ITMI20111202A1 - Procedimento per la produzione di un componente con attenuazione divibrazioni - Google Patents
Procedimento per la produzione di un componente con attenuazione divibrazioniInfo
- Publication number
- ITMI20111202A1 ITMI20111202A1 ITMI20111202A ITMI20111202A1 IT MI20111202 A1 ITMI20111202 A1 IT MI20111202A1 IT MI20111202 A ITMI20111202 A IT MI20111202A IT MI20111202 A1 ITMI20111202 A1 IT MI20111202A1
- Authority
- IT
- Italy
- Prior art keywords
- divibration
- attenuation
- procedure
- production
- component
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Vibration Prevention Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010030960.5A DE102010030960B4 (de) | 2010-07-06 | 2010-07-06 | Verfahren zur Herstellung eines schwingungsgedämpften Bauteils |
Publications (1)
Publication Number | Publication Date |
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ITMI20111202A1 true ITMI20111202A1 (it) | 2012-01-07 |
Family
ID=44898760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI20111202 ITMI20111202A1 (it) | 2010-07-06 | 2011-06-29 | Procedimento per la produzione di un componente con attenuazione divibrazioni |
Country Status (5)
Country | Link |
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KR (1) | KR101877713B1 (fr) |
CN (1) | CN102311092A (fr) |
DE (1) | DE102010030960B4 (fr) |
FR (1) | FR2962429B1 (fr) |
IT (1) | ITMI20111202A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011003195B4 (de) | 2011-01-26 | 2019-01-10 | Robert Bosch Gmbh | Bauteil und Verfahren zum Herstellen eines Bauteils |
US8946833B2 (en) * | 2012-10-22 | 2015-02-03 | Freescale Semiconductor, Inc. | Packaging for semiconductor sensor devices and methods |
US10497633B2 (en) | 2013-02-06 | 2019-12-03 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with fluid containment |
KR20150115019A (ko) * | 2013-02-06 | 2015-10-13 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 밀폐 챔버가 구비된 신축가능한 전자 시스템 |
US10840536B2 (en) | 2013-02-06 | 2020-11-17 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
US9613911B2 (en) | 2013-02-06 | 2017-04-04 | The Board Of Trustees Of The University Of Illinois | Self-similar and fractal design for stretchable electronics |
DE102013204811A1 (de) * | 2013-03-19 | 2014-09-25 | Robert Bosch Gmbh | Sensorvorrichtung zum Sensieren eines Gases, Verfahren zum Betreiben einer Sensorvorrichtung zum Sensieren eines Gases und Herstellungsverfahren für eine Sensorvorrichtung zum Sensieren eines Gases |
DE102013206524A1 (de) * | 2013-04-12 | 2014-10-16 | Robert Bosch Gmbh | Bauelement, Nutzen und Verfahren zum Herstellen eines Bauelements |
DE102014202821B4 (de) | 2014-02-17 | 2023-03-30 | Robert Bosch Gmbh | Gehäuse für ein mikromechanisches Sensorelement |
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DE10259795A1 (de) * | 2002-12-19 | 2004-07-08 | Siemens Ag | Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges |
JP4238724B2 (ja) * | 2003-03-27 | 2009-03-18 | 株式会社デンソー | 半導体装置 |
DE10332303A1 (de) * | 2003-07-16 | 2005-02-17 | Robert Bosch Gmbh | Halterung für Bauteile |
DE102004043663B4 (de) * | 2004-09-07 | 2006-06-08 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip |
JP4831949B2 (ja) | 2004-09-08 | 2011-12-07 | 株式会社デンソー | 物理量センサ装置 |
DE102005002813B4 (de) * | 2005-01-20 | 2006-10-19 | Robert Bosch Gmbh | Steuermodul |
DE102005012404B4 (de) * | 2005-03-17 | 2007-05-03 | Siemens Ag | Leiterplatte |
DE102006011753B4 (de) * | 2006-03-13 | 2021-01-28 | Infineon Technologies Ag | Halbleitersensorbauteil, Verfahren zur Herstellung eines Nutzens und Verfahren zur Herstellung von Halbleitersensorbauteilen |
JP2010530134A (ja) | 2007-06-15 | 2010-09-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 組み込まれた振動遮断部を備えたプリモールドハウジング |
DE102008016133B4 (de) * | 2008-03-28 | 2013-12-19 | Continental Automotive Gmbh | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
EP2112471A1 (fr) * | 2008-04-22 | 2009-10-28 | Microcomponents AG | Dispositif de montage pour composant électronique |
JP4851555B2 (ja) * | 2008-05-13 | 2012-01-11 | 株式会社デンソー | 力学量センサおよびその製造方法 |
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KR20120004335A (ko) | 2012-01-12 |
KR101877713B1 (ko) | 2018-08-09 |
DE102010030960A1 (de) | 2012-01-12 |
CN102311092A (zh) | 2012-01-11 |
FR2962429A1 (fr) | 2012-01-13 |
FR2962429B1 (fr) | 2017-07-28 |
DE102010030960B4 (de) | 2020-12-10 |
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