ITMI20001335A0 - Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni - Google Patents

Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni

Info

Publication number
ITMI20001335A0
ITMI20001335A0 IT2000MI001335A ITMI20001335A ITMI20001335A0 IT MI20001335 A0 ITMI20001335 A0 IT MI20001335A0 IT 2000MI001335 A IT2000MI001335 A IT 2000MI001335A IT MI20001335 A ITMI20001335 A IT MI20001335A IT MI20001335 A0 ITMI20001335 A0 IT MI20001335A0
Authority
IT
Italy
Prior art keywords
massacula
casting
vibration
procedure
assembly equipped
Prior art date
Application number
IT2000MI001335A
Other languages
English (en)
Inventor
Franzen Frank
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20001335A0 publication Critical patent/ITMI20001335A0/it
Publication of ITMI20001335A1 publication Critical patent/ITMI20001335A1/it
Application granted granted Critical
Publication of IT1318001B1 publication Critical patent/IT1318001B1/it

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Vibration Prevention Devices (AREA)
  • Refinement Of Pig-Iron, Manufacture Of Cast Iron, And Steel Manufacture Other Than In Revolving Furnaces (AREA)
IT2000MI001335A 1999-06-29 2000-06-15 Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni IT1318001B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19929754A DE19929754C2 (de) 1999-06-29 1999-06-29 Verguß einer bestückten Baugruppe mit vibrationsdämpfender Gießmasse

Publications (3)

Publication Number Publication Date
ITMI20001335A0 true ITMI20001335A0 (it) 2000-06-15
ITMI20001335A1 ITMI20001335A1 (it) 2001-12-15
IT1318001B1 IT1318001B1 (it) 2003-07-21

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IT2000MI001335A IT1318001B1 (it) 1999-06-29 2000-06-15 Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni

Country Status (4)

Country Link
US (1) US6350953B1 (it)
DE (1) DE19929754C2 (it)
FR (1) FR2795908A1 (it)
IT (1) IT1318001B1 (it)

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DE10038508A1 (de) * 2000-08-08 2002-02-21 Bosch Gmbh Robert Elektrische Baugruppe und Verfahren zur Herstellung der elektrischen Baugruppe
DE10051945C1 (de) * 2000-10-19 2001-11-29 Siemens Ag Dichte Aufnahmekammer für Kfz-Elektronikbauteil und Verfahren zur Herstellung derselben
JP2003229517A (ja) * 2002-01-31 2003-08-15 Fujitsu Hitachi Plasma Display Ltd 半導体チップ実装基板及びフラットディスプレイ
US20040211582A1 (en) * 2003-04-23 2004-10-28 Siemens Vdo Automotive, Inc. Vehicle component having an electrical conductor adhesively secured into the component
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ITMI20001335A1 (it) 2001-12-15
US6350953B1 (en) 2002-02-26
FR2795908A1 (fr) 2001-01-05
DE19929754C2 (de) 2001-08-16
DE19929754A1 (de) 2001-01-18

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