JP1548554S - - Google Patents

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Publication number
JP1548554S
JP1548554S JPD2015-27271F JP2015027271F JP1548554S JP 1548554 S JP1548554 S JP 1548554S JP 2015027271 F JP2015027271 F JP 2015027271F JP 1548554 S JP1548554 S JP 1548554S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-27271F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-27271F priority Critical patent/JP1548554S/ja
Priority to US29/566,047 priority patent/USD798831S1/en
Priority to TW105303084D02F priority patent/TWD181168S/zh
Priority to CA168805F priority patent/CA168805S/en
Application granted granted Critical
Publication of JP1548554S publication Critical patent/JP1548554S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-27271F 2015-12-04 2015-12-04 Active JP1548554S (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JPD2015-27271F JP1548554S (ko) 2015-12-04 2015-12-04
US29/566,047 USD798831S1 (en) 2015-12-04 2016-05-26 Cooling device for an electronic component heat sink
TW105303084D02F TWD181168S (zh) 2015-12-04 2016-05-31 電子零件散熱器用冷卻裝置
CA168805F CA168805S (en) 2015-12-04 2016-06-02 Heat-exchanger for electronic component heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-27271F JP1548554S (ko) 2015-12-04 2015-12-04

Publications (1)

Publication Number Publication Date
JP1548554S true JP1548554S (ko) 2016-10-17

Family

ID=55762036

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-27271F Active JP1548554S (ko) 2015-12-04 2015-12-04

Country Status (3)

Country Link
US (1) USD798831S1 (ko)
JP (1) JP1548554S (ko)
TW (1) TWD181168S (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD813364S1 (en) * 2015-06-26 2018-03-20 Spx Cooling Technologies, Inc. Drift eliminator
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink
USD849567S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing
ZAF201602033S (en) * 2016-12-21 2019-10-30 Mecalc Pty Ltd Casing ¿ variations of vertical
USD837362S1 (en) * 2017-04-19 2019-01-01 Glen Dimplex Americas Limited Forked paddle element for an electric fireplace
USD961535S1 (en) * 2020-01-15 2022-08-23 Showa Denko K.K. Pin fintype heat sink
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
CN2594989Y (zh) * 2001-11-29 2003-12-24 王清风 可提高热交换效率的热交换鳍片板
TWI267337B (en) * 2003-05-14 2006-11-21 Inventor Prec Co Ltd Heat sink
US7306028B2 (en) * 2005-06-23 2007-12-11 Thermal Corp. Modular heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
USD567343S1 (en) * 2006-09-08 2008-04-22 Spx Cooling Technologies, Inc. Film fill pack
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
USD586763S1 (en) * 2007-08-23 2009-02-17 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
CN101839654B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热器
US20130020060A1 (en) * 2010-09-02 2013-01-24 Cooper-Standard Automotive, Inc. Heat exchanger
CN103119387A (zh) * 2010-09-21 2013-05-22 开利公司 包括独立热交换回路的微通道热交换器和方法
USD676118S1 (en) * 2011-06-24 2013-02-12 Hiform As Heat exchanger panel
EP2704190A1 (en) * 2012-09-03 2014-03-05 ABB Technology AG Modular cooling system
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
EP2988578B1 (en) * 2014-08-19 2021-05-19 ABB Schweiz AG Cooling element
CN105636407A (zh) * 2014-11-27 2016-06-01 英业达科技有限公司 散热鳍片组
FR3030708B1 (fr) * 2014-12-22 2018-02-16 Airbus Operations Sas Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur
TWI650522B (zh) * 2015-05-21 2019-02-11 萬在工業股份有限公司 冷媒式散熱裝置
TWM512730U (zh) * 2015-08-20 2015-11-21 Cooler Master Co Ltd 水冷式散熱裝置

Also Published As

Publication number Publication date
USD798831S1 (en) 2017-10-03
TWD181168S (zh) 2017-02-01

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