IT1318001B1 - Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni - Google Patents

Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni

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Publication number
IT1318001B1
IT1318001B1 IT2000MI001335A ITMI20001335A IT1318001B1 IT 1318001 B1 IT1318001 B1 IT 1318001B1 IT 2000MI001335 A IT2000MI001335 A IT 2000MI001335A IT MI20001335 A ITMI20001335 A IT MI20001335A IT 1318001 B1 IT1318001 B1 IT 1318001B1
Authority
IT
Italy
Prior art keywords
massaculated
casting
vibration
drop
procedure
Prior art date
Application number
IT2000MI001335A
Other languages
English (en)
Inventor
Franzen Frank
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20001335A0 publication Critical patent/ITMI20001335A0/it
Publication of ITMI20001335A1 publication Critical patent/ITMI20001335A1/it
Application granted granted Critical
Publication of IT1318001B1 publication Critical patent/IT1318001B1/it

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
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    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49002—Electrical device making
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Vibration Prevention Devices (AREA)
  • Refinement Of Pig-Iron, Manufacture Of Cast Iron, And Steel Manufacture Other Than In Revolving Furnaces (AREA)
IT2000MI001335A 1999-06-29 2000-06-15 Procedimento per annegare per colata un gruppo equipaggiato con massacolata antivibrazioni IT1318001B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19929754A DE19929754C2 (de) 1999-06-29 1999-06-29 Verguß einer bestückten Baugruppe mit vibrationsdämpfender Gießmasse

Publications (3)

Publication Number Publication Date
ITMI20001335A0 ITMI20001335A0 (it) 2000-06-15
ITMI20001335A1 ITMI20001335A1 (it) 2001-12-15
IT1318001B1 true IT1318001B1 (it) 2003-07-21

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US (1) US6350953B1 (it)
DE (1) DE19929754C2 (it)
FR (1) FR2795908A1 (it)
IT (1) IT1318001B1 (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10038508A1 (de) * 2000-08-08 2002-02-21 Bosch Gmbh Robert Elektrische Baugruppe und Verfahren zur Herstellung der elektrischen Baugruppe
DE10051945C1 (de) * 2000-10-19 2001-11-29 Siemens Ag Dichte Aufnahmekammer für Kfz-Elektronikbauteil und Verfahren zur Herstellung derselben
JP2003229517A (ja) 2002-01-31 2003-08-15 Fujitsu Hitachi Plasma Display Ltd 半導体チップ実装基板及びフラットディスプレイ
US20040211582A1 (en) * 2003-04-23 2004-10-28 Siemens Vdo Automotive, Inc. Vehicle component having an electrical conductor adhesively secured into the component
EP1356997B1 (en) * 2002-04-25 2010-02-03 Siemens VDO Automotive Inc. Vehicle component having an electrical conductor adhesively secured into the component
DE10233296A1 (de) * 2002-07-22 2004-02-12 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung eines Gehäuses für einen gekapselten Sensor und entsprechendes Gehäuse
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
JP2005080370A (ja) * 2003-08-29 2005-03-24 Auto Network Gijutsu Kenkyusho:Kk 回路構成体及び防水処理された回路構成体の製造方法
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
DE102005022536A1 (de) 2005-05-17 2006-11-23 Siemens Ag Steuereinheit mit einer flexiblen Leiterplatte
EP1925037A4 (en) * 2005-09-13 2011-10-26 Showa Denko Kk LIGHT EMITTING DEVICE
US7345492B2 (en) * 2005-12-14 2008-03-18 Microprobe, Inc. Probe cards employing probes having retaining portions for potting in a retention arrangement
DE102006033269B4 (de) * 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
DE102006033477B3 (de) * 2006-07-19 2008-01-24 Siemens Ag Leiterträger und Anordnung mit Leiterträger
JP4453711B2 (ja) * 2007-03-30 2010-04-21 Ｔｄｋ株式会社 薄膜部品及び製造方法
DE102007032594B4 (de) * 2007-07-12 2009-04-09 Continental Automotive Gmbh Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
US8245575B2 (en) * 2009-12-08 2012-08-21 Jen-Huang Albert Chiou Pressure sensor device with breakwater to reduce protective gel vibration
CN102945837B (zh) * 2012-10-24 2015-08-19 西安永电电气有限责任公司 一种半导体模块结构以及该结构中键合线的连接固定方法
DE102015212616A1 (de) 2015-07-06 2017-01-12 Zf Friedrichshafen Ag Schutzgehäuse zur flexiblen Bauteilfixierung und Leiterplatte mit Schutzgehäuse
DE102016224671B4 (de) 2016-12-12 2021-07-29 Vitesco Technologies Germany Gmbh Getriebesteuergerät in einem Kraftfahrzeug
CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5018005A (en) * 1989-12-27 1991-05-21 Motorola Inc. Thin, molded, surface mount electronic device
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
DE4407810C2 (de) * 1994-03-09 1998-02-26 Semikron Elektronik Gmbh Schaltungsanordnung (Modul)
DE19515187C2 (de) * 1995-04-25 2003-07-10 Infineon Technologies Ag Chip-Abdeckung
DE19712842C1 (de) * 1997-03-26 1998-08-13 Siemens Ag Steuergerät für ein Kraftfahrzeug

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FR2795908A1 (fr) 2001-01-05
US6350953B1 (en) 2002-02-26
DE19929754A1 (de) 2001-01-18
ITMI20001335A0 (it) 2000-06-15
ITMI20001335A1 (it) 2001-12-15

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