USD689835S1 - Electrostatic carrier tray - Google Patents

Electrostatic carrier tray Download PDF

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Publication number
USD689835S1
USD689835S1 US29/441,627 US201329441627F USD689835S US D689835 S1 USD689835 S1 US D689835S1 US 201329441627 F US201329441627 F US 201329441627F US D689835 S USD689835 S US D689835S
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US
United States
Prior art keywords
carrier tray
electrostatic carrier
view
electrostatic
tray
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/441,627
Inventor
Eryn Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diablo Capital Inc
Original Assignee
Eryn Smith
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eryn Smith filed Critical Eryn Smith
Priority to US29/441,627 priority Critical patent/USD689835S1/en
Application granted granted Critical
Publication of USD689835S1 publication Critical patent/USD689835S1/en
Assigned to WESTERN ALLIANCE BANK reassignment WESTERN ALLIANCE BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SMITH, ERYN
Assigned to SMITH, ERYN reassignment SMITH, ERYN RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: WESTER ALLIANCE BANK
Assigned to DIABLO CAPITAL, INC. reassignment DIABLO CAPITAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SMITH, ERYN
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a perspective view of an electrostatic carrier tray showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a left-side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is an exploded perspective view thereof;
FIG. 9 is a perspective view thereof shown in a used condition wherein a plurality of substrates is electrostatically bonded to the plurality of electrostatic field generating circuits; and,
FIG. 10 is a cross-sectional view thereof taken along line 10-10 of FIG. 7.
The broken lines illustrate the plurality of substrates in FIG. 9 and are included to show environmental structure that forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electrostatic carrier tray, as shown and described.
US29/441,627 2013-01-08 2013-01-08 Electrostatic carrier tray Active USD689835S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/441,627 USD689835S1 (en) 2013-01-08 2013-01-08 Electrostatic carrier tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/441,627 USD689835S1 (en) 2013-01-08 2013-01-08 Electrostatic carrier tray

Publications (1)

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USD689835S1 true USD689835S1 (en) 2013-09-17

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US29/441,627 Active USD689835S1 (en) 2013-01-08 2013-01-08 Electrostatic carrier tray

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
US10236202B2 (en) 2013-11-11 2019-03-19 Diablo Capital, Inc. System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum
USD913256S1 (en) 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10236202B2 (en) 2013-11-11 2019-03-19 Diablo Capital, Inc. System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD913256S1 (en) 2019-07-31 2021-03-16 Eryn Smith Antenna pattern for a semiconductive substrate carrier

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