JP1564934S - - Google Patents
Info
- Publication number
- JP1564934S JP1564934S JPD2016-4151F JP2016004151F JP1564934S JP 1564934 S JP1564934 S JP 1564934S JP 2016004151 F JP2016004151 F JP 2016004151F JP 1564934 S JP1564934 S JP 1564934S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-4151F JP1564934S (en:Method) | 2016-02-26 | 2016-02-26 | |
| TW104305548D01F TWD180288S (zh) | 2016-02-26 | 2016-04-29 | 電漿處理裝置用上腔室 |
| US29/572,169 USD812578S1 (en) | 2016-02-26 | 2016-07-26 | Upper chamber for a plasma processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-4151F JP1564934S (en:Method) | 2016-02-26 | 2016-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1564934S true JP1564934S (en:Method) | 2016-12-05 |
Family
ID=57406451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2016-4151F Active JP1564934S (en:Method) | 2016-02-26 | 2016-02-26 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD812578S1 (en:Method) |
| JP (1) | JP1564934S (en:Method) |
| TW (1) | TWD180288S (en:Method) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD826300S1 (en) * | 2016-09-30 | 2018-08-21 | Oerlikon Metco Ag, Wohlen | Rotably mounted thermal plasma burner for thermalspraying |
| JP1611626S (en:Method) * | 2017-01-20 | 2018-08-20 | ||
| USD875054S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD818447S1 (en) * | 2017-04-28 | 2018-05-22 | Applied Materials, Inc. | Plasma feedthrough flange |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD875055S1 (en) | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| JP1638504S (en:Method) * | 2018-12-06 | 2019-08-05 | ||
| JP1646366S (en:Method) * | 2019-03-19 | 2019-11-25 | ||
| US12100577B2 (en) | 2019-08-28 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| JP1724328S (ja) * | 2022-02-10 | 2022-09-08 | プラズマ処理装置用アッパーチャンバ | |
| USD1055006S1 (en) | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
| USD1042373S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| USD1042374S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
| USD1066440S1 (en) * | 2022-10-28 | 2025-03-11 | Applied Materials, Inc. | Process chamber pumping liner |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4153907A (en) * | 1977-05-17 | 1979-05-08 | Vactec, Incorporated | Photovoltaic cell with junction-free essentially-linear connections to its contacts |
| USD274836S (en) * | 1982-12-02 | 1984-07-24 | Smith Edward J | Space heater assembly |
| US5641375A (en) * | 1994-08-15 | 1997-06-24 | Applied Materials, Inc. | Plasma etching reactor with surface protection means against erosion of walls |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| US6623609B2 (en) * | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| USD448729S1 (en) * | 1999-12-14 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Stator of AC generator for vehicles |
| JP4470274B2 (ja) * | 2000-04-26 | 2010-06-02 | 東京エレクトロン株式会社 | 熱処理装置 |
| US20040069223A1 (en) * | 2002-10-10 | 2004-04-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wall liner and slot liner for process chamber |
| USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| US9677188B2 (en) * | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
| TWI502617B (zh) * | 2010-07-21 | 2015-10-01 | 應用材料股份有限公司 | 用於調整電偏斜的方法、電漿處理裝置與襯管組件 |
| WO2013148890A1 (en) * | 2012-03-28 | 2013-10-03 | Novellus Systems, Inc. | Methods and apparatuses for cleaning electroplating substrate holders |
| USD716240S1 (en) * | 2013-11-07 | 2014-10-28 | Applied Materials, Inc. | Lower chamber liner |
| US10049862B2 (en) * | 2015-04-17 | 2018-08-14 | Lam Research Corporation | Chamber with vertical support stem for symmetric conductance and RF delivery |
-
2016
- 2016-02-26 JP JPD2016-4151F patent/JP1564934S/ja active Active
- 2016-04-29 TW TW104305548D01F patent/TWD180288S/zh unknown
- 2016-07-26 US US29/572,169 patent/USD812578S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWD180288S (zh) | 2016-12-21 |
| USD812578S1 (en) | 2018-03-13 |