|
US3101634A
(en)
*
|
1960-09-12 |
1963-08-27 |
Gulton Ind Inc |
Sonic welder
|
|
US3690538A
(en)
|
1970-02-25 |
1972-09-12 |
Gaiser Tool Co |
Bonding tool
|
|
US4030657A
(en)
|
1972-12-26 |
1977-06-21 |
Rca Corporation |
Wire lead bonding tool
|
|
USD255318S
(en)
*
|
1977-11-22 |
1980-06-10 |
Bakkeren Hans A |
Ultrasonic welding head for polypropylene strapping
|
|
USD271741S
(en)
|
1981-02-02 |
1983-12-13 |
Eldon Industries, Inc. |
Soldering iron tip
|
|
US4415115A
(en)
|
1981-06-08 |
1983-11-15 |
Motorola, Inc. |
Bonding means and method
|
|
US4600138A
(en)
|
1984-07-25 |
1986-07-15 |
Hughes Aircraft Company |
Bonding tool and clamp assembly and wire handling method
|
|
USD297704S
(en)
*
|
1985-03-11 |
1988-09-20 |
Carol Bulow |
Miniature welding torch with disposable tip
|
|
JPH0445241Y2
(ja)
|
1986-05-26 |
1992-10-23 |
|
|
|
JPS6380845U
(ja)
|
1986-11-14 |
1988-05-27 |
|
|
|
USD305720S
(en)
*
|
1987-02-09 |
1990-01-30 |
Olgesby & Butler Plc |
Soldering iron with removable cap
|
|
US5217154A
(en)
|
1989-06-13 |
1993-06-08 |
Small Precision Tools, Inc. |
Semiconductor bonding tool
|
|
DE8910049U1
(de)
|
1989-08-22 |
1989-11-23 |
Cooper Industries, Inc., Houston, Tex. |
Lötwerkzeug
|
|
US5485949A
(en)
|
1993-04-30 |
1996-01-23 |
Matsushita Electric Industrial Co., Ltd. |
Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
|
|
US5445306A
(en)
|
1994-05-31 |
1995-08-29 |
Motorola, Inc. |
Wedge wire bonding tool tip
|
|
US5683603A
(en)
|
1995-04-19 |
1997-11-04 |
Fortune; William S. |
Electric soldering iron tip improvements
|
|
US6068174A
(en)
|
1996-12-13 |
2000-05-30 |
Micro)N Technology, Inc. |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
|
|
US5954260A
(en)
|
1996-12-17 |
1999-09-21 |
Texas Instruments Incorporated |
Fine pitch bonding technique
|
|
JP3440190B2
(ja)
|
1997-03-06 |
2003-08-25 |
株式会社新川 |
ワイヤボンディング方法
|
|
USD431434S
(en)
*
|
1998-01-08 |
2000-10-03 |
Hakko Corporation |
Soldering iron tip
|
|
JPH11354569A
(ja)
|
1998-06-05 |
1999-12-24 |
Hitachi Ltd |
ワイヤボンディング方法および装置ならびに半導体装置の製造方法
|
|
IT1305646B1
(it)
|
1998-08-07 |
2001-05-15 |
St Microelectronics Srl |
Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'
|
|
US6158647A
(en)
|
1998-09-29 |
2000-12-12 |
Micron Technology, Inc. |
Concave face wire bond capillary
|
|
JP4010432B2
(ja)
|
1999-01-29 |
2007-11-21 |
ローム株式会社 |
電子部品におけるワイヤボンディング方法及びその装置
|
|
US6646228B2
(en)
|
1999-08-18 |
2003-11-11 |
Hyperion Innovations, Inc. |
Cordless soldering iron
|
|
AU144116S
(en)
*
|
2000-05-23 |
2001-06-01 |
Pentel Kk |
A correction pen
|
|
JP2002064117A
(ja)
|
2000-08-22 |
2002-02-28 |
Mitsubishi Electric Corp |
ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
|
|
US6729527B2
(en)
*
|
2001-01-30 |
2004-05-04 |
Kulicke & Soffa Investments, Inc. |
Bonding tool with polymer coating
|
|
JP3566678B2
(ja)
|
2001-08-28 |
2004-09-15 |
京セラ株式会社 |
ワイヤーボンディング用キャピラリー
|
|
JP2004087822A
(ja)
|
2002-08-27 |
2004-03-18 |
Mitsubishi Materials Corp |
ウェッジツール
|
|
JP3765778B2
(ja)
|
2002-08-29 |
2006-04-12 |
ローム株式会社 |
ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
|
|
AU2003295874A1
(en)
|
2002-11-22 |
2004-06-18 |
Saint-Gobain Ceramics And Plastics, Inc. |
Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
|
|
US7249702B2
(en)
|
2003-12-04 |
2007-07-31 |
Kulicke And Soffa Industries, Inc. |
Multi-part capillary
|
|
USD517384S1
(en)
*
|
2004-01-22 |
2006-03-21 |
Pentel Kabushiki Kaisha |
Wire solder applicator
|
|
US7407080B2
(en)
|
2004-04-02 |
2008-08-05 |
Chippac, Inc. |
Wire bond capillary tip
|
|
USD549255S1
(en)
|
2004-11-08 |
2007-08-21 |
Dragos Axinte |
Soldering iron tip
|
|
US7216794B2
(en)
|
2005-06-09 |
2007-05-15 |
Texas Instruments Incorporated |
Bond capillary design for ribbon wire bonding
|
|
US8056794B2
(en)
|
2006-10-09 |
2011-11-15 |
Kulicke And Soffa Industries, Inc. |
Combination wedge bonding and ball bonding transducer
|
|
JP4989437B2
(ja)
|
2007-12-14 |
2012-08-01 |
ルネサスエレクトロニクス株式会社 |
半導体装置の製造方法
|
|
USD598721S1
(en)
|
2008-04-24 |
2009-08-25 |
Luis Meza |
Motorcycle maintenance tool
|
|
JP2009283814A
(ja)
|
2008-05-26 |
2009-12-03 |
Toshiba Lighting & Technology Corp |
ワイヤーボンディング用キャピラリーおよび電子部品組立装置
|
|
JP4595018B2
(ja)
|
2009-02-23 |
2010-12-08 |
株式会社新川 |
半導体装置の製造方法およびボンディング装置
|
|
USD667857S1
(en)
*
|
2009-06-04 |
2012-09-25 |
Smk Co., Ltd. |
Electrode tip for resistive welders
|
|
US7918378B1
(en)
|
2010-08-06 |
2011-04-05 |
National Semiconductor Corporation |
Wire bonding deflector for a wire bonder
|
|
JP5899907B2
(ja)
|
2011-12-26 |
2016-04-06 |
富士電機株式会社 |
ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法
|
|
JP5510691B2
(ja)
|
2012-09-26 |
2014-06-04 |
Ｔｏｔｏ株式会社 |
ボンディングキャピラリ
|
|
USD697956S1
(en)
*
|
2013-01-24 |
2014-01-21 |
Tesa Tape Inc. |
Ultrasonic welding sheath
|
|
TWI511826B
(zh)
|
2013-01-25 |
2015-12-11 |
Toto Ltd |
Welding needle
|
|
JP5376413B1
(ja)
|
2013-01-25 |
2013-12-25 |
Ｔｏｔｏ株式会社 |
ボンディングキャピラリ
|
|
JP2014222729A
(ja)
|
2013-05-14 |
2014-11-27 |
住友電気工業株式会社 |
半導体装置の製造方法及び半導体装置の製造装置
|
|
USD720785S1
(en)
*
|
2013-10-30 |
2015-01-06 |
Sei Optifrontier Co., Ltd. |
Electrode bar for optical fiber fusion splicer
|
|
USD741127S1
(en)
*
|
2013-11-14 |
2015-10-20 |
Robert Bosch Gmbh |
Glue applicator
|
|
USD753739S1
(en)
*
|
2015-04-17 |
2016-04-12 |
Coorstek, Inc. |
Wire bonding wedge tool
|