IT981199B - EQUIPMENT AND PROCEDURE FOR THE SEPARATION OF SEMI-CONDUCTIVE CHIPS - Google Patents

EQUIPMENT AND PROCEDURE FOR THE SEPARATION OF SEMI-CONDUCTIVE CHIPS

Info

Publication number
IT981199B
IT981199B IT2130973A IT2130973A IT981199B IT 981199 B IT981199 B IT 981199B IT 2130973 A IT2130973 A IT 2130973A IT 2130973 A IT2130973 A IT 2130973A IT 981199 B IT981199 B IT 981199B
Authority
IT
Italy
Prior art keywords
semi
separation
procedure
equipment
conductive chips
Prior art date
Application number
IT2130973A
Other languages
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US00247614A external-priority patent/US3851758A/en
Priority claimed from US247639A external-priority patent/US3915784A/en
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT981199B publication Critical patent/IT981199B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
IT2130973A 1972-04-26 1973-03-08 EQUIPMENT AND PROCEDURE FOR THE SEPARATION OF SEMI-CONDUCTIVE CHIPS IT981199B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24753072A 1972-04-26 1972-04-26
US00247614A US3851758A (en) 1972-04-26 1972-04-26 Semiconductor chip fixture
US247639A US3915784A (en) 1972-04-26 1972-04-26 Method of semiconductor chip separation

Publications (1)

Publication Number Publication Date
IT981199B true IT981199B (en) 1974-10-10

Family

ID=27400049

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2130973A IT981199B (en) 1972-04-26 1973-03-08 EQUIPMENT AND PROCEDURE FOR THE SEPARATION OF SEMI-CONDUCTIVE CHIPS

Country Status (5)

Country Link
CH (1) CH554076A (en)
DE (1) DE2317649C3 (en)
FR (1) FR2181842B1 (en)
IT (1) IT981199B (en)
NL (1) NL7304000A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
DE102005047509B4 (en) * 2005-10-04 2017-10-26 Degotec Gmbh Device for separating a planar object from a body to which the object is connected by means of adhesion

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632074A (en) * 1967-10-09 1972-01-04 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US3590462A (en) * 1968-11-18 1971-07-06 Western Electric Co Method and apparatus for expanding an array of articles

Also Published As

Publication number Publication date
FR2181842B1 (en) 1977-07-29
DE2317649B2 (en) 1975-04-03
DE2317649A1 (en) 1973-11-15
NL7304000A (en) 1973-10-30
DE2317649C3 (en) 1975-11-27
CH554076A (en) 1974-09-13
FR2181842A1 (en) 1973-12-07

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