JP1548555S - - Google Patents

Info

Publication number
JP1548555S
JP1548555S JPD2015-27272F JP2015027272F JP1548555S JP 1548555 S JP1548555 S JP 1548555S JP 2015027272 F JP2015027272 F JP 2015027272F JP 1548555 S JP1548555 S JP 1548555S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-27272F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-27272F priority Critical patent/JP1548555S/ja
Priority to US29/566,037 priority patent/USD798829S1/en
Priority to TW105303084D01F priority patent/TWD181167S/zh
Priority to CA168805F priority patent/CA168805S/en
Application granted granted Critical
Publication of JP1548555S publication Critical patent/JP1548555S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-27272F 2015-12-04 2015-12-04 Active JP1548555S (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JPD2015-27272F JP1548555S (fr) 2015-12-04 2015-12-04
US29/566,037 USD798829S1 (en) 2015-12-04 2016-05-26 Cooling device for an electronic component heat sink
TW105303084D01F TWD181167S (zh) 2015-12-04 2016-05-31 電子零件散熱器用冷卻裝置
CA168805F CA168805S (en) 2015-12-04 2016-06-02 Heat-exchanger for electronic component heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-27272F JP1548555S (fr) 2015-12-04 2015-12-04

Publications (1)

Publication Number Publication Date
JP1548555S true JP1548555S (fr) 2016-10-17

Family

ID=55762037

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-27272F Active JP1548555S (fr) 2015-12-04 2015-12-04

Country Status (3)

Country Link
US (1) USD798829S1 (fr)
JP (1) JP1548555S (fr)
TW (1) TWD181167S (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1653095S (fr) * 2018-11-26 2020-02-17
JP1653096S (fr) * 2018-11-26 2020-02-17
JP1653094S (fr) * 2018-11-26 2020-02-17

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
CN2594989Y (zh) * 2001-11-29 2003-12-24 王清风 可提高热交换效率的热交换鳍片板
TWI267337B (en) * 2003-05-14 2006-11-21 Inventor Prec Co Ltd Heat sink
US7306028B2 (en) * 2005-06-23 2007-12-11 Thermal Corp. Modular heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
USD567343S1 (en) * 2006-09-08 2008-04-22 Spx Cooling Technologies, Inc. Film fill pack
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
USD586763S1 (en) * 2007-08-23 2009-02-17 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
CN101839654B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热器
US20130020060A1 (en) * 2010-09-02 2013-01-24 Cooper-Standard Automotive, Inc. Heat exchanger
WO2012040281A2 (fr) * 2010-09-21 2012-03-29 Carrier Corporation Échangeur de chaleur à microcanaux incluant des circuits d'échange de chaleur indépendants et procédé associé
USD676118S1 (en) * 2011-06-24 2013-02-12 Hiform As Heat exchanger panel
EP2704190A1 (fr) * 2012-09-03 2014-03-05 ABB Technology AG Système de refroidissement modulaire
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
EP2988578B1 (fr) * 2014-08-19 2021-05-19 ABB Schweiz AG Élément de refroidissement
CN105636407A (zh) * 2014-11-27 2016-06-01 英业达科技有限公司 散热鳍片组
FR3030708B1 (fr) * 2014-12-22 2018-02-16 Airbus Operations Sas Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur
TWI650522B (zh) * 2015-05-21 2019-02-11 萬在工業股份有限公司 冷媒式散熱裝置
TWM512730U (zh) * 2015-08-20 2015-11-21 Cooler Master Co Ltd 水冷式散熱裝置

Also Published As

Publication number Publication date
USD798829S1 (en) 2017-10-03
TWD181167S (zh) 2017-02-01

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