ITTO20010540A1 - Dispositivo elettronico e relativo processo di fabbricazione. - Google Patents
Dispositivo elettronico e relativo processo di fabbricazione. Download PDFInfo
- Publication number
- ITTO20010540A1 ITTO20010540A1 IT2001TO000540A ITTO20010540A ITTO20010540A1 IT TO20010540 A1 ITTO20010540 A1 IT TO20010540A1 IT 2001TO000540 A IT2001TO000540 A IT 2001TO000540A IT TO20010540 A ITTO20010540 A IT TO20010540A IT TO20010540 A1 ITTO20010540 A1 IT TO20010540A1
- Authority
- IT
- Italy
- Prior art keywords
- electronic device
- dimensional
- electronic circuit
- dimensional electronic
- impregnable material
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 7
- 229930195733 hydrocarbon Natural products 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 239000000835 fiber Substances 0.000 claims 2
- 239000012455 biphasic mixture Substances 0.000 claims 1
- 239000011491 glass wool Substances 0.000 claims 1
- 239000011490 mineral wool Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 235000013311 vegetables Nutrition 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2001TO000540A ITTO20010540A1 (it) | 2001-06-05 | 2001-06-05 | Dispositivo elettronico e relativo processo di fabbricazione. |
| EP02741171A EP1412983A2 (de) | 2001-06-05 | 2002-06-05 | Elektronikbauteil und seine herstellung |
| AU2002314532A AU2002314532A1 (en) | 2001-06-05 | 2002-06-05 | Electronic device and relative fabrication method |
| PCT/IT2002/000367 WO2002099883A2 (en) | 2001-06-05 | 2002-06-05 | Electronic device and relative fabrication method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2001TO000540A ITTO20010540A1 (it) | 2001-06-05 | 2001-06-05 | Dispositivo elettronico e relativo processo di fabbricazione. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ITTO20010540A0 ITTO20010540A0 (it) | 2001-06-05 |
| ITTO20010540A1 true ITTO20010540A1 (it) | 2002-12-05 |
Family
ID=11458933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT2001TO000540A ITTO20010540A1 (it) | 2001-06-05 | 2001-06-05 | Dispositivo elettronico e relativo processo di fabbricazione. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1412983A2 (de) |
| AU (1) | AU2002314532A1 (de) |
| IT (1) | ITTO20010540A1 (de) |
| WO (1) | WO2002099883A2 (de) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673306A (en) * | 1970-11-02 | 1972-06-27 | Trw Inc | Fluid heat transfer method and apparatus for semi-conducting devices |
| US5270571A (en) * | 1991-10-30 | 1993-12-14 | Amdahl Corporation | Three-dimensional package for semiconductor devices |
| US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
| JP2001183080A (ja) * | 1999-12-24 | 2001-07-06 | Furukawa Electric Co Ltd:The | 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ |
-
2001
- 2001-06-05 IT IT2001TO000540A patent/ITTO20010540A1/it unknown
-
2002
- 2002-06-05 EP EP02741171A patent/EP1412983A2/de not_active Withdrawn
- 2002-06-05 AU AU2002314532A patent/AU2002314532A1/en not_active Abandoned
- 2002-06-05 WO PCT/IT2002/000367 patent/WO2002099883A2/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1412983A2 (de) | 2004-04-28 |
| WO2002099883A2 (en) | 2002-12-12 |
| WO2002099883A3 (en) | 2004-03-04 |
| ITTO20010540A0 (it) | 2001-06-05 |
| AU2002314532A1 (en) | 2002-12-16 |
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