NL7304000A - - Google Patents
Info
- Publication number
- NL7304000A NL7304000A NL7304000A NL7304000A NL7304000A NL 7304000 A NL7304000 A NL 7304000A NL 7304000 A NL7304000 A NL 7304000A NL 7304000 A NL7304000 A NL 7304000A NL 7304000 A NL7304000 A NL 7304000A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24753072A | 1972-04-26 | 1972-04-26 | |
| US00247614A US3851758A (en) | 1972-04-26 | 1972-04-26 | Semiconductor chip fixture |
| US247639A US3915784A (en) | 1972-04-26 | 1972-04-26 | Method of semiconductor chip separation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7304000A true NL7304000A (enExample) | 1973-10-30 |
Family
ID=27400049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7304000A NL7304000A (enExample) | 1972-04-26 | 1973-03-22 |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH554076A (enExample) |
| DE (1) | DE2317649C3 (enExample) |
| FR (1) | FR2181842B1 (enExample) |
| IT (1) | IT981199B (enExample) |
| NL (1) | NL7304000A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4138304A (en) * | 1977-11-03 | 1979-02-06 | General Electric Company | Wafer sawing technique |
| DE102005047509B4 (de) * | 2005-10-04 | 2017-10-26 | Degotec Gmbh | Vorrichtung zur Separierung eines flächigen Objektes von einem Körper, mit dem das Objekt mittels Adhäsionskraft verbunden ist |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632074A (en) * | 1967-10-09 | 1972-01-04 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
| US3590462A (en) * | 1968-11-18 | 1971-07-06 | Western Electric Co | Method and apparatus for expanding an array of articles |
-
1973
- 1973-03-08 IT IT21309/73A patent/IT981199B/it active
- 1973-03-13 FR FR7310219A patent/FR2181842B1/fr not_active Expired
- 1973-03-22 NL NL7304000A patent/NL7304000A/xx not_active Application Discontinuation
- 1973-04-04 CH CH479473A patent/CH554076A/xx not_active IP Right Cessation
- 1973-04-07 DE DE2317649A patent/DE2317649C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2317649B2 (de) | 1975-04-03 |
| DE2317649C3 (de) | 1975-11-27 |
| CH554076A (de) | 1974-09-13 |
| DE2317649A1 (de) | 1973-11-15 |
| IT981199B (it) | 1974-10-10 |
| FR2181842A1 (enExample) | 1973-12-07 |
| FR2181842B1 (enExample) | 1977-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |