IT966924B - Procedimento per l incisione chimi ca di superfici poliammidiche particolarmente in applicazione a circuiti stampat - Google Patents
Procedimento per l incisione chimi ca di superfici poliammidiche particolarmente in applicazione a circuiti stampatInfo
- Publication number
- IT966924B IT966924B IT6890672A IT6890672A IT966924B IT 966924 B IT966924 B IT 966924B IT 6890672 A IT6890672 A IT 6890672A IT 6890672 A IT6890672 A IT 6890672A IT 966924 B IT966924 B IT 966924B
- Authority
- IT
- Italy
- Prior art keywords
- application
- printed circuits
- surfaces particularly
- chemical engraving
- polyamide surfaces
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15279271A | 1971-06-14 | 1971-06-14 | |
| US25512472A | 1972-05-19 | 1972-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT966924B true IT966924B (it) | 1974-02-20 |
Family
ID=26849870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT6890672A IT966924B (it) | 1971-06-14 | 1972-06-13 | Procedimento per l incisione chimi ca di superfici poliammidiche particolarmente in applicazione a circuiti stampat |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5149442B1 (xx) |
| BE (1) | BE784790A (xx) |
| CH (1) | CH573956A5 (xx) |
| DE (1) | DE2227891C3 (xx) |
| FR (1) | FR2141865B1 (xx) |
| GB (1) | GB1379961A (xx) |
| IT (1) | IT966924B (xx) |
| NL (1) | NL149204B (xx) |
| SE (1) | SE396620B (xx) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130803A (ja) * | 1983-12-19 | 1985-07-12 | 松下電器産業株式会社 | 可変抵抗器 |
| DE3530617A1 (de) * | 1985-08-23 | 1987-02-26 | Schering Ag | Konditionierungsmittel fuer die behandlung von basismaterialien |
| DE19834721A1 (de) * | 1998-07-31 | 2000-04-13 | Siemens Ag | Lösung und Verfahren zum chemischen Entgraten und/oder strukturierten Ätzen von Kunststoffelementen, insbesondere Polyester-Kunststoffelementen |
| CN112203422A (zh) * | 2020-09-14 | 2021-01-08 | 珠海市晶昊电子科技有限公司 | 一种印制线路板覆盖膜的表面处理方法 |
-
1972
- 1972-06-06 SE SE741172A patent/SE396620B/xx unknown
- 1972-06-08 DE DE19722227891 patent/DE2227891C3/de not_active Expired
- 1972-06-13 FR FR7221210A patent/FR2141865B1/fr not_active Expired
- 1972-06-13 IT IT6890672A patent/IT966924B/it active
- 1972-06-13 NL NL7208055A patent/NL149204B/xx not_active IP Right Cessation
- 1972-06-13 BE BE784790A patent/BE784790A/xx not_active IP Right Cessation
- 1972-06-13 GB GB2755772A patent/GB1379961A/en not_active Expired
- 1972-06-14 JP JP5934172A patent/JPS5149442B1/ja active Pending
- 1972-06-14 CH CH885572A patent/CH573956A5/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CH573956A5 (xx) | 1976-03-31 |
| BE784790A (fr) | 1972-10-02 |
| FR2141865B1 (xx) | 1977-12-23 |
| NL7208055A (xx) | 1972-12-18 |
| SE396620B (sv) | 1977-09-26 |
| DE2227891B2 (de) | 1976-09-30 |
| GB1379961A (en) | 1975-01-08 |
| DE2227891C3 (de) | 1978-10-05 |
| JPS5149442B1 (xx) | 1976-12-27 |
| NL149204B (nl) | 1976-04-15 |
| DE2227891A1 (de) | 1973-01-04 |
| FR2141865A1 (xx) | 1973-01-26 |
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