TWI650522B - 冷媒式散熱裝置 - Google Patents

冷媒式散熱裝置 Download PDF

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TWI650522B
TWI650522B TW104116203A TW104116203A TWI650522B TW I650522 B TWI650522 B TW I650522B TW 104116203 A TW104116203 A TW 104116203A TW 104116203 A TW104116203 A TW 104116203A TW I650522 B TWI650522 B TW I650522B
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refrigerant
evaporator
condenser
tube
heat
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TW104116203A
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TW201641910A (zh
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萬正乾
萬正豐
林浩暉
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萬在工業股份有限公司
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Priority to TW104116203A priority Critical patent/TWI650522B/zh
Priority to US15/157,918 priority patent/US9797659B2/en
Priority to CN201620466284.8U priority patent/CN205793890U/zh
Publication of TW201641910A publication Critical patent/TW201641910A/zh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05366Assemblies of conduits connected to common headers, e.g. core type radiators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一種冷媒式散熱裝置,係包含一蒸發器、一冷凝器、一第一冷媒管、二第二冷媒管及冷媒,口徑較大的第一冷媒管連接蒸發器頂部與冷凝器一側冷凝基管上段,該二口徑較小的第二冷媒管係自蒸發器兩側低於第一冷媒管之位置分別延伸連接冷凝器兩側的冷凝基管下段,構成一多流向的密閉冷媒循環迴路。使蒸發器中吸熱轉化為氣態的冷媒集中向上通過第一冷媒管流向冷凝器散熱,進入冷凝器一側的冷凝基管的氣態冷媒的一部分先冷凝為液態冷媒,且沿著在下的第二冷媒管先回流蒸發器中回補冷媒,其餘氣態冷媒則流向另一側冷凝基管冷凝為液態冷媒,再沿另一第二冷媒管回流至蒸發器中,藉此多流向的冷媒相變循環流動方式以及液、氣態冷媒確實分流之機制,達到高效能的散熱效果。

Description

冷媒式散熱裝置
本創作係關於一種散熱裝置,尤指一種冷媒式散熱裝置。
為避免電子裝置等物品因工作時產生高溫而不正常運作或損壞,在電子裝置之主要發熱源處皆會裝設散熱裝置,藉以利用散熱裝置快速將發熱源產生的熱予以散發,達到冷卻降溫之目的。
目前應用於電子裝置中提供散熱功用的冷媒式散熱裝置組成構造,其主要係於一蒸發器與一冷凝器之間以複數冷媒管串接組成一密閉的冷媒循環迴路,並藉由充填於該密閉的冷媒循環迴路的冷媒於蒸發器中吸熱,位於蒸發器中之冷媒吸熱轉化為氣態,氣態的冷媒通過冷媒管快速流向冷凝器,通過冷凝器散熱後,使冷媒降溫而轉化為液態,液態的冷媒再回流至蒸發器中重新再吸熱,藉由冷媒的液氣相變及循環流動的散熱機制為電子裝置之發熱源提供冷卻功能。
前揭冷媒式散熱裝置中,其主要係利用複數冷媒管連接於蒸發器與冷凝器之間提供冷媒循環流動的路徑。現有冷媒式散熱裝置還進一步利用蒸發器連接二冷媒管之位置呈一上一下之設置方式,以期藉由氣態冷媒上升、液態冷媒下降之原理,利用在上的冷媒管導引氣態冷媒自蒸發器流向冷凝器,以及利用在下的冷媒管導引液態冷媒自冷凝器回流至蒸發器。
惟現有冷媒式散熱裝置中,連接於蒸發器上下兩側之冷媒管係採取相同口徑的管件,當蒸發器中吸熱後的氣態冷媒因氣體壓力大,氣態冷媒仍會分別朝上下側二冷媒管方向流動,難以控制冷媒依循一定方向循環流動。再者,現有的冷媒式散熱裝置使用的過程中,蒸發器中吸熱轉化為氣態的冷 媒,通過位置在上的冷媒管流向冷凝器後,冷媒必須自冷凝器中一側的冷凝基管通過散熱導管散熱後流向另一側冷凝基管,再通過另一位置在下的冷媒管回流至蒸發器,其冷媒循環路徑一定且距離長,以致氣態冷媒自蒸發器通過位置在上的冷媒管流向冷凝器後,部分氣態冷媒因先冷凝相變為液態冷媒,該些液態冷媒難以立即回流至蒸發器中重新吸熱,而須依循冷媒循環路徑回流至蒸發器,造成冷媒式散熱裝置之散熱效能難以提昇。
本創作之主要目的在於提供一種冷媒式散熱裝置,解決現有冷媒式散熱裝置難以控制控制冷媒朝向一定方向循環流動以及散熱效能不佳等問題。
為了達成前揭目的,本創作所提出之冷媒式散熱裝置係包含:一蒸發器,其包含一內有蒸發室的蒸發器本體,蒸發器本體底部具有一導熱底板,蒸發器本體頂部具有一氣態冷媒出口,蒸發器本體於低於氣態冷媒出口之水平方向的相異兩側側壁分別形成一液態冷媒入口,氣態冷媒出口與液態冷媒入口分別連通蒸發室,且液態冷媒入口的開口面積小於氣態冷媒出口的開口面積;一冷凝器,其具有二冷凝基管、複數散熱導管以及複數散熱件,該二冷凝基管直立設置且沿水平方向間隔排列,該二冷凝基管內部各具有一密閉的腔室,該複數散熱導管上下排列地連接於該二冷凝基管之間,所述複數散熱件係分布排列且導熱性接觸該複數散熱導管之外表面;一第一冷媒管,其兩端分別連接蒸發器的氣態冷媒出口與冷凝器一側的冷凝基管上段;二第二冷媒管,該二第二冷媒管之口徑小於第一冷媒管的口徑,該二第二冷媒管分別以其一端連接該蒸發器相異兩側側壁的液態冷媒入口,該二第二冷 媒管之另一端則分別連接該冷凝器兩側之冷凝基管下段,使蒸發器、冷凝器結合第一冷媒管與第二冷媒管構成一多流向的密閉冷媒循環迴路;以及冷媒,係裝填於該密閉的冷媒循環迴路中。
藉由前揭冷媒式散熱裝置創作,其主要係利用連接蒸發器之第一冷媒管與第二冷媒管為口徑大小不等,且令位置在上的第一冷媒管口徑大於位置在下的第二冷媒管口徑,藉由熱氣自然上升,以及流體朝向口徑大、壓力小的方向流動之白努利定理,使氣態冷媒能自蒸發器快速通過位置在上第一冷媒管流向冷凝器散熱。另一方面,本創作利用二第二冷媒管分別自蒸發器相異兩側側壁連接至冷凝器兩側之冷凝基管下段,形成一多流向的密閉冷媒循環迴路之構造,藉以在氣態冷媒自蒸發器通過位置在上的第一冷媒管流至冷凝器一側的冷凝基管時,部分冷凝相變為液態冷媒能沿著冷凝基管下降,並通過一位置在下的第二冷媒管先行回流至蒸發器之蒸發室中,回補冷媒再重新吸熱。進入冷凝基管中之其餘氣態冷媒則分散通過該複數散熱導管流向冷凝器另一側冷凝基管中而冷凝為液態冷媒,液態的冷媒再沿另一位置在下的第二冷媒管回流至蒸發器中重新再吸熱,藉此多流向的冷媒相變循環流動方式以及液、氣態冷媒確實分流之機制,使該冷媒式散熱裝置達到高效能的散熱效果。
1‧‧‧蒸發器
10‧‧‧蒸發器本體
100‧‧‧蒸發室
11‧‧‧導熱底板
12‧‧‧氣態冷媒出口
13‧‧‧液態冷媒入口
14‧‧‧液態冷媒入口
2‧‧‧冷凝器
20A、20B‧‧‧冷凝基管
21‧‧‧散熱導管
22‧‧‧散熱件
3‧‧‧第一冷媒管
4A、4B‧‧‧第二冷媒管
5‧‧‧冷媒
6‧‧‧發熱源
圖1係本創作冷媒式散熱裝置之一較佳實施例之立體示意圖。
圖2係圖1所示冷媒式散熱裝置較佳實施例中之蒸發器設置於發熱源上的局部剖面示意圖。
圖3係圖1所示冷媒式散熱裝置較佳實施例之使用狀態參考圖。
如圖1及圖2所示,係揭示本創作冷媒式散熱裝置之一較佳實施例,所述冷媒式散熱裝置係包含一蒸發器1、一冷凝器2、一第一冷媒管3、二第二冷媒管4A、4B以及適量的冷媒5。惟所述蒸發器1不以一個為限,蒸發器1的數量依據所需的散熱能力而增加,所述第一冷媒管3與第二冷媒管4A、4B的數量則依據蒸發器1的數量而改變,且所述第一冷媒管3與第二冷媒管4A、4B連接於所述蒸發器1與冷凝器2之間,構成一多流向的密閉冷媒循環迴路,所述冷媒能於該密閉冷媒循環迴路中流動。
如圖1及圖2所示,所述蒸發器1包含一蒸發器本體10,該蒸發器本體10係為導熱性材料所製成的部件,所述蒸發器本體10內部具有一蒸發室100,蒸發器本體10底部具有一導熱底板11,蒸發器本體10頂部具有一氣態冷媒出口12,蒸發器本體10於低於氣態冷媒出口12之水平方向的相異兩側側壁分別形成一液態冷媒入口13、14,氣態冷媒出口12與液態冷媒入口13、14分別連通蒸發室100,所述液態冷媒入口13、14的開口面積小於氣態冷媒出口12的開口面積。
如圖1所示,所述冷凝器2具有二冷凝基管20A、20B、複數散熱導管21以及複數散熱件22,所述冷凝基管20A、20B內部各具有一密閉的腔室,該二冷凝基管20A、20B係直立設置且沿水平方向間隔排列。所述散熱導管21分別為具有導熱性的管體,該複數散熱導管21係上下平行排列地連接於該二冷凝基管20A、20B之間,所述複數散熱件22係分布排列且導熱性接觸該複數散熱導管21之外表面,所述散熱件22可為波浪狀片體或其他具有較大散熱表面之部件。
如圖1及圖2所示,所述第一冷媒管3之口徑大於第二冷媒管4A、4B的口徑,其中,口徑較大的第一冷媒管3兩端分別連接蒸發器1的氣態冷媒出口12與冷凝器2一側的冷凝基管20A上段,口徑較小的該二第二冷媒管 4A、4B分別以其一端連接該蒸發器1相異兩側側壁的液態冷媒入口13、14,該二第二冷媒管4A、4B之另一端則分別連接該冷凝器2兩側之冷凝基管20A、20B下段,藉此,使蒸發器1、冷凝器2結合第一冷媒管3與第二冷媒管4A、4B構成一多流向的密閉冷媒循環迴路,所述冷媒5係裝填於該密閉的冷媒循環迴路中。
如圖2及圖3所示,該冷媒式散熱裝置於使用時,以應用於電子裝置的提供冷卻降溫功能為例,該冷媒式散熱裝置係以蒸發器1之蒸發器本體10底部之導熱底板11導熱性接觸電子裝置之發熱源6,發熱源6產生的熱通過蒸發器本體10之導熱底板11熱傳導至蒸發室100中的冷媒5,蒸發室100內之冷媒5因吸熱而由液態轉化為氣態。藉由熱氣自然上升之原理,以及流體通過之開口面積大小與流體通過的流速成反比、流體的流速與壓力成反比之白努利定理,基於蒸發器本體10相異兩側之液態冷媒出口13、14的開口面積小於蒸發器本體10頂部氣態冷媒出口12的開口面積,故而蒸發室100中之氣態冷媒會集中朝向頂部壓力較小的氣態冷媒出口12方向流動。
如圖2及圖3所示,當氣態冷媒通過蒸發器1頂部的氣態冷媒出口12後,接續通過第一冷媒管3進入冷凝器2一側的冷凝基管20A,進入冷凝基管20A中之氣態冷媒之部分因遠離熱源而降溫冷凝為液態冷媒,此部分的液態冷媒會先沿著冷凝基管20A下降,並通過第二冷媒管4A先行回流至蒸發器1之蒸發室100中回補冷媒再重新吸熱。進入冷凝基管20A中之其餘氣態冷媒係分散通過該複數散熱導管21流向冷凝器2另一側的冷凝基管20B中。於此流動過程中,藉由熱傳導至接觸該複數散熱導管21的複數散熱件22,以及利用該複數散熱件22擴大散熱表面積而快速散熱,使通過該複數散熱導管21內的氣態冷媒降溫而冷凝為液態,液態冷媒進入冷凝器2另一側的冷凝基管20B中,液態的冷媒再沿 第二冷媒管4B回流至蒸發器1的蒸發室10中重新再吸熱,藉此多流向的冷媒相變循環流動方式,使該冷媒式散熱裝置達到高效能的散熱效果。

Claims (2)

  1. 一種冷媒式散熱裝置,係包含:一蒸發器,其包含一內有蒸發室的蒸發器本體,蒸發器本體底部具有一導熱底板,蒸發器本體頂部具有一氣態冷媒出口,蒸發器本體於低於氣態冷媒出口之水平方向的相異兩側側壁分別形成一液態冷媒入口,氣態冷媒出口與液態冷媒入口分別連通蒸發室,且液態冷媒入口的開口面積小於氣態冷媒出口的開口面積;一冷凝器,其具有二冷凝基管、複數散熱導管以及複數散熱件,該二冷凝基管直立設置且沿水平方向間隔排列,該二冷凝基管內部各具有一密閉的腔室,該複數散熱導管上下排列地連接於該二冷凝基管之間,所述複數散熱件係分布排列且導熱性接觸該複數散熱導管之外表面;一第一冷媒管,其兩端分別連接蒸發器的氣態冷媒出口與冷凝器一側的冷凝基管上段;二第二冷媒管,該二第二冷媒管之口徑小於第一冷媒管的口徑,該二第二冷媒管分別以其一端連接該蒸發器相異兩側側壁的液態冷媒入口,該二第二冷媒管之另一端則分別連接該冷凝器兩側之冷凝基管下段,使蒸發器、冷凝器結合第一冷媒管與第二冷媒管構成一多流向的密閉冷媒循環迴路;以及冷媒,係裝填於該密閉的冷媒循環迴路中。
  2. 如請求項1所述之冷媒式散熱裝置,其中,所述散熱件為波浪狀片體。
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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160158900A1 (en) * 2014-12-03 2016-06-09 Universal Vortex Inc. Vortex Tube
JP1548555S (zh) * 2015-12-04 2016-10-17
JP1548346S (zh) * 2015-12-04 2016-10-17
JP1548554S (zh) * 2015-12-04 2016-10-17
USD810034S1 (en) * 2016-02-22 2018-02-13 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns
JP6624119B2 (ja) * 2017-02-24 2019-12-25 トヨタ自動車株式会社 熱交換器
US11555660B2 (en) * 2017-08-03 2023-01-17 Mitsubishi Electric Corporation Refrigerant distributor, heat exchanger, and refrigeration cycle apparatus
CN109392283A (zh) * 2017-08-04 2019-02-26 万在工业股份有限公司 相变化蒸发器及相变化散热装置
CN207395544U (zh) * 2017-08-31 2018-05-22 万在工业股份有限公司 具有散热鳍片的相变化式蒸发器以及相变化式散热装置
TWI631308B (zh) * 2017-09-14 2018-08-01 萬在工業股份有限公司 Parallel condenser and heat sink
CN109520338A (zh) * 2017-09-19 2019-03-26 万在工业股份有限公司 并联式冷凝器及散热装置
EP3742101B1 (en) * 2018-01-19 2023-10-25 Sumitomo Precision Products Co., Ltd. Ebullient cooler
JP7238401B2 (ja) * 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
JP2019179832A (ja) * 2018-03-30 2019-10-17 日本電産株式会社 冷却装置
TW202010387A (zh) * 2018-08-22 2020-03-01 萬在工業股份有限公司 冷凝器及散熱裝置
US11493239B2 (en) 2018-09-28 2022-11-08 Universal Vortex, Inc. Method for reducing the energy necessary for cooling natural gas into liquid natural gas using a non-freezing vortex tube as a precooling device
TWI677659B (zh) * 2019-01-16 2019-11-21 萬在工業股份有限公司 並聯式冷凝裝置
USD957460S1 (en) * 2020-10-19 2022-07-12 Resource Intl Inc. Transmission cooler for automotive applications
CN114518792A (zh) * 2020-11-19 2022-05-20 英业达科技有限公司 散热装置
CN113225991A (zh) * 2021-04-30 2021-08-06 深圳市汇川技术股份有限公司 散热装置及电子器件
CN116147233B (zh) * 2023-04-21 2023-06-30 广东美博智能环境设备有限公司 一种高效率的制冷设备换热管

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1618002A (zh) * 2001-11-29 2005-05-18 贝洱两合公司 热交换器
US20110214840A1 (en) * 2008-11-18 2011-09-08 Hitoshi Sakamoto Boiling heat transfer device
CN102834688A (zh) * 2010-03-29 2012-12-19 日本电气株式会社 相变冷却器和设有该相变冷却器的电子设备
TWM444501U (zh) * 2012-08-10 2013-01-01 Cooling House Co Ltd 燈具用的無風扇式散熱裝置
TWM513991U (zh) * 2015-05-21 2015-12-11 Man Zai Ind Co Ltd 冷媒式散熱裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271239A (en) * 1990-11-13 1993-12-21 Rocky Research Cooling apparatus for electronic and computer components
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US7497252B2 (en) * 2006-01-24 2009-03-03 John Yenkai Pun Active fluid and air heat exchanger and method
US7665511B2 (en) * 2006-05-25 2010-02-23 Delphi Technologies, Inc. Orientation insensitive thermosiphon capable of operation in upside down position
US8305761B2 (en) * 2009-11-17 2012-11-06 Apple Inc. Heat removal in compact computing systems

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1618002A (zh) * 2001-11-29 2005-05-18 贝洱两合公司 热交换器
US20110214840A1 (en) * 2008-11-18 2011-09-08 Hitoshi Sakamoto Boiling heat transfer device
CN102834688A (zh) * 2010-03-29 2012-12-19 日本电气株式会社 相变冷却器和设有该相变冷却器的电子设备
TWM444501U (zh) * 2012-08-10 2013-01-01 Cooling House Co Ltd 燈具用的無風扇式散熱裝置
TWM513991U (zh) * 2015-05-21 2015-12-11 Man Zai Ind Co Ltd 冷媒式散熱裝置

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