ITTO20040517A1 - Struttura dissipatrice del calore per dispositivi elettronici e simili - Google Patents
Struttura dissipatrice del calore per dispositivi elettronici e similiInfo
- Publication number
- ITTO20040517A1 ITTO20040517A1 ITTO20040517A ITTO20040517A1 IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1 IT TO20040517 A ITTO20040517 A IT TO20040517A IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1
- Authority
- IT
- Italy
- Prior art keywords
- electronic
- heat dissipating
- similar devices
- dissipating structure
- similar
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO20040517 ITTO20040517A1 (it) | 2004-07-23 | 2004-07-23 | Struttura dissipatrice del calore per dispositivi elettronici e simili |
| PCT/EP2005/053553 WO2006008315A2 (fr) | 2004-07-23 | 2005-07-21 | Structure de dissipation thermique pour dispositifs electroniques et analogues |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO20040517 ITTO20040517A1 (it) | 2004-07-23 | 2004-07-23 | Struttura dissipatrice del calore per dispositivi elettronici e simili |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ITTO20040517A1 true ITTO20040517A1 (it) | 2004-10-23 |
Family
ID=34972894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITTO20040517 ITTO20040517A1 (it) | 2004-07-23 | 2004-07-23 | Struttura dissipatrice del calore per dispositivi elettronici e simili |
Country Status (2)
| Country | Link |
|---|---|
| IT (1) | ITTO20040517A1 (fr) |
| WO (1) | WO2006008315A2 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2902771A1 (de) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | Kuehlvorrichtung fuer halbleiterbauelemente |
| US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
| JPH09312361A (ja) * | 1996-05-22 | 1997-12-02 | Hitachi Metals Ltd | 電子部品用複合材料およびその製造方法 |
| DE19908749A1 (de) * | 1999-02-20 | 2000-08-31 | Daimler Chrysler Ag | Verfahren zur Erzielung einer gleichmäßigen Temperaturverteilung bei auf einen Träger aufgelöteten Halbleiter-Elementen |
| US6942025B2 (en) * | 2000-09-20 | 2005-09-13 | Degree Controls, Inc. | Uniform heat dissipating and cooling heat sink |
-
2004
- 2004-07-23 IT ITTO20040517 patent/ITTO20040517A1/it unknown
-
2005
- 2005-07-21 WO PCT/EP2005/053553 patent/WO2006008315A2/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006008315A3 (fr) | 2006-08-10 |
| WO2006008315A8 (fr) | 2006-05-11 |
| WO2006008315A2 (fr) | 2006-01-26 |
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