JP1551209S - - Google Patents

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Publication number
JP1551209S
JP1551209S JPD2015-17097F JP2015017097F JP1551209S JP 1551209 S JP1551209 S JP 1551209S JP 2015017097 F JP2015017097 F JP 2015017097F JP 1551209 S JP1551209 S JP 1551209S
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JP
Japan
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JPD2015-17097F
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JPD2015-17097F 2015-02-03 2015-07-31 Active JP1551209S (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/516,524 USD797172S1 (en) 2015-02-03 2015-02-03 Ceramic bonding tool with textured tip

Publications (1)

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JP1551209S true JP1551209S (ja) 2016-06-06

Family

ID=56090593

Family Applications (2)

Application Number Title Priority Date Filing Date
JPD2015-17097F Active JP1551209S (ja) 2015-02-03 2015-07-31
JPD2016-8039F Active JP1551215S (ja) 2015-02-03 2015-07-31

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Application Number Title Priority Date Filing Date
JPD2016-8039F Active JP1551215S (ja) 2015-02-03 2015-07-31

Country Status (3)

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US (2) USD797172S1 (ja)
JP (2) JP1551209S (ja)
TW (2) TWD178578S (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD855089S1 (en) * 2016-02-29 2019-07-30 Moldman Systems Llc Mixer assembly
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip
USD859109S1 (en) * 2019-03-11 2019-09-10 Pro-Iroda Industries, Inc. Soldering bit

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) * 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
DE1439262B2 (de) * 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3453142A (en) * 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
BE757977A (fr) * 1969-11-24 1971-04-01 Stoody Co Procede et electrode de soudage a l'arc pour acier inoxydable
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) * 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
US4343983A (en) * 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) * 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) * 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4405074A (en) * 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) * 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
USD297704S (en) 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
JPH0445241Y2 (ja) 1986-05-26 1992-10-23
JPS6380845U (ja) 1986-11-14 1988-05-27
USD305720S (en) 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
DE8910049U1 (de) 1989-08-22 1989-11-23 Cooper Industries, Inc., Houston, Tex. Lötwerkzeug
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5816472A (en) * 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
JP3440190B2 (ja) 1997-03-06 2003-08-25 株式会社新川 ワイヤボンディング方法
USD431434S (en) 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
JPH11354569A (ja) 1998-06-05 1999-12-24 Hitachi Ltd ワイヤボンディング方法および装置ならびに半導体装置の製造方法
IT1305646B1 (it) 1998-08-07 2001-05-15 St Microelectronics Srl Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
JP2000202622A (ja) * 1999-01-18 2000-07-25 Hakko Kk 電気ハンダゴテ
JP4010432B2 (ja) 1999-01-29 2007-11-21 ローム株式会社 電子部品におけるワイヤボンディング方法及びその装置
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
US6213898B1 (en) * 1999-09-16 2001-04-10 Callaway Golf Company Golf ball with an aerodynamic surface on a polyurethane cover
JP3474513B2 (ja) * 2000-03-09 2003-12-08 沖電気工業株式会社 キャピラリ
AU144116S (en) 2000-05-23 2001-06-01 Pentel Kk A correction pen
JP2002064117A (ja) 2000-08-22 2002-02-28 Mitsubishi Electric Corp ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
US6715658B2 (en) * 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
JP3566678B2 (ja) 2001-08-28 2004-09-15 京セラ株式会社 ワイヤーボンディング用キャピラリー
JP2004087822A (ja) 2002-08-27 2004-03-18 Mitsubishi Materials Corp ウェッジツール
JP3765778B2 (ja) 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
AU2003295874A1 (en) 2002-11-22 2004-06-18 Saint-Gobain Ceramics And Plastics, Inc. Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
US20040109980A1 (en) * 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7249702B2 (en) * 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
WO2006116288A2 (en) * 2005-04-22 2006-11-02 Regents Of The University Of Michigan Rotatable multi-pin apparatus, and process for friction driven stitch welding and structural modification of materials
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP4989437B2 (ja) 2007-12-14 2012-08-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (ja) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp ワイヤーボンディング用キャピラリーおよび電子部品組立装置
JP4595018B2 (ja) 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
WO2012021349A2 (en) * 2010-08-10 2012-02-16 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related process
CN102373428A (zh) * 2010-08-19 2012-03-14 鸿富锦精密工业（深圳）有限公司 涂层、具有该涂层的被覆件及该被覆件的制备方法
JP5734236B2 (ja) * 2011-05-17 2015-06-17 株式会社新川 ワイヤボンディング装置及びボンディング方法
JP5899907B2 (ja) 2011-12-26 2016-04-06 富士電機株式会社 ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法
CN104684709A (zh) * 2012-06-26 2015-06-03 卡勒克密封技术有限责任公司 垫圈材料,垫圈,以及相关方法
JP5510691B2 (ja) 2012-09-26 2014-06-04 Ｔｏｔｏ株式会社 ボンディングキャピラリ
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TWI511826B (zh) 2013-01-25 2015-12-11 Toto Ltd Welding needle
JP5376413B1 (ja) 2013-01-25 2013-12-25 Ｔｏｔｏ株式会社 ボンディングキャピラリ
JP2014222729A (ja) 2013-05-14 2014-11-27 住友電気工業株式会社 半導体装置の製造方法及び半導体装置の製造装置
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD735787S1 (en) * 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD744560S1 (en) * 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool

Also Published As

Publication number Publication date
TWD178578S (zh) 2016-10-01
JP1551215S (ja) 2016-06-06
TWD177552S (zh) 2016-08-11
USD821468S1 (en) 2018-06-26
USD797172S1 (en) 2017-09-12

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