IT981199B - Apparecchiatura e procedimento per la separazione di chip semi conduttori - Google Patents

Apparecchiatura e procedimento per la separazione di chip semi conduttori

Info

Publication number
IT981199B
IT981199B IT21309/73A IT2130973A IT981199B IT 981199 B IT981199 B IT 981199B IT 21309/73 A IT21309/73 A IT 21309/73A IT 2130973 A IT2130973 A IT 2130973A IT 981199 B IT981199 B IT 981199B
Authority
IT
Italy
Prior art keywords
semi
separation
procedure
equipment
conductive chips
Prior art date
Application number
IT21309/73A
Other languages
English (en)
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US00247614A external-priority patent/US3851758A/en
Priority claimed from US247639A external-priority patent/US3915784A/en
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT981199B publication Critical patent/IT981199B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
IT21309/73A 1972-04-26 1973-03-08 Apparecchiatura e procedimento per la separazione di chip semi conduttori IT981199B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24753072A 1972-04-26 1972-04-26
US00247614A US3851758A (en) 1972-04-26 1972-04-26 Semiconductor chip fixture
US247639A US3915784A (en) 1972-04-26 1972-04-26 Method of semiconductor chip separation

Publications (1)

Publication Number Publication Date
IT981199B true IT981199B (it) 1974-10-10

Family

ID=27400049

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21309/73A IT981199B (it) 1972-04-26 1973-03-08 Apparecchiatura e procedimento per la separazione di chip semi conduttori

Country Status (5)

Country Link
CH (1) CH554076A (enExample)
DE (1) DE2317649C3 (enExample)
FR (1) FR2181842B1 (enExample)
IT (1) IT981199B (enExample)
NL (1) NL7304000A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
DE102005047509B4 (de) * 2005-10-04 2017-10-26 Degotec Gmbh Vorrichtung zur Separierung eines flächigen Objektes von einem Körper, mit dem das Objekt mittels Adhäsionskraft verbunden ist

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632074A (en) * 1967-10-09 1972-01-04 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US3590462A (en) * 1968-11-18 1971-07-06 Western Electric Co Method and apparatus for expanding an array of articles

Also Published As

Publication number Publication date
DE2317649B2 (de) 1975-04-03
DE2317649C3 (de) 1975-11-27
NL7304000A (enExample) 1973-10-30
CH554076A (de) 1974-09-13
DE2317649A1 (de) 1973-11-15
FR2181842A1 (enExample) 1973-12-07
FR2181842B1 (enExample) 1977-07-29

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