|
JP2725952B2
(ja)
*
|
1992-06-30 |
1998-03-11 |
三菱電機株式会社 |
半導体パワーモジュール
|
|
US5347160A
(en)
*
|
1992-09-28 |
1994-09-13 |
Sundstrand Corporation |
Power semiconductor integrated circuit package
|
|
EP0884781A3
(fr)
|
1997-06-12 |
1999-06-30 |
Hitachi, Ltd. |
Module semi-conducteur de puissance
|
|
US6078501A
(en)
|
1997-12-22 |
2000-06-20 |
Omnirel Llc |
Power semiconductor module
|
|
US6774465B2
(en)
|
2001-10-05 |
2004-08-10 |
Fairchild Korea Semiconductor, Ltd. |
Semiconductor power package module
|
|
JP5041798B2
(ja)
|
2006-12-15 |
2012-10-03 |
三菱電機株式会社 |
半導体装置
|
|
CA2745720A1
(fr)
*
|
2008-09-18 |
2010-03-25 |
Paul Fathauer |
Ensemble circuit imprime pour module d'electroaimant de transmission automatique
|
|
USD699693S1
(en)
*
|
2012-10-03 |
2014-02-18 |
Fuji Electric Co., Ltd. |
Semiconductor device
|
|
US9295184B2
(en)
*
|
2012-12-14 |
2016-03-22 |
GM Global Technology Operations LLC |
Scalable and modular approach for power electronic building block design in automotive applications
|
|
USD754084S1
(en)
|
2013-08-21 |
2016-04-19 |
Mitsubishi Electric Corporation |
Semiconductor device
|
|
USD762597S1
(en)
|
2014-08-07 |
2016-08-02 |
Infineon Technologies Ag |
Power semiconductor module
|
|
USD775593S1
(en)
|
2014-08-19 |
2017-01-03 |
Infineon Technologies Ag |
Power semiconductor module
|
|
JP1536359S
(fr)
|
2014-08-19 |
2015-10-26 |
|
|
|
JP1536360S
(fr)
|
2014-08-19 |
2015-10-26 |
|
|
|
USD762185S1
(en)
|
2014-08-21 |
2016-07-26 |
Infineon Technologies Ag |
Power semiconductor module
|
|
USD774479S1
(en)
|
2014-11-28 |
2016-12-20 |
Fuji Electric Co., Ltd. |
Semiconductor module
|
|
USD772184S1
(en)
|
2014-12-24 |
2016-11-22 |
Fuji Electric Co., Ltd. |
Semiconductor module
|
|
JP6382097B2
(ja)
|
2014-12-24 |
2018-08-29 |
株式会社 日立パワーデバイス |
半導体パワーモジュールおよびそれを用いた電力変換装置
|
|
USD748595S1
(en)
|
2015-02-03 |
2016-02-02 |
Infineon Technologies Ag |
Power semiconductor module
|
|
USD766851S1
(en)
|
2015-02-04 |
2016-09-20 |
Mitsubishi Electric Corporation |
Semiconductor device
|
|
US10680518B2
(en)
*
|
2015-03-16 |
2020-06-09 |
Cree, Inc. |
High speed, efficient SiC power module
|
|
JP6362560B2
(ja)
|
2015-03-24 |
2018-07-25 |
三菱電機株式会社 |
半導体モジュール、電力変換装置および半導体モジュールの製造方法
|
|
JP6300751B2
(ja)
|
2015-03-25 |
2018-03-28 |
三菱電機株式会社 |
半導体装置
|
|
US9979105B2
(en)
|
2015-05-15 |
2018-05-22 |
Mitsubishi Electric Corporation |
Power semiconductor device
|
|
JP6511979B2
(ja)
*
|
2015-06-18 |
2019-05-15 |
富士電機株式会社 |
半導体装置及び半導体装置の製造方法
|
|
JP1551317S
(fr)
|
2015-09-30 |
2016-06-13 |
|
|
|
JP1551316S
(fr)
|
2015-09-30 |
2016-06-13 |
|
|
|
JP6682824B2
(ja)
|
2015-11-25 |
2020-04-15 |
富士電機株式会社 |
半導体装置
|
|
USD799439S1
(en)
|
2016-05-31 |
2017-10-10 |
Rohm Co., Ltd. |
Power converting semiconductor module
|
|
JP1585830S
(fr)
|
2017-01-05 |
2017-09-11 |
|
|
|
JP1585831S
(fr)
|
2017-01-05 |
2017-09-11 |
|
|
|
JP1605558S
(fr)
|
2017-01-05 |
2018-06-04 |
|
|
|
USD864132S1
(en)
*
|
2017-01-05 |
2019-10-22 |
Rohm Co., Ltd. |
Power semiconductor module
|
|
JP1585962S
(fr)
|
2017-01-05 |
2017-09-11 |
|
|
|
USD887998S1
(en)
*
|
2017-02-17 |
2020-06-23 |
Stat Peel Ag |
Chip
|
|
JP1603980S
(fr)
|
2017-09-07 |
2018-05-14 |
|
|
|
JP1603793S
(fr)
|
2017-09-29 |
2018-05-14 |
|
|
|
USD883241S1
(en)
|
2018-06-04 |
2020-05-05 |
Semikron Elektronik Gmbh & Co. Kg |
Power module
|
|
TWD203975S
(zh)
*
|
2018-10-17 |
2020-04-11 |
大陸商歐品電子（昆山）有限公司 |
電路板（一）
|
|
TWD202850S
(zh)
*
|
2018-10-17 |
2020-02-21 |
大陸商歐品電子（昆山）有限公司 |
電路板（二）
|
|
JP1642346S
(fr)
*
|
2019-03-20 |
2019-09-30 |
|
|
|
JP1644633S
(fr)
|
2019-03-26 |
2019-11-05 |
|
|
|
USD903611S1
(en)
|
2019-03-29 |
2020-12-01 |
Mitsubishi Electric Corporation |
Semiconductor device
|
|
USD909319S1
(en)
*
|
2020-07-08 |
2021-02-02 |
Impact Ip, Llc |
Circuit board
|