JP1463922S - - Google Patents
Info
- Publication number
- JP1463922S JP1463922S JPD2012-10399F JP2012010399F JP1463922S JP 1463922 S JP1463922 S JP 1463922S JP 2012010399 F JP2012010399 F JP 2012010399F JP 1463922 S JP1463922 S JP 1463922S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2012-10399F JP1463922S (OSRAM) | 2012-05-02 | 2012-05-02 | |
| US29/431,909 USD692843S1 (en) | 2012-05-02 | 2012-09-12 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2012-10399F JP1463922S (OSRAM) | 2012-05-02 | 2012-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1463922S true JP1463922S (OSRAM) | 2016-02-29 |
Family
ID=49488222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2012-10399F Active JP1463922S (OSRAM) | 2012-05-02 | 2012-05-02 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD692843S1 (OSRAM) |
| JP (1) | JP1463922S (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD776801S1 (en) * | 2014-06-24 | 2017-01-17 | Kobe Steel, Ltd | Heat exchanger tube |
| JP1555474S (OSRAM) * | 2015-10-26 | 2016-08-08 | ||
| JP1555473S (OSRAM) * | 2015-10-26 | 2016-08-08 | ||
| USD1056861S1 (en) * | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| JP1696315S (ja) * | 2021-03-23 | 2021-10-04 | 電力用半導体素子 | |
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| JP1755379S (ja) * | 2023-03-30 | 2023-10-16 | 化学的機械研磨装置用シール材 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7786496B2 (en) * | 2002-04-24 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
| USD574339S1 (en) * | 2005-06-24 | 2008-08-05 | Nitto Denko Corporation | Pattern formed on the ground layer of a multilayer printed circuit board |
| CN101490733B (zh) * | 2006-07-15 | 2012-11-07 | 夏普株式会社 | 显示面板用基板和具有该基板的显示面板 |
| US8119919B2 (en) * | 2006-10-24 | 2012-02-21 | Panasonic Corporation | Printed wiring board, method for manufacturing printed wiring board, and electric device |
| JPWO2008126541A1 (ja) * | 2007-04-05 | 2010-07-22 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| JP4538069B2 (ja) * | 2008-11-28 | 2010-09-08 | 株式会社東芝 | プリント配線板 |
| TWM357702U (en) * | 2009-01-15 | 2009-05-21 | Domintech Co Ltd | Chip package with colored pattern |
| US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| JP2012014669A (ja) * | 2009-11-20 | 2012-01-19 | Fujifilm Corp | 導電シート、導電シートの使用方法及び静電容量方式タッチパネル |
| US8674250B2 (en) * | 2011-01-24 | 2014-03-18 | Young Fast Optoelectronics Co., Ltd | Substrate of touch panel in manufacturing and the method for forming the same |
| JP5211185B2 (ja) * | 2011-02-10 | 2013-06-12 | 株式会社フジクラ | プリント配線板 |
-
2012
- 2012-05-02 JP JPD2012-10399F patent/JP1463922S/ja active Active
- 2012-09-12 US US29/431,909 patent/USD692843S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD692843S1 (en) | 2013-11-05 |