, for example, nichrome, titanium, chromium,
Nickel or the like is used. As a material for the conductor layer, a material having excellent conductivity, for example, silver, copper, or the like is used. As a material for the solder crack preventing layer, a material having excellent solder heat resistance and conductivity, such as Monel, is used. As the material of the antioxidant layer, a material having excellent solderability and conductivity, for example, silver or the like is used. Here, the dry plating layer is a layer formed by sputtering, vapor deposition, or the like.

[0010] With the above configuration, good bonding between the inner conductor and the insulating substrate is ensured by the adhesive layer, and good conductivity of the inner conductor is ensured by the conductor layer. In addition, good bonding between the outer conductor and the substrate surface is ensured by an adhesive layer, good solder heat resistance of the outer conductor is ensured by a solder tear prevention layer, and good solderability of the outer conductor is antioxidant. The good conductivity of the outer conductor is ensured by the anti-soldering layer and the anti-oxidation layer.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component according to the present invention and a method of manufacturing the same will be described.
An embodiment of the method will be described with reference to the accompanying drawings. In the following embodiments, the same components and the same portions are denoted by the same reference numerals.

[First Embodiment, FIGS. 1 to 7] In a first embodiment, a chip filter for a high-frequency band is used as an example of an electronic component, and an internal part formed of an adhesive layer made of nichrome and a conductor layer made of silver. A description will be given of a case including a conductor, an external electrode composed of an adhesive layer made of nichrome, a solder crack preventing layer made of monel, and an oxidation preventing layer made of silver. As shown in FIGS. 1 to 3, the chip filter 1 includes an insulating substrate 2, a pair of internal conductors 3 and 4 provided on an upper surface of the insulating substrate 2, and a grounding filter provided on a lower surface of the insulating substrate 2. The inner conductor 5, insulating coating films 8 and 9 covering the upper and lower surfaces of the insulating substrate 2, input / output external electrodes 12 and 13 provided at both ends of the filter 1, and the filter 1
Ground external electrodes 1 provided on both side surfaces of the
4.

The internal conductor 3 is electrically connected to the input / output external electrode 12 and the ground external electrode 14 through the lead portions 3c and 3d. The internal conductor 4 is electrically connected to the input / output external electrode 13 and the ground external electrode 14 through the lead portions 4c and 4d. The ground inner conductor 5 is electrically connected to the ground external electrode 14 via the lead portions 5c and 5d. The inner conductors 3, 4, and 5 are respectively composed of adhesive layers 3a, 4a, 5a made of nichrome and the adhesive layers 3a, 4a, 5a.
a, a conductive layer 3 made of silver provided on the surface of 4a, 5a
b, 4b, and 5b.
Since nichrome is a metal having excellent adhesion to the insulating member, the inner conductors 3 to 5 and the insulating substrate 2 are bonded to the adhesive layers 3a to 5a.
Good bonding. Nichrome does not require the use of a harmful etchant as compared with metals such as titanium and chromium, and is relatively easy to treat etching waste liquid. Furthermore, nichrome is cheaper than titanium or the like, and can reduce manufacturing costs. Since silver is a metal having excellent conductivity, the internal conductors 3 to 5 have good conductivity due to the conductor layers 3b to 5b, and a filter having excellent quality Q can be obtained.

The insulating coating films 8 and 9 are made of an insulating material having excellent heat resistance, such as a polyimide resin. The input / output external electrodes 12 and 13 and the ground external electrode 14
Adhesive layers 12a, 13a, 14 each made of nichrome
a and the solder crack preventing layers 12b, 13b, made of Monel provided on the surfaces of the adhesive layers 12a, 13a, 14a.
14b and the solder crack preventing layers 12b, 13b, 14b
Antioxidant layers 12c and 13 made of silver provided on the surface of
c, 14c. The electrodes 12 to 14 and the insulating substrate 2 or the insulating coating film 8,
9 is satisfactorily joined by the adhesive layers 12a to 14a.
Since Monel is a metal having excellent solder heat resistance and conductivity, the external electrodes 12 to 14 are provided with solder break prevention layers 12b to 1b.
4b has good solder heat resistance and conductivity. Since silver is a metal having excellent solderability and conductivity, the external electrodes 12 to 14 have good solderability and conductivity due to the antioxidant layers 12c to 14c.

Next, referring to FIG. 4 to FIG.
The method for forming No. 5 will be described. As shown in FIG. 4, a metal film is formed on the upper and lower surfaces of the insulating substrate 2 in the order of the nichrome film 20 and the silver film 21 by dry plating such as sputtering or vapor deposition. Next, after covering the entire surface of the silver film 21 with a resist film, an unnecessary portion of the resist film is peeled off to expose a part of the surface of the silver film 21. Next, as shown in FIG. 5, the exposed silver film 21 is etched with a silver etchant.
Are etched to form conductor layers 3b to
5b is formed. Next, as shown in FIG. 6, using the resist film and the conductor layers 3b to 5b as a resist film, the exposed nichrome film 2 is etched with a nichrome etchant.
0 is etched, and the adhesive layer 3a of the internal conductors 3 to 5 is etched.
After forming ~ 5a, the remaining resist film is peeled off. The inner conductors 3 to 5 thus obtained have excellent dimensional accuracy and are suitable for high frequency band chip filters.

Next, a method of forming the external electrodes 12 to 14 will be described. As shown in FIG. 7, the upper and lower surfaces of the insulating substrate 2 are covered with insulating coating films 8 and 9. next,
After covering unnecessary portions for forming the external electrodes 12 to 14 with a masking material, the external electrodes 12 to 1 are dry-plated.
No. 4, the adhesion layers 12a to 14a made of nichrome, then the solder crack prevention layers 12b to 14b made of monel, and the oxidation prevention layers 12c to 14c made of silver are formed in this order (see FIG. 2). The external electrodes 12 to 14 thus obtained have excellent dimensional accuracy.

As described above, each of the internal conductors 3 to 5 and the external electrodes 12 to 14 has a two-layer structure of an adhesive layer and a conductor layer, and a three-layer structure of an adhesive layer, a solder crack preventing layer, and an oxidation preventing layer. The inner conductors 3 to 5 and the outer electrodes 12 to 14
Can be treated at a relatively low temperature, and deterioration of the characteristics of components due to high-temperature treatment and immersion in a reactive plating solution can be prevented.

[Second Embodiment, FIGS. 8 to 10] In a second embodiment, as shown in FIGS. 8 to 10, an insulation in which the internal conductors 3 to 5 described in the first embodiment are provided on the upper and lower surfaces. Substrate 2 and insulating substrate 3 provided with internal conductor 33 on the upper surface
A description will be given of a chip filter 31 having a structure in which 2 is bonded with an insulating adhesive 36 such as a polyimide resin.
The chip filter 31 has input / output external electrodes 42 and 43 provided on both ends and ground external electrodes 44 provided on both side surfaces.

The internal conductor 33 provided on the upper surface of the insulating substrate 32 has a two-layer structure including an adhesive layer 33a made of nichrome and a conductor layer 33b made of silver. The external electrodes 42 to 44 are respectively composed of adhesive layers 42a to 44a made of nichrome, solder fray prevention layers 42b to 44b made of monel, and oxidation prevention layers 42c to 4 made of silver.
4c has a three-layer structure. 37,38
Is an insulating coating film made of a polyimide resin or the like.

Next, a method for forming the external electrodes 42 to 44 will be described. Since the internal conductor 33 is formed by the same method as the internal conductors 3 to 5 of the first embodiment, the description is omitted. The upper and lower surfaces of the filter 31 in which the insulating substrates 2 and 32 are bonded together to form an integral body,
Cover at 38. Next, portions unnecessary for forming the external electrodes 42 to 44 are masked, and the adhesive layers 42a to 44a made of nichrome and the solder fray prevention layer 42 made of monel are masked.
The anti-oxidation layers 42c to 44c made of silver are formed in this order by dry plating means such as sputtering or vapor deposition.

The external electrodes 42 to 4 are formed by the following method.
4 may be formed. First, a metal film is formed on the entire upper and lower surfaces of the filter 31 in the order of a nichrome film, a monel film, and a silver film by dry plating such as sputtering or vapor deposition. Next, after covering the entire surface of the silver film with a resist film, an unnecessary part of the resist film is peeled off to expose a part of the surface of the silver film. Next, the exposed portions of the silver film are etched with a silver etchant to form antioxidant layers 42c to 44c of the external electrodes 42 to 44. At this time, a part of the monel film is also etched by the silver etchant. next,
The resist film and the antioxidant layers 42c to 44c are used as resist films to etch the monel film and the nichrome film with a nichrome etching solution to prevent the solder from being removed.
To 44b and adhesive layers 42a to 44a. In this case, since the monel film is etched by both the silver etchant and the nichrome etchant, the external electrode 4
Although the dimensional accuracy of 2 to 44 is slightly lower than that of the filter of the first embodiment, there is no problem in practical use. After that, the remaining resist film is peeled off.

The chip filter 31 thus obtained is
The same operation and effect as those of the chip filter 1 of the first embodiment are obtained.

[Other Embodiments] The electronic component and the method of manufacturing the same according to the present invention are not limited to the above embodiment, but can be variously modified within the scope of the invention. In particular, in the above-described embodiment, a high frequency band chip filter has been described as an example. However, the present invention is not limited to this, and electronic components such as capacitors and inductors may be used.

[0024]

As is apparent from the above description, according to the present invention, the inner conductor is constituted by the adhesive layer of dry plating and the conductor layer, and the outer conductor is constituted by the adhesive layer of dry plating and the solder crack preventing layer. And the anti-oxidation layer, the inner conductor and the outer conductor can be formed at a relatively low temperature, and the characteristic deterioration of components due to high-temperature treatment and immersion in a reactive plating solution can be prevented. Further, by forming the inner conductor and the outer conductor into a multilayer structure, it is possible to obtain an inner conductor and an outer conductor having excellent adhesion to a substrate, solder heat resistance, solderability, and conductivity.

Further, the dimensional accuracy of the inner conductor and the outer conductor formed by dry plating is superior to the dimensional accuracy of the conductor formed by printing and applying a conductive paste, and the electronic conductor has less variation in electrical characteristics. Parts are obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a first embodiment of an electronic component according to the present invention.

FIG. 2 is a vertical sectional view taken along line II-II of FIG.

FIG. 3 is a horizontal sectional view showing the inside of the electronic component shown in FIG. 1;

FIG. 4 is a vertical sectional view for explaining a method of manufacturing the electronic component shown in FIG.

FIG. 5 is a vertical sectional view for explaining the manufacturing method following FIG. 4;

FIG. 6 is a vertical sectional view for explaining the manufacturing method following FIG. 5;

FIG. 7 is a vertical sectional view for explaining the manufacturing method following FIG. 6;

FIG. 8 is a perspective view showing the appearance of a second embodiment of the electronic component according to the present invention.

FIG. 9 is a vertical sectional view taken along the line IX-IX of FIG. 8;

FIG. 10 is a horizontal sectional view showing the inside of the electronic component shown in FIG. 8;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chip filter 2 ... Insulating substrate 3,4,5 ... Inner conductor 3a, 4a, 5a ... Adhesive layer 3b, 4b, 5b ... Conductor layer 12,13,14 ... External electrode 12a, 13a, 14a ... Adhesive layer 12b , 13b, 14b: anti-scratch layer 12c, 13c, 14c: antioxidant layer 31: chip filter 32: insulating substrate 33: internal conductor 33a: adhesive layer 33b: conductor layer 42, 43, 44: external electrode 42a, 43a, 44a: adhesive layer 42b, 43b, 44b: anti-scratch layer 42c, 43c, 44c: antioxidant layer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-49-121957 (JP, A) JP-A-56-167318 (JP, A) JP-A-5-47585 (JP, A) JP-A-4- 357807 (JP, A) JP-A-60-195916 (JP, A) JP-B-63-9647 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01G 1 / 00-1 / 017 H01G 13/00-13/06

Claims (5)

(57) [Claims] An internal conductor formed on a surface of an insulating substrate is composed of an adhesive layer and a conductor layer provided on a surface of the adhesive layer, and an external conductor formed on at least an end of the insulating substrate. The conductor is composed of an adhesive layer, a solder crack preventing layer provided on the surface of the adhesive layer, and an oxidation preventing layer provided on the surface of the solder crack preventing layer. Same as the conductor adhesive layer
An electronic component comprising a material, wherein the adhesive layers are connected to each other, and each of the adhesive layers, the conductor layer, the solder crack preventing layer, and the oxidation preventing layer is a dry plating layer. (2) Insulation with internal conductors on each side
The conductive board and the inner conductor are provided on either side.
A structure in which an edge substrate is bonded with an insulating adhesive
Having an external conductor at the end of the structure, The inner conductor is provided on an adhesive layer and a surface of the adhesive layer.
Composed of conductive layers, The external conductor is provided on an adhesive layer and a surface of the adhesive layer.
The solder crack prevention layer and the surface of this solder crack prevention layer
It consists of an antioxidant layer The adhesive layer of the inner conductor and the adhesive layer of the outer conductor are the same
Made of a material, the adhesive layers are connected to each other, The adhesive layer, the conductor layer, the solder crack preventing layer,
The oxidation prevention layer is a dry plating layer, An electronic component, characterized in that: 3. An adhesive layer film and a conductor layer film are sequentially formed on a surface of an insulating substrate by a dry plating method, and a part of the adhesive layer film and the conductor layer film is subjected to an etching treatment to form an adhesive layer and a conductor layer film. A step of forming a desired internal conductor constituted by a conductor layer provided on the surface of the adhesive layer; and an adhesive layer and at least an end portion of the insulating substrate, each comprising a dry plating layer. Forming a desired external conductor composed of a solder crack preventing layer provided on the surface of the substrate and an oxidation preventing layer provided on the surface of the solder crack preventing layer, and an adhesive layer for the internal conductor. And the adhesive layer of the outer conductor are the same
The adhesive layers are connected to each other, and
The inner conductor, the insulating substrate, and the outer
A method for manufacturing an electronic component, wherein the partial conductors are bonded . 4. After masking an unnecessary portion of the surface of the insulating substrate for forming an external conductor, an adhesive layer, a solder crack preventing layer, and an oxidation preventing layer are sequentially formed by a dry plating method. the desired outer conductor is constituted by provided the solder leach prevention layer provided on the surface of the adhesive layer on the surface of the solder leach prevention layer antioxidant layer is formed, the inner conductor
The adhesive layer of the external conductor and the adhesive layer of the external conductor are made of the same material.
The adhesive layers are connected to each other, and
The inner conductor, the insulating substrate and the outer conductor
The method for manufacturing an electronic component according to claim 3, wherein the electronic component is worn . 5. An adhesive layer film, a solder crack preventing layer film and an oxidation preventing layer film are sequentially formed on a surface of an insulating substrate by a dry plating method, and then the adhesive layer film, the solder crack preventing layer film and A part of the antioxidant layer film is etched to form an adhesive layer, a solder crack preventing layer provided on the surface of the adhesive layer, and an antioxidant layer provided on the surface of the solder crack preventing layer. To form a desired outer conductor,
The adhesive layer and the adhesive layer of the outer conductor are made of the same material,
The adhesive layers are connected to each other, and
The inner conductor, the insulating substrate and the outer conductor are adhered to each other.
The method for manufacturing an electronic component according to claim 3, wherein