IT991087B - Pacco di unita elementari lsi e procedimento per realizzarlo - Google Patents

Pacco di unita elementari lsi e procedimento per realizzarlo

Info

Publication number
IT991087B
IT991087B IT26386/73A IT2638673A IT991087B IT 991087 B IT991087 B IT 991087B IT 26386/73 A IT26386/73 A IT 26386/73A IT 2638673 A IT2638673 A IT 2638673A IT 991087 B IT991087 B IT 991087B
Authority
IT
Italy
Prior art keywords
lsi
pack
realizing
procedure
elementary units
Prior art date
Application number
IT26386/73A
Other languages
English (en)
Italian (it)
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Application granted granted Critical
Publication of IT991087B publication Critical patent/IT991087B/it

Links

Classifications

    • H10W40/22—
    • H10W70/635—
    • H10W72/075—
    • H10W76/157—
    • H10W70/682—
    • H10W72/073—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5475—
    • H10W72/884—
    • H10W72/926—
    • H10W72/932—
    • H10W90/754—
IT26386/73A 1972-07-10 1973-07-09 Pacco di unita elementari lsi e procedimento per realizzarlo IT991087B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27044872A 1972-07-10 1972-07-10

Publications (1)

Publication Number Publication Date
IT991087B true IT991087B (it) 1975-07-30

Family

ID=23031361

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26386/73A IT991087B (it) 1972-07-10 1973-07-09 Pacco di unita elementari lsi e procedimento per realizzarlo

Country Status (7)

Country Link
US (1) US4115837A (index.php)
JP (1) JPS5228547B2 (index.php)
AT (1) AT356713B (index.php)
BR (1) BR7305010D0 (index.php)
ES (1) ES417197A1 (index.php)
IT (1) IT991087B (index.php)
NO (1) NO143441C (index.php)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433830Y2 (index.php) * 1974-05-31 1979-10-17
JPS5213772A (en) * 1975-07-22 1977-02-02 Kyocera Corp Ic package
JPS5236472A (en) * 1975-09-17 1977-03-19 Mitsubishi Electric Corp Semiconductor unit
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
DE3061383D1 (en) * 1979-02-19 1983-01-27 Fujitsu Ltd Semiconductor device and method for manufacturing the same
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
JPS59139652A (ja) * 1983-12-02 1984-08-10 Hitachi Ltd 電子回路装置の実装構造
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
DE3567771D1 (en) * 1984-11-02 1989-02-23 Siemens Ag Wave resistance-adapted chip support for a microwave semiconductor
US4916515A (en) * 1985-06-03 1990-04-10 Levi Clifford A Microwave circuit integrating
JPS63181399A (ja) * 1987-01-22 1988-07-26 日本特殊陶業株式会社 高熱伝導性厚膜多層配線基板
US5159750A (en) * 1989-12-20 1992-11-03 National Semiconductor Corporation Method of connecting an IC component with another electrical component
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
DE69009429T2 (de) * 1989-12-29 1994-09-15 Sumitomo Electric Industries Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit.
JPH04164361A (ja) * 1990-10-29 1992-06-10 Nec Corp 樹脂封止型半導体装置
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
CN100550442C (zh) * 2004-10-22 2009-10-14 皇家飞利浦电子股份有限公司 发光装置和制造这种装置的方法
US20130187286A1 (en) * 2011-07-25 2013-07-25 Richard Schneider Lead frameless hermetic circuit package
US10374387B2 (en) * 2017-11-10 2019-08-06 Finisar Corporation High power cavity package for light emitters

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202925C (index.php) * 1969-04-30 1900-01-01
US3277957A (en) * 1964-04-03 1966-10-11 Westinghouse Electric Corp Heat transfer apparatus for electronic component
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
JPS5332233B1 (index.php) * 1968-12-25 1978-09-07
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch

Also Published As

Publication number Publication date
AT356713B (de) 1980-05-27
US4115837A (en) 1978-09-19
NO143441B (no) 1980-11-03
NO143441C (no) 1981-02-11
ATA594773A (de) 1979-10-15
BR7305010D0 (pt) 1974-08-22
ES417197A1 (es) 1976-06-01
JPS4938575A (index.php) 1974-04-10
JPS5228547B2 (index.php) 1977-07-27

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