JP1604002S - - Google Patents

Info

Publication number
JP1604002S
JP1604002S JPD2017-21144F JP2017021144F JP1604002S JP 1604002 S JP1604002 S JP 1604002S JP 2017021144 F JP2017021144 F JP 2017021144F JP 1604002 S JP1604002 S JP 1604002S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-21144F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-21144F priority Critical patent/JP1604002S/ja
Priority to US29/641,840 priority patent/USD864883S1/en
Priority to TW107301729D01F priority patent/TWD195624S/zh
Application granted granted Critical
Publication of JP1604002S publication Critical patent/JP1604002S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-21144F 2017-09-27 2017-09-27 Active JP1604002S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2017-21144F JP1604002S (enExample) 2017-09-27 2017-09-27
US29/641,840 USD864883S1 (en) 2017-09-27 2018-03-26 Part for semiconductor device
TW107301729D01F TWD195624S (zh) 2017-09-27 2018-03-27 半導體元件用構件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-21144F JP1604002S (enExample) 2017-09-27 2017-09-27

Publications (1)

Publication Number Publication Date
JP1604002S true JP1604002S (enExample) 2018-05-14

Family

ID=62104990

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-21144F Active JP1604002S (enExample) 2017-09-27 2017-09-27

Country Status (3)

Country Link
US (1) USD864883S1 (enExample)
JP (1) JP1604002S (enExample)
TW (1) TWD195624S (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1664282S (enExample) * 2019-07-24 2020-07-27
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD432095S (en) * 1998-10-09 2000-10-17 Vishay Semiconductor Gmbh Light-emitting semi-conductor component
TW452191U (en) 1999-05-06 2001-08-21 Advanced Semiconductor Eng Semiconductor adhesive-film adhering platen with a positioning structure
TW404562U (en) 1999-05-06 2000-09-01 Advanced Semiconductor Eng Semiconductor glue film application platform with positioning structure
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
TW443580U (en) 1999-11-25 2001-06-23 Chipmos Technologies Inc Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW491359U (en) 1999-11-25 2002-06-11 Chipmos Technologies Inc Connection distribution structure for etching pad mesh set of wafer
TW446183U (en) 1999-11-25 2001-07-11 Chipmos Technologies Inc Wafer surface structure
TW510503U (en) 1999-11-25 2002-11-11 Chipmos Technolgies Inc Distributing structure of wafer's testing pad and burning pad
TW461582U (en) 2000-11-07 2001-10-21 Chipmos Technologies Inc Laser repair and real-time detection device
TW529771U (en) 2001-11-28 2003-04-21 Advanced Semiconductor Eng Flip chip semiconductor device with solder balls
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
TW556957U (en) 2002-08-13 2003-10-01 Advanced Semiconductor Eng Semiconductor wafer and semiconductor device
TWM293525U (en) 2004-06-29 2006-07-01 Sino American Silicon Products Silicon wafer structure for power electronic device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
TWM352128U (en) 2008-10-08 2009-03-01 Int Semiconductor Tech Ltd Semiconductor structure having silver bump
TWM379066U (en) 2009-12-18 2010-04-21 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe card
TWM386593U (en) 2010-03-29 2010-08-11 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
TWM478909U (zh) 2012-11-20 2014-05-21 Kun-Chieh Chang 發光二極體晶片之複合陣列微透鏡
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
TWM482158U (zh) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd 黏著半導體晶片之裝置
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
JP1536360S (enExample) * 2014-08-19 2015-10-26
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
JP1582228S (enExample) * 2016-08-02 2017-07-24

Also Published As

Publication number Publication date
TWD195624S (zh) 2019-01-21
USD864883S1 (en) 2019-10-29

Similar Documents

Publication Publication Date Title
BR122021000189A2 (enExample)
BR112019008823A2 (enExample)
JP1603911S (enExample)
BR112019025875B1 (pt) Sistema de cilindro com estrutura de ocupação de movimento relativo
BR112020011860B1 (pt) Dispositivo cirúrgico para cortar uma lente dentro de um saco capsular de um olho
BR112020006283B1 (pt) Placa refinadora, e, refinador para tratamento mecânico de material orgânico/celulósico
BR112020008714B1 (pt) Uso de medicamentos serotoninérgicos para tratar trombocitopenia induzida por vírus
BR112020006992B1 (pt) Dispositivo de recolhimento e método para o recolhimento de uma embarcação
BR112019023976B1 (pt) Sistema e método para comunicar dados de saúde em um ambiente de cuidados de saúde
BR112020003314B1 (pt) Sistema terapêutico transdérmico para administração transdérmica de um agente ativo, seu método de fabricação, usos de emulsificante, e método para estabilizar uma mistura de revestimento bifásica
BR112020003112B1 (pt) Método de garantir a viabilidade de uma máquina para uma tarefa agendada
BR112020002577B1 (pt) Método de melhoria de rendimento de centrifugação dupla para purificação de óleo nutritivo
BR112019016885B1 (pt) Remodelagem de imagem integrada e codificação de vídeo
BR112019027876B1 (pt) Método de codificação para uma comunicação sem fio, codificador, método de decodificação, decodificador, aparelho de comunicação, meio de armazenagem legível por computador, e sistema de comunicações
BR112020001354B1 (pt) Método, em uma primeira estação base, para suportar posicionamento de um dispositivo móvel e primeira estação base para suportar posicionamento de um dispositivo móvel
BR112019026818B1 (pt) Método de codificação, método de decodificação, aparelho, aparelho de comunicações, terminal, estação base e mídia legível por computador
BR102018011961B1 (pt) Sistemas, métodos e meio não transitório legível por computador para analisar cores a partir de uma plataforma de mídia social
BR112019023944B1 (pt) Combinação farmacêutica para o tratamento de um câncer
BR112019021396B1 (pt) Processo para fabricação de pululano
BR102018003507B1 (pt) Sistema de isolamento de tensão de tambor de guincho
BR112019016182B1 (pt) Método para diagnosticar risco de revisão relacionado a implante
BR112019014127B1 (pt) Composição farmacêutica para tratamento de tumores
BR112019017156B1 (pt) Dispositivo, sistema e método de gerenciamento de recepção de pedido, e, meio de armazenamento legível por computador
BR102017026429B1 (pt) Método de extração subsequente de ácidos graxos e dna genômico a partir de dípteros
BR112020006250B1 (pt) Primeira estação base e método de controle de estado em uma primeira estação base